LNP™ THERMOCOMP™ Compound LF006EX1
- Chemical Family
- Polyether Ether Ketone (PEEK)
SABIC's Specialties Business LNP THERMOCOMP LF006EX1 compound is based on Polyetheretherketone (PEEK) resin containing 30% glass fiber. Added features of this grade include: Low warpage, Easy Molding. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Consumer Electronics
- Displays
- Industrial Automation
- Connectors
- Housings & Enclosures
- Semiconductor Manufacturing
- Switches & Relays
Product Families
- High Performance Thermoplastics
Other characteristics
- Brand
- LNP™ THERMOCOMP™ Compound
- Polymer Name
- Polyetheretherketone (PEEK)
- Fillers Included
- Glass Fiber
- Flexural Modulus
- 10200.0 - 10200.0 MPa
- Processing Methods
- Injection Molding
- Note
ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
- Markets
- Consumer Goods
- Electrical & Electronics
- Technology
- Plastics
- Labeling Claims
- No Added PFAS
- Material Features
- Cost Effective
- Easy To Mold
- Good Moldability
- Good Processability
- High Modulus
- High Stiffness
- High Temperature Resistance
- Low Warpage
- Country Availability
- Canada
- China (Mainland)
- Mexico
- USA
- Potential Applications
PEEK based LNP THERMOCOMP compound may be qualified to use in industrial, oil & gas applications for combination of high heat, chemical resistance and mechanical performance.
- Plastics and Elastomers End Uses
- Appliances
- Cell Phones
- Commercial Appliance
- Computer Components
- Displays
- Electrical Components
- Electrical Enclosure
- Electrical Internal Frame
- Plastics and Elastomers Functions
- Resin
- Plastics and Elastomers Processing Methods
- Injection Molding
Technical data
Table 1 of 6
10 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Stress (Break, Type I, 5 mm/min) ¹¹ | 170 | MPa | ASTM D638 |
| Tensile Strain (Break, Type I, 5 mm/min) ¹¹ | 2.3 | % | ASTM D638 |
| Tensile Modulus (at 5 mm/min) ¹¹ | 12300 | MPa | ASTM D638 |
| Flexural Strength (at 1.3 mm/min, 50 mm span) ¹¹ | 235 | MPa | ASTM D790 |
| Flexural Modulus (at 1.3 mm/min, 50 mm span) ¹¹ | 10100 | MPa | ASTM D790 |
| Tensile Stress (Break, 5 mm/min) ¹¹ | 170 | MPa | ISO 527 |
| Tensile Strain (Break, 5 mm/min) ¹¹ | 2.2 | % | ISO 527 |
| Tensile Modulus (at 1 mm/min) ¹¹ | 11800 | MPa | ISO 527 |
| Flexural Strength (at 2 mm/min) ¹¹ | 225 | MPa | ISO 178 |
| Flexural Modulus (at 2 mm/min) ¹¹ | 10200 | MPa | ISO 178 |
Table 2 of 6
6 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Moisture Absorption (at 23°C, 50% RH, 24hrs) ¹¹ | 0.037 | % | ASTM D570 |
| Specific Gravity ¹¹ | 1.536 | — | ASTM D792 |
| Mold Shrinkage (flow) ᵍ ¹¹ | 0.43 | % | SABIC method |
| Mold Shrinkage (xflow) ᵍ ¹¹ | 0.65 | % | SABIC method |
| Moisture Absorption (at 23°C, 50% RH, Equilibrium) ¹¹ | 0.088 | % | ISO 62-4 |
| Density ¹¹ | 1.532 | g/cm³ | ASTM D792 |
Table 3 of 6
6 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Heat Deflection Temperature (at 0.45 MPa, 3.2 mm, Unannealed) ¹¹ | 336 | °C | ASTM D648 |
| Heat Deflection Temperature (at 1.82 MPa, 3.2 mm, Unannealed) ¹¹ | 321 | °C | ASTM D648 |
| Coefficient of Thermal Expansion (at -40°C to 120°C, flow) ¹¹ | 0.0000223 | 1/°C | ASTM E831 |
| Coefficient of Thermal Expansion (at -40°C to 120°C, xflow) ¹¹ | 0.000041 | 1/°C | ASTM E831 |
| Heat Deflection Temperature/Bf (at 0.45 Mpa, Flatw 80*10*4, sp=64mm) ¹¹ | 333 | °C | ISO 75/Bf |
| Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80*10*4, sp=64mm) ¹¹ | 309 | °C | ISO 75/Af |
Table 4 of 6
4 rows| Characteristic | Value | Method |
|---|---|---|
| Dielectric Constant (at 1.1 GHz) ¹¹ | 3.82 | SABIC method |
| Dielectric Constant (at 1.9 GHz) ¹¹ | 3.84 | SABIC method |
| Dissipation Factor (at 1.1 GHz) ¹¹ | 0.0039 | SABIC method |
| Dissipation Factor (at 1.9 GHz) ¹¹ | 0.0041 | SABIC method |
Table 5 of 6
6 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Izod Impact (Unnotched, at 23°C) ¹¹ | 732 | J/m | ASTM D4812 |
| Izod Impact (Notched, at 23°C) ¹¹ | 95 | J/m | ASTM D256 |
| Izod Impact (Unnotched, 80*10*4, at 23°C) ¹¹ | 47 | kJ/m² | ISO 180/1U |
| Izod Impact (Notched, 80*10*4, at 23°C) ¹¹ | 10 | kJ/m² | ISO 180/1A |
| Charpy Impact (at 23°C, Unnotch Edgew 80*10*3 sp=62mm) ¹¹ | 46 | kJ/m² | ISO 179/1eU |
| Charpy Impact (at 23°C, V-notch Edgew 80*10*3 sp=62mm) ¹¹ | 10 | kJ/m² | ISO 179/1eA |
Table 6 of 6
8 rows| Characteristic | Value | Unit |
|---|---|---|
| Drying Temperature ⁷ | 150 | °C |
| Drying Time ⁷ | 4 - 6 | Hrs |
| Front - Zone 3 Temperature ⁷ | 380 - 400 | °C |
| Middle - Zone 2 Temperature ⁷ | 380 - 400 | °C |
| Rear - Zone 1 Temperature ⁷ | 370 - 380 | °C |
| Mold Temperature ⁷ | 175 - 190 | °C |
| Back Pressure ⁷ | 0.3 - 0.7 | MPa |
| Screw Speed ⁷ | 60 - 100 | rpm |
