LNP™ THERMOCOMP™ Compound 2X04505

Chemical Family: FluoropolymersPolyolefins

LNP THERMOCOMP 2X04505 compound is based on Ethylene Tetrafluoroethylene (ETFE) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.

Product families

Applications

Industrial — Chemical & Industrial Manufacturing

Equipment & Parts

Electrical & Electronics — Devices & Assemblies

Industrial Automation

Electrical & Electronics — Parts & Components

Housings & Enclosures
Semiconductor Manufacturing

Industrial — Power, Water & Utilities

Renewable Energy

Product Families

Plastics — Engineering & Specialty Polymers

High Performance Thermoplastics

Other characteristics

Brand: LNP™ THERMOCOMP™ Compound
Polymer Name: Ethylene Tetrafluoroethylene Copolymer (ETFE)
Fillers Included: Carbon Fiber
Flexural Modulus: 18800.0 - 18800.0 MPa
Processing Methods: Injection Molding
Note: ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
Markets: Electrical & Electronics
Industrial
Technology: Plastics
Material Features: Cost Effective
Electrically Conductive
High Stiffness
High Strength
Light Weight
Country Availability: Canada
China (Mainland)
Mexico
USA
Plastics and Elastomers End Uses: Electrical Enclosure
Electrical Internal Frame
Electrical/Electronic Applications
Energy Management
Industrial Applications
Internal Armature
Semiconductor Applications
Plastics and Elastomers Functions: Resin
Plastics and Elastomers Processing Methods: Injection Molding

Technical data

Table 1 of 5

6 rows

Characteristic	Value	Unit	Method
Density ¹¹	1.74	g/cm³	ISO 1183
Density ¹¹	1.75	g/cm³	ASTM D792
Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹	1.1	%	ISO 294
Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹	1 - 1.2	%	ASTM D955
Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹	1.9	%	ISO 294
Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹	1.8 - 2	%	ASTM D955

Table 2 of 5

13 rows

Characteristic	Value	Unit	Method
Tensile Stress (Yield) ¹¹	89	MPa	ISO 527
Tensile Stress (Break) ¹¹	88	MPa	ISO 527
Tensile Strain (Yield) ¹¹	4.6	%	ISO 527
Tensile Strain (Break) ¹¹	4.9	%	ISO 527
Tensile Modulus (at 1 mm/min) ¹¹	11580	MPa	ISO 527
Flexural Stress ¹¹	319	MPa	ISO 178
Flexural Modulus ¹¹	18800	MPa	ISO 178
Tensile Stress (Yield, Type I, 5 mm/min) ¹¹	87	MPa	ASTM D638
Tensile Stress (Break, Type I, 5 mm/min) ¹¹	85	MPa	ASTM D638
Tensile Strain (Yield, Type I, 5 mm/min) ¹¹	4.5	%	ASTM D638
Tensile Strain (Break, Type I, 5 mm/min) ¹¹	4.8	%	ASTM D638
Tensile Modulus (at 50 mm/min) ¹¹	15160	MPa	ASTM D638

Table 3 of 5

8 rows

Characteristic	Value	Unit	Method
Heat Deflection Temperature/Bf (at 0.45 Mpa, Flatw 80104, sp=64mm) ¹¹	251	°C	ISO 75/Bf
Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80104, sp=64mm) ¹¹	207	°C	ISO 75/Af
Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹	0.0000126	1/°C	ASTM E831
Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹	0.000012	1/°C	ISO 11359-2
Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹	0.000078	1/°C	ISO 11359-2
Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹	0.0000774	1/°C	ASTM E831
Heat Deflection Temperature (at 0.45 MPa, 3.2 mm, Unannealed) ¹¹	255	°C	ASTM D648
Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹	222	°C	ASTM D648

Table 4 of 5