LNP™ THERMOCOMP™ Compound LX03447

Chemical Family: Polyether Ether Ketone (PEEK)

LNP THERMOCOMP LX03447 compound is based on Polyetheretherketone (PEEK) resin containing 35% carbon fiber. Added features of this grade include: Electrically Conductive.

Product families

Applications

Consumer Goods — Appliances & Electronics

Industrial — Chemical & Industrial Manufacturing

Equipment & Parts

Electrical & Electronics — Devices & Assemblies

Consumer Electronics
Displays
Industrial Automation

Electrical & Electronics — Parts & Components

Connectors
Housings & Enclosures
Semiconductor Manufacturing
Switches & Relays

Product Families

Plastics — Engineering & Specialty Polymers

High Performance Thermoplastics

Other characteristics

Brand: LNP™ THERMOCOMP™ Compound
Polymer Name: Polyetheretherketone (PEEK)
Fillers Included: Carbon Fiber
Flexural Modulus: 23800.0 - 23800.0 MPa
Processing Methods: Injection Molding
Note: ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
Markets: Consumer Goods
Electrical & Electronics
Industrial
Technology: Plastics
Material Features: Cost Effective
Electrically Conductive
High Stiffness
High Strength
High Temperature Resistance
Light Weight
Very Good Heat Resistance
Country Availability: Canada
China (Mainland)
Mexico
USA
Plastics and Elastomers End Uses: Appliances
Cell Phones
Commercial Appliance
Computer Components
Consumer Applications
Displays
Electrical Components
Electrical Enclosure
Plastics and Elastomers Functions: Resin
Plastics and Elastomers Processing Methods: Injection Molding

Technical data

Table 1 of 5

11 rows

Characteristic	Value	Unit	Method
Tensile Stress (Break, Type I, 5 mm/min) ¹¹	248	MPa	ASTM D638
Tensile Strain (Break, Type I, 5 mm/min) ¹¹	1.6	%	ASTM D638
Tensile Modulus (at 50 mm/min) ¹¹	28540	MPa	ASTM D638
Flexural Stress (Yield, 1.3 mm/min, 50 mm span) ¹¹	370	MPa	ASTM D790
Flexural Stress (Break, 1.3 mm/min, 50 mm span) ¹¹	365	MPa	ASTM D790
Flexural Modulus (at 1.3 mm/min, 50 mm span) ¹¹	23700	MPa	ASTM D790
Tensile Stress (Break, 5 mm/min) ¹¹	246	MPa	ISO 527
Tensile Strain (Break, 5 mm/min) ¹¹	1.5	%	ISO 527
Tensile Modulus (at 1 mm/min) ¹¹	28350	MPa	ISO 527
Flexural Stress ¹¹	360	MPa	ISO 178
Flexural Modulus (at 2 mm/min) ¹¹	23800	MPa	ISO 178

Table 2 of 5

5 rows

Characteristic	Value	Unit	Method
Density ¹¹	1.43	g/cm³	ASTM D792
Moisture Absorption (at 23°C, 50% RH, 24hrs) ¹¹	0.05	%	ASTM D570
Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹	0.1 - 0.3	%	ASTM D955
Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹	0.5 - 0.9	%	ASTM D955
Moisture Absorption (at 23°C, 50% RH) ¹¹	0.07	%	ISO 62

Table 3 of 5

6 rows

Characteristic	Value	Unit	Method
Heat Deflection Temperature (at 0.45 MPa, 3.2 mm, Unannealed) ¹¹	337	°C	ASTM D648
Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹	325	°C	ASTM D648
Coefficient of Thermal Expansion (at -30°C to 30°C, flow) ¹¹	0.000009	1/°C	ASTM D696
Coefficient of Thermal Expansion (at -30°C to 30°C, xflow) ¹¹	0.000039	1/°C	ASTM D696
Heat Deflection Temperature/Bf (at 0.45 Mpa, Flatw 80104, sp=64mm) ¹¹	335	°C	ISO 75/Bf
Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80104, sp=64mm) ¹¹	318	°C	ISO 75/Af

Table 4 of 5