LNP™ THERMOCOMP™ Compound ZX08005

Name: LNP™ THERMOCOMP™ Compound ZX08005
Brand: LNP™ THERMOCOMP™ Compound

LNP THERMOCOMP ZX08005 compound is based on Polyphenylene Ether / Polystyrene (PPE/PS) blend containing unreinforced. Added features of this grade include: Improved Dielectric Properties.

Product families

Applications

Consumer Goods — Appliances & Electronics

Automotive & Transportation — Automotive

Interior

Electrical & Electronics — Devices & Assemblies

Consumer Electronics
Displays

Printing & Packaging — Packaging

Non-Food Consumer Packaging

Personal Care — Packaging & Accessories

Applicators & Accessories

Electrical & Electronics — Parts & Components

Connectors
Housings & Enclosures
Switches & Relays

Product Families

Plastics — Engineering & Specialty Polymers

Blends & Alloys

Other characteristics

Brand: LNP™ THERMOCOMP™ Compound
Density: 2070.0 - 2070.0 kg/m³
Polymer Name: PPO/PS Alloy
Flexural Modulus: 4600.0 - 4600.0 MPa
Processing Methods: Injection Molding
Note: ⁷ Параметры литья под давлением упоминаются только в качестве общих рекомендаций. Они могут не применяться или требовать корректировки в конкретных ситуациях, таких как малые объемы впрыска, литье крупногабаритных деталей, литье тонкостенных деталей и газовое литье.. ¹¹ Информация, указанная в технических паспортах, должна использоваться только для целей выбора материала и не должна использоваться в качестве спецификации или для проектирования деталей или пресс-форм.
Markets: Automotive & Transportation
Consumer Goods
Electrical & Electronics
Personal Care
Printing & Packaging
Technology: Plastics
Fillers Included: Mineral
Material Features: Cost Effective
Electrically Conductive
Excellent Dielectric Properties
Unreinforced
Country Availability: Canada
China (Mainland)
Mexico
USA
Plastics and Elastomers End Uses: Automotive Applications
Automotive Interior Parts
Cell Phones
Computer Components
Consumer Applications
Containers
Displays
Electrical Components
Plastics and Elastomers Functions: Resin
Plastics and Elastomers Processing Methods: Injection Molding
Compounds for Dielectric Solutions: LNP™ THERMOCOMP compounds portfolio contains thermoplastic injection molding materials that offer low Dissipation Factor (Df ) for improved signal gain and longer reading distance paired with tailor made Dielectric Constants (Dk ) to fine tune or detour a signal direction supporting innovative antenna designs. Beyond that, THERMOCOMP compounds allow further antenna miniaturization and the design of phase shifters with higher productivity through combined high Dk and low Df material properties.; Materials for individual antenna design to fine tune or detour signal direction.; Improved signal gain and longer reading distance through less signal attenuation.; Miniaturized antenna solutions with sufficient signal strength for 5G technology.; Improved mechanical performance versus Epoxy or Ceramics in more complex designs for less maintenance through longer lifetime.; Tailored Dielectric Constant Dk by customized compound formulations.; Very low Dissipation Factor Df for lower signal absorption, less signal scattering.; Combined high Dk and low Df with very high signal transmission density.; Sufficient flowability for thin wall design, improved ductility, dimensional and dielectric stability versus current solution.

Technical data

Table 1 of 6

5 rows

Characteristic	Value	Unit	Method
Tensile Stress (Yield, 5 mm/min) ¹¹	55	MPa	ISO 527
Tensile Strain (Break, 5 mm/min) ¹¹	4.4	%	ISO 527
Tensile Modulus (at 1 mm/min) ¹¹	3400	MPa	ISO 527
Flexural Stress (Yield, at 2 mm/min) ¹¹	105	MPa	ISO 178
Flexural Modulus (at 2 mm/min) ¹¹	4600	MPa	ISO 178

Table 2 of 6

1 row

Characteristic	Value	Unit	Method
Density ¹¹	2.07	g/cm³	ISO 1183

Table 3 of 6

2 rows

Characteristic	Value	Unit	Method
Heat Deflection Temperature (at 0.45 MPa, 3.2 mm, Unannealed) ¹¹	140	°C	ASTM D648
Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹	130	°C	ASTM D648

Table 4 of 6

6 rows

Characteristic	Value	Method
Relative Permittivity (100 MHz) ¹¹	6.58	IEC 60250
Relative Permittivity (500 MHz) ¹¹	6.47	IEC 60250
Relative Permittivity (1 GHz) ¹¹	6.16	IEC 60250
Dissipation Factor (at 500 MHz) ¹¹	0.001	IEC 60250
Dissipation Factor (at at 1 GHz) ¹¹	0.001	IEC 60250
Dissipation Factor (at 100 MHz) ¹¹	0.001	IEC 60250

Table 5 of 6