LNP™ THERMOCOMP™ Compound DX06411
- Chemical Family
- Polycarbonate (PC)
SABIC's Specialties Business LNP THERMOCOMP DX06411 compound is based on Polycarbonate (PC) resin containing 20% glass fiber. Added features of this grade include: Easy Molding, Mold Release. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Consumer Goods — Lawn & Garden
- Artificial Turf
- Consumer Electronics
- Displays
- Non-Food Consumer Packaging
- Applicators & Accessories
- Connectors
- Housings & Enclosures
- Switches & Relays
Product Families
- Polycarbonates
Other characteristics
- Brand
- LNP™ THERMOCOMP™ Compound
- Polymer Name
- Polycarbonate (PC)
- Fillers Included
- Glass Fiber
- Flexural Modulus
- 5650.0 - 5650.0 MPa
- Additives Included
- Mold Release Agent
- Processing Methods
- Injection Molding
- Note
⁷ Параметры литья под давлением упоминаются только в качестве общих рекомендаций. Они могут не применяться или требовать корректировки в конкретных ситуациях, таких как малые объемы впрыска, литье крупногабаритных деталей, литье тонкостенных деталей и газовое литье.. ¹¹ Информация, указанная в технических паспортах, должна использоваться только в качестве ориентировочной для целей выбора материала и не должна использоваться в качестве спецификации или для проектирования деталей или пресс-форм.
- Markets
- Building & Construction
- Consumer Goods
- Electrical & Electronics
- Personal Care
- Printing & Packaging
- Technology
- Plastics
- Labeling Claims
- No Added PFAS
- Material Features
- Cost Effective
- Easy To Mold
- Good Mold Release
- Good Moldability
- Good Processability
- High Modulus
- High Stiffness
- No Added PFAS
- Country Availability
- Canada
- China (Mainland)
- Mexico
- USA
- Plastics and Elastomers End Uses
- Building Materials
- Cell Phones
- Computer Components
- Consumer Applications
- Containers
- Displays
- Doors
- Electrical Components
- Plastics and Elastomers Functions
- Resin
- Plastics and Elastomers Processing Methods
- Injection Molding
Technical data
Table 1 of 5
5 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Stress (Break) ¹¹ | 82 | MPa | ASTM D638 |
| Tensile Strain (Break) ¹¹ | 4.2 | % | ASTM D638 |
| Tensile Modulus (at 50 mm/min) ¹¹ | 5740 | MPa | ASTM D638 |
| Flexural Stress ¹¹ | 144 | MPa | ASTM D790 |
| Flexural Modulus ¹¹ | 5650 | MPa | ASTM D790 |
Table 2 of 5
1 row| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Density ¹¹ | 1.4 | g/cm³ | ASTM D792 |
Table 3 of 5
1 row| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹ | 137 | °C | ASTM D648 |
Table 4 of 5
2 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Izod Impact (Unnotched, at 23°C) ¹¹ | 747 | J/m | ASTM D4812 |
| Izod Impact (Notched, at 23°C) ¹¹ | 64 | J/m | ASTM D256 |
Table 5 of 5
10 rows| Characteristic | Value | Unit |
|---|---|---|
| Drying Temperature ⁷ | 120 | °C |
| Drying Time ⁷ | 4 | Hrs |
| Maximum Moisture Content ⁷ | 0.02 | % |
| Melt Temperature ⁷ | 305 - 325 | °C |
| Front - Zone 3 Temperature ⁷ | 320 - 330 | °C |
| Middle - Zone 2 Temperature ⁷ | 310 - 320 | °C |
| Rear - Zone 1 Temperature ⁷ | 295 - 305 | °C |
| Mold Temperature ⁷ | 80 - 110 | °C |
| Back Pressure ⁷ | 0.2 - 0.3 | MPa |
| Screw Speed ⁷ | 30 - 60 | rpm |
