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LNP™ THERMOCOMP™ Compound MX89510
- Chemical Family
- PolyolefinsPolypropylenes (PP)
LNP THERMOCOMP MX89510 compound is based on Polypropylene (PP) resin containing 10% glass fiber, 10% glass bead.
Product families
Applications
Applications
- Consumer Goods — Appliances & Electronics
- Consumer Goods — Sports & Recreation
Electrical & Electronics — Devices & Assemblies
- Consumer Electronics
- Displays
Printing & Packaging — Packaging
- Non-Food Consumer Packaging
Personal Care — Packaging & Accessories
- Applicators & Accessories
Electrical & Electronics — Parts & Components
- Connectors
- Housings & Enclosures
- Switches & Relays
Product Families
Plastics — Basic Thermoplastics
- Polyolefins
Other characteristics
- Brand
- LNP™ THERMOCOMP™ Compound
- Polymer Name
- Polypropylene (unspecified)
- Fillers Included
- Glass Bead, Glass Fiber
- Glass Bead
- Glass Fiber
- Additives Included
- Mold Release Agent
- Processing Methods
- Injection Molding
- Note
ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
- Markets
- Consumer Goods
- Electrical & Electronics
- Personal Care
- Printing & Packaging
- Technology
- Plastics
- Material Features
- Cost Effective
- Dimensional Stability
- Good Mold Release
- High Stiffness
- Low Warpage
- Country Availability
- Canada
- China (Mainland)
- Mexico
- USA
- Plastics and Elastomers End Uses
- Cell Phones
- Computer Components
- Consumer Applications
- Containers
- Displays
- Electrical Components
- Electrical Enclosure
- Electrical Internal Frame
- Plastics and Elastomers Functions
- Resin
- Plastics and Elastomers Processing Methods
- Injection Molding
Technical data
Table 1 of 5
14 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Stress (Yield, Type I, 5 mm/min) ¹¹ | 52 | MPa | ASTM D638 |
| Tensile Stress (Break, Type I, 5 mm/min) ¹¹ | 52 | MPa | ASTM D638 |
| Tensile Strain (Yield, Type I, 5 mm/min) ¹¹ | 3 | % | ASTM D638 |
| Tensile Strain (Break, Type I, 5 mm/min) ¹¹ | 3.4 | % | ASTM D638 |
| Tensile Modulus (at 50 mm/min) ¹¹ | 3820 | MPa | ASTM D638 |
| Flexural Stress (Yield, 1.3 mm/min, 50 mm span) ¹¹ | 80 | MPa | ASTM D790 |
| Flexural Modulus (at 1.3 mm/min, 50 mm span) ¹¹ | 2800 | MPa | ASTM D790 |
| Tensile Stress (Yield, 5 mm/min) ¹¹ | 50 | MPa | ISO 527 |
| Tensile Stress (Break, 5 mm/min) ¹¹ | 48 | MPa | ISO 527 |
| Tensile Strain (Yield, 5 mm/min) ¹¹ | 2.9 | % | ISO 527 |
| Tensile Strain (Break, 5 mm/min) ¹¹ | 3.4 | % | ISO 527 |
| Tensile Modulus (at 1 mm/min) ¹¹ | 3540 | MPa | ISO 527 |
Table 2 of 5
6 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Specific Gravity ¹¹ | 1.02 | — | ASTM D792 |
| Density ¹¹ | 1.01 | g/cm³ | ASTM D792 |
| Moisture Absorption (at 23°C, 50% RH, 24hrs) ¹¹ | 2.00E-02 | % | ASTM D570 |
| Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹ | 0.8 - 2 | % | ASTM D955 |
| Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹ | 0.9 - 3 | % | ASTM D955 |
| Moisture Absorption (at 23°C, 50% RH) ¹¹ | 0.02 | % | ISO 62 |
Table 3 of 5
6 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Heat Deflection Temperature (at 0.45 MPa, 3.2 mm, Unannealed) ¹¹ | 156 | °C | ASTM D648 |
| Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹ | 131 | °C | ASTM D648 |
| Coefficient of Thermal Expansion (at -30°C to 30°C, flow) ¹¹ | 0.000043 | 1/°C | ASTM D696 |
| Coefficient of Thermal Expansion (at -30°C to 30°C, xflow) ¹¹ | 0.00012 | 1/°C | ASTM D696 |
| Heat Deflection Temperature/Bf (at 0.45 Mpa, Flatw 80*10*4, sp=64mm) ¹¹ | 153 | °C | ISO 75/Bf |
| Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80*10*4, sp=64mm) ¹¹ | 119 | °C | ISO 75/Af |
Table 4 of 5
6 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Izod Impact (Unnotched, at 23°C) ¹¹ | 368 | J/m | ASTM D4812 |
| Izod Impact (Notched, at 23°C) ¹¹ | 21 | J/m | ASTM D256 |
| Multi-Axial Impact ¹¹ | 1 | J | ISO 6603 |
| Instrumented Dart Impact Total Energy (at 23°C) ¹¹ | 4 | J | ASTM D3763 |
| Izod Impact (Unnotched, 80*10*4, at 23°C) ¹¹ | 22 | kJ/m² | ISO 180/1U |
| Izod Impact (Notched, 80*10*4, at 23°C) ¹¹ | 2 | kJ/m² | ISO 180/1A |
Table 5 of 5
9 rows| Characteristic | Value | Unit |
|---|---|---|
| Drying Temperature ⁷ | 80 | °C |
| Drying Time ⁷ | 4 | Hrs |
| Melt Temperature ⁷ | 225 - 250 | °C |
| Front - Zone 3 Temperature ⁷ | 240 - 250 | °C |
| Middle - Zone 2 Temperature ⁷ | 215 - 225 | °C |
| Rear - Zone 1 Temperature ⁷ | 195 - 205 | °C |
| Mold Temperature ⁷ | 30 - 50 | °C |
| Back Pressure ⁷ | 0.2 - 0.3 | MPa |
| Screw Speed ⁷ | 30 - 60 | rpm |
