LNP™ THERMOCOMP™ Compound KZ002

Name: LNP™ THERMOCOMP™ Compound KZ002
Brand: LNP™ THERMOCOMP™ Compound

LNP THERMOCOMP KZ002 compound is based on POM (Acetal) copolymer resin containing 10% milled glass.

Product families

Applications

Consumer Goods — Appliances & Electronics
Consumer Goods — Lawn & Garden

Building & Construction — Decorative Materials & Finishes

Artificial Turf

Electrical & Electronics — Devices & Assemblies

Consumer Electronics
Displays

Printing & Packaging — Packaging

Non-Food Consumer Packaging

Personal Care — Packaging & Accessories

Applicators & Accessories

Electrical & Electronics — Parts & Components

Connectors
Housings & Enclosures
Switches & Relays

Product Families

Plastics — Engineering & Specialty Polymers

Polyacetals

Other characteristics

Brand: LNP™ THERMOCOMP™ Compound
Polymer Name: Polyacetal Copolymer (POM)
Fillers Included: Glass Fiber, Milled Glass Fiber
Glass Fiber
Milled Glass Fiber
Flexural Modulus: 2950.0 - 2950.0 MPa
Processing Methods: Injection Molding
Note: ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
Markets: Building & Construction
Consumer Goods
Electrical & Electronics
Personal Care
Printing & Packaging
Technology: Plastics
Material Features: Cost Effective
High Stiffness
Low Warpage
Country Availability: Canada
China (Mainland)
Mexico
USA
Plastics and Elastomers End Uses: Building Materials
Cell Phones
Computer Components
Consumer Applications
Containers
Displays
Doors
Electrical Components
Plastics and Elastomers Functions: Resin
Plastics and Elastomers Processing Methods: Injection Molding

Technical data

Table 1 of 5

13 rows

Characteristic	Value	Unit	Method
Tensile Stress (Yield, Type I, 5 mm/min) ¹¹	55	MPa	ASTM D638
Tensile Stress (Break, Type I, 5 mm/min) ¹¹	53	MPa	ASTM D638
Tensile Strain (Yield, Type I, 5 mm/min) ¹¹	9.6	%	ASTM D638
Tensile Strain (Break, Type I, 5 mm/min) ¹¹	18.6	%	ASTM D638
Tensile Modulus (at 5 mm/min) ¹¹	3630	MPa	ASTM D638
Flexural Modulus (at 1.3 mm/min, 50 mm span) ¹¹	2770	MPa	ASTM D790
Tensile Stress (Yield, 5 mm/min) ¹¹	55	MPa	ISO 527
Tensile Stress (Break, 5 mm/min) ¹¹	54	MPa	ISO 527
Tensile Strain (Yield, 5 mm/min) ¹¹	10.1	%	ISO 527
Tensile Strain (Break, 5 mm/min) ¹¹	21.3	%	ISO 527
Tensile Modulus (at 1 mm/min) ¹¹	3410	MPa	ISO 527
Flexural Stress ¹¹	74	MPa	ISO 178

Table 2 of 5

6 rows

Characteristic	Value	Unit	Method
Density ¹¹	1.49	g/cm³	ISO 1183
Density ¹¹	1.49	g/cm³	ASTM D792
Moisture Absorption (at 23°C, 50% RH, 24hrs) ¹¹	0.18	%	ASTM D570
Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹	2 - 4	%	ASTM D955
Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹	2 - 4	%	ASTM D955
Moisture Absorption (at 23°C, 50% RH) ¹¹	0.26	%	ISO 62

Table 3 of 5

4 rows

Characteristic	Value	Unit	Method
Heat Deflection Temperature (at 0.45 MPa, 3.2 mm, Unannealed) ¹¹	153	°C	ASTM D648
Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹	101	°C	ASTM D648
Coefficient of Thermal Expansion (at -30°C to 30°C, flow) ¹¹	0.00011	1/°C	ASTM D696
Coefficient of Thermal Expansion (at -30°C to 30°C, xflow) ¹¹	0.00011	1/°C	ASTM D696

Table 4 of 5