LNP™ THERMOCOMP™ Compound DX11354
- Chemical Family
- Polycarbonate (PC)
SABIC's Specialties Business LNP THERMOCOMP DX11354 compound is based on Polycarbonate (PC) resin containing proprietary fillers and available in black color only. Added features of this grade include: Improved Plating Surface and Mechanical Performance suitable for Laser Direct Structuring (LDS) applications, Improved Impact. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Interior
- Consumer Electronics
- Displays
- Non-Food Consumer Packaging
- Applicators & Accessories
- Connectors
- Housings & Enclosures
- Switches & Relays
Product Families
- Polycarbonates
Other characteristics
- Brand
- LNP™ THERMOCOMP™ Compound
- Polymer Name
- Polycarbonate (PC)
- Fillers Included
- Talc
- Additives Included
Heat Stabilizer, Metal Deactivator, Mold Release Agent, UV Stabilizer; Heat Stabilizer; Metal Deactivator; Mold Release Agent; UV Stabilizer
- Processing Methods
- Injection Molding, Laser Sintering (SLS)
- Note
ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ᵖ UL ratings shown on the technical datasheet might not cover the full range of thicknesses and colors. For details, please see the UL Yellow Card.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
- Markets
- Automotive & Transportation
- Consumer Goods
- Electrical & Electronics
- Personal Care
- Printing & Packaging
- Flame Rating
- UL 94 HB
- Technology
- Plastics
- Labeling Claims
- No Added PFAS
- Material Features
- Cost Effective
- Excellent Dielectric Properties
- Good Mold Release
- Heat Stabilized
- High Ductility
- High Impact Resistance
- No Added PFAS
- UV Stabilized
- Country Availability
- Canada
- China (Mainland)
- Mexico
- USA
- Certifications and Compliance
- UL 94
- Plastics and Elastomers End Uses
- Automotive Interior Parts
- Cell Phones
- Computer Components
- Consumer Applications
- Containers
- Displays
- Electrical Components
- Electrical Enclosure
- Plastics and Elastomers Functions
- Resin
- Plastics and Elastomers Processing Methods
- Injection Molding
- Laser Sintering (SLS)
Technical data
Table 1 of 7
8 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Stress (Yield, Type I, 50 mm/min) ¹¹ | 59 | MPa | ASTM D638 |
| Tensile Stress (Break, Type I, 50 mm/min) ¹¹ | 52 | MPa | ASTM D638 |
| Tensile Strain (Yield, Type I, 50 mm/min) ¹¹ | 5.7 | % | ASTM D638 |
| Tensile Strain (Break, Type I, 50 mm/min) ¹¹ | 64 | % | ASTM D638 |
| Tensile Modulus (at 50 mm/min) ¹¹ | 2560 | MPa | ASTM D638 |
| Flexural Stress (Yield, 1.3 mm/min, 50 mm span) ¹¹ | 91 | MPa | ASTM D790 |
| Flexural Stress (Break, 1.3 mm/min, 50 mm span) ¹¹ | 90 | MPa | ASTM D790 |
| Flexural Modulus (at 1.3 mm/min, 50 mm span) ¹¹ | 2300 | MPa | ASTM D790 |
Table 2 of 7
5 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Density ¹¹ | 1.27 | g/cm³ | ASTM D792 |
| Moisture Absorption (at 23°C, 50% RH, 24hrs) ¹¹ | 0.01 | % | ASTM D570 |
| Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹ | 0.6 - 0.65 | % | ASTM D955 |
| Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹ | 0.6 - 0.65 | % | ASTM D955 |
| Melt Flow Rate (at 300°C, 1.2 kgf) ¹¹ | 12 | g/10 min | ASTM D1238 |
Table 3 of 7
6 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹ | 124 | °C | ASTM D648 |
| Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹ | 0.000063 | 1/°C | ASTM E831 |
| Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹ | 0.000069 | 1/°C | ASTM E831 |
| Relative Temperature Index (Electrical) ᵖ ¹¹ | 80 | °C | UL 746B |
| Relative Temperature Index (Mechanical with impact) ᵖ ¹¹ | 80 | °C | UL 746B |
| Relative Temperature Index (Mechanical without impact) ᵖ ¹¹ | 80 | °C | UL 746B |
Table 4 of 7
2 rows| Characteristic | Value | Method |
|---|---|---|
| Relative Permittivity (1 GHz) ¹¹ | 2.92 | IEC 60250 |
| Dissipation Factor (at at 1 GHz) ¹¹ | 0.007 | IEC 60250 |
Table 5 of 7
1 row| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Izod Impact (Notched, at 23°C) ¹¹ | 750 | J/m | ASTM D256 |
Table 6 of 7
15 rows| Characteristic | Value | Unit |
|---|---|---|
| Drying Temperature ⁷ | 100 - 110 | °C |
| Drying Time ⁷ | 3 - 4 | Hrs |
| Drying Time (Cumulative) ⁷ | 8 | Hrs |
| Maximum Moisture Content ⁷ | 0.02 | % |
| Melt Temperature ⁷ | 275 - 300 | °C |
| Nozzle Temperature ⁷ | 275 - 300 | °C |
| Front - Zone 3 Temperature ⁷ | 260 - 300 | °C |
| Middle - Zone 2 Temperature ⁷ | 255 - 295 | °C |
| Rear - Zone 1 Temperature ⁷ | 250 - 290 | °C |
| Hopper Temperature ⁷ | 60 - 80 | °C |
| Mold Temperature ⁷ | 60 - 90 | °C |
| Back Pressure ⁷ | 0.3 - 0.7 | MPa |
Table 7 of 7
1 row| Characteristic | Value | Unit | Method |
|---|---|---|---|
| UL Recognized (94HB Flame Class Rating) ᵖ | min. 0.6 | mm | UL 94 |
