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LNP™ THERMOCOMP™ Compound RF007SXQ

Chemical Family
Polyamides

LNP THERMOCOMP RF007SXQ compound is based on Nylon 6/6 resin containing 35% glass fiber. Added features of this grade include: Heat Stabilized, Hydrolysis Resistant.

Product families

Applications

Applications
  • Consumer Goods — Appliances & Electronics
  • Consumer Goods — Lawn & Garden
  • Consumer Goods — Sports & Recreation
Building & Construction — Decorative Materials & Finishes
  • Artificial Turf
Electrical & Electronics — Devices & Assemblies
  • Consumer Electronics
  • Displays
Printing & Packaging — Packaging
  • Non-Food Consumer Packaging
Personal Care — Packaging & Accessories
  • Applicators & Accessories
Electrical & Electronics — Parts & Components
  • Connectors
  • Housings & Enclosures
  • Switches & Relays

Product Families

Plastics — Engineering & Specialty Polymers
  • Polyamides

Other characteristics

Brand
LNP™ THERMOCOMP™ Compound
Polymer Name
Polyamide 66 (PA 66)
Fillers Included
Glass Fiber
Flexural Modulus
10680.0 - 10680.0 MPa
Additives Included
  • Heat Stabilizer, Mold Release Agent
  • Heat Stabilizer
  • Mold Release Agent
Processing Methods
Injection Molding
Note

ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.

Markets
  • Building & Construction
  • Consumer Goods
  • Electrical & Electronics
  • Personal Care
  • Printing & Packaging
Technology
Plastics
Material Features
  • Cost Effective
  • Good Mold Release
  • Heat Stabilized
  • High Hydrolytic Stability
  • High Modulus
  • High Stiffness
Country Availability
  • Canada
  • Mexico
  • USA
Plastics and Elastomers End Uses
  • Appliances
  • Building Materials
  • Cell Phones
  • Commercial Appliance
  • Computer Components
  • Consumer Applications
  • Containers
  • Displays
Plastics and Elastomers Functions
Resin
Plastics and Elastomers Processing Methods
Injection Molding

Technical data

Table 1 of 7

10 rows
CharacteristicValueUnitMethod
Tensile Stress (Break, 5 mm/min) ¹¹200MPaISO 527
Tensile Stress (Break) ¹¹195MPaASTM D638
Tensile Strain (Break, 5 mm/min) ¹¹3.3%ISO 527
Tensile Strain (Break) ¹¹2.9%ASTM D638
Flexural Stress ¹¹297MPaASTM D790
Tensile Modulus (at 1 mm/min) ¹¹10500MPaISO 527
Flexural Modulus ¹¹10680MPaASTM D790
Flexural Stress (Break, 2 mm/min) ¹¹290MPaISO 178
Flexural Modulus (at 2 mm/min) ¹¹10000MPaISO 178
Hardness (Rockwell L) ¹¹115—ISO 2039-2

Table 2 of 7

7 rows
CharacteristicValueUnitMethod
Density ¹¹1.42g/cm³ASTM D792
Density ¹¹1.41g/cm³ISO 1183
Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹0.4%ASTM D955
Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹1.4%ASTM D955
Mold Shrinkage (on Tensile Bar, flow) ᵍ ¹¹0.15 - 0.3%SABIC method
Water Absorption (at 23°C, saturated) ¹¹4.5%ISO 62-1
Moisture Absorption (at 23°C, 50% RH) ¹¹1.10E+00%ISO 62

Table 3 of 7

9 rows
CharacteristicValueUnitMethod
Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹250°CASTM D648
Thermal Conductivity ¹¹0.33W/m-°CISO 8302
Coefficient of Thermal Expansion (at 23°C to 60°C, flow) ¹¹0.000021/°CISO 11359-2
Coefficient of Thermal Expansion (at 23°C to 60°C, xflow) ¹¹0.000081/°CISO 11359-2
Ball Pressure Test (at 123°C to 127°C) ¹¹Pass—IEC 60695-10-2
Vicat Softening Temperature (Rate B/50) ¹¹256°CISO 306
Vicat Softening Temperature (Rate B/120) ¹¹255°CISO 306
Heat Deflection Temperature/Be (at 0.45MPa, Edgew 120*10*4, sp=100mm) ¹¹260°CISO 75/Be
Heat Deflection Temperature/Ae (at 1.8 Mpa, Edgew 120*10*4, sp=100mm) ¹¹258°CISO 75/Ae

Table 4 of 7

9 rows
CharacteristicValueUnitMethod
Volume Resistivity ¹¹min. 1.E+16Ω.cmIEC 60093
Surface Resistivity (ROA) ¹¹min. 1.E+16ΩIEC 60093
Dielectric Strength (in oil, at 3.2mm) ¹¹19kV/mmIEC 60243-1
Relative Permittivity (1 MHz) ¹¹3.2—IEC 60250
Dissipation Factor (at 50/60 Hz) ¹¹0.0068—IEC 60250
Dissipation Factor (at at 1 MHz) ¹¹0.015—IEC 60250
Comparative Tracking Index ¹¹500VIEC 60112
Comparative Tracking Index (M) ¹¹375VIEC 60112
Relative Permittivity (50/60 Hz) ¹¹3.4—IEC 60250

Table 5 of 7

10 rows
CharacteristicValueUnitMethod
Izod Impact (Unnotched, at 23°C) ¹¹1228J/mASTM D4812
Izod Impact (Notched, at 23°C) ¹¹106J/mASTM D256
Izod Impact (Notched, 80*10*4, at 23°C) ¹¹12kJ/m²ISO 180/1A
Izod Impact (Notched, 80*10*4, at -20°C) ¹¹11kJ/m²ISO 180/1A
Izod Impact (Notched, 80*10*4, at -30°C) ¹¹10kJ/m²ISO 180/1A
Izod Impact (Notched, 80*10*4, at -40°C) ¹¹9kJ/m²ISO 180/1A
Charpy Impact (at 23°C, V-notch Edgew 80*10*4 sp=62mm) ¹¹10kJ/m²ISO 179/1eA
Charpy Impact (at -30°C, V-notch Edgew 80*10*4 sp=62mm) ¹¹9kJ/m²ISO 179/1eA
Charpy Impact (at 23°C, Unnotch Edgew 80*10*4 sp=62mm) ¹¹85kJ/m²ISO 179/1eU
Charpy Impact (at -30°C, Unnotch Edgew 80*10*4 sp=62mm) ¹¹65kJ/m²ISO 179/1eU

Table 6 of 7

20 rows
CharacteristicValueUnit
Drying Temperature ⁷80°C
Drying Temperature ⁷75 - 85°C
Drying Time ⁷4Hrs
Drying Time ⁷4 - 6Hrs
Maximum Moisture Content ⁷0.15 - 0.25%
Maximum Moisture Content ⁷0.2%
Melt Temperature ⁷260 - 290°C
Melt Temperature ⁷280 - 305°C
Front - Zone 3 Temperature ⁷295 - 305°C
Front - Zone 3 Temperature ⁷260 - 280°C
Nozzle Temperature ⁷250 - 270°C
Middle - Zone 2 Temperature ⁷260 - 280°C

Table 7 of 7

4 rows
CharacteristicValueUnitMethod
Glow Wire Flammability Index (passes at 650°C)2mmIEC 60695-2-12
Oxygen Index (LOI)26%ISO 4589
FMVSS Burning Speed (Thickness 2 mm)6mm/minFMVSS 302
FMVSS Burning Speed (Thickness 3 mm)2mm/minFMVSS 302

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