LNP™ STAT-LOY™ Compound 63000CTC

Name: LNP™ STAT-LOY™ Compound 63000CTC
Brand: LNP™ STAT-LOY™ Compound

SABIC's Specialties Business LNP STAT-LOY 63000CTC compound is based on Polycarbonate / Polyester alloy containing proprietary additives suitable for advanced semiconductor packaging applications. Added features of this grade include: LNP Clean Compounding Technology, Permanently Anti-Static, Translucent. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

Product families

Applications

Consumer Goods — Appliances & Electronics

Electrical & Electronics — Devices & Assemblies

Consumer Electronics
Displays
Industrial Automation

Electrical & Electronics — Parts & Components

Connectors
Semiconductor Manufacturing
Switches & Relays

Product Families

Plastics — Engineering & Specialty Polymers

Blends & Alloys

Other characteristics

Brand: LNP™ STAT-LOY™ Compound
Density: 1160.0 - 1160.0 kg/m³
Polymer Name: PC/Polyester Alloy
Flexural Modulus: 1150.0 - 1150.0 MPa
Processing Methods: Injection Molding
Note: ᵈ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding. Do NOT mix NORYL GTX* resin with other grades of NORYL* resins. Polystyrene and acrylic regrind are effective purging Materials. Use temperature range appropriate for particular purging resin. Regrind must also be dried. Maximum 25% regrind. Dry at recommended temperatures and times for optimum performance. Overdrying can cause loss of physical properties and/or create appearance defects. Do not exceed recommended basic drying time and temperature above or:\n4-8 hrs at 95°C (200°F), 10 hrs max\n6-12 hrs at 80°C (175°F), 16 hrs max\n8-16 hrs at 65°C (150°F), 24 hrs max\nAVOID air circulating tray ovens. Moisture levels in heated ambient air can exceed moisture level in the resin itself, causing moisture ABSORPTION not drying. Avoid melt temperature in excess of 300°C (575°F) and residence times over 6-8 minutes (may affect properties and/or appearance). Nozzle temperature controls assist in elimination of drool premature freeze-off. Shot sizes in excess of 50% barrel capacity can lead to difficulties in providing a consistent, homogenous plastic melt.; ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
Color: Translucent
Transparent
Markets: Consumer Goods
Electrical & Electronics
Technology: Plastics
Labeling Claims: No Added PFAS
Additives Included: Anti-Static Agent
Mold Release Agent
Proprietary
Material Features: Anti-Static
Good Mold Release
Low Liquid Particle Count
Low Outgassing
No Added PFAS
Translucent
Unreinforced
Country Availability: Canada
China (Mainland)
Mexico
USA
Plastics and Elastomers End Uses: Cell Phones
Computer Components
Displays
Electrical Components
Electrical/Electronic Applications
Semiconductor Applications
Tablets
Plastics and Elastomers Functions: Resin
Plastics and Elastomers Processing Methods: Injection Molding

Technical data

Table 1 of 7

9 rows

Characteristic	Value	Unit	Method
Tensile Stress (Yield, Type I, 5 mm/min) ¹¹	35	MPa	ASTM D638
Tensile Strain (Break, Type I, 5 mm/min) ¹¹	200	%	ASTM D638
Tensile Modulus (at 5 mm/min) ¹¹	1170	MPa	ASTM D638
Flexural Stress (Break, 1.3 mm/min, 50 mm span) ¹¹	52	MPa	ASTM D790
Flexural Modulus (at 1.3 mm/min, 50 mm span) ¹¹	1170	MPa	ASTM D790
Tensile Stress (Yield, 5 mm/min) ¹¹	34	MPa	ISO 527
Tensile Strain (Break, 5 mm/min) ¹¹	140	%	ISO 527
Tensile Modulus (at 1 mm/min) ¹¹	1190	MPa	ISO 527
Flexural Modulus (at 2 mm/min) ¹¹	1150	MPa	ISO 178

Table 2 of 7

4 rows

Characteristic	Value	Unit	Method
Density ¹¹	1.16	g/cm³	ASTM D792
Mold Shrinkage (flow) ᵍ ¹¹	0.6	%	SABIC method
Mold Shrinkage (xflow) ᵍ ¹¹	0.6	%	SABIC method
Moisture Absorption (at 23°C, 50% RH) ¹¹	0.7	%	ISO 62

Table 3 of 7

4 rows

Characteristic	Value	Unit	Method
Heat Deflection Temperature (at 0.45 MPa, 6.4 mm, Unannealed) ¹¹	84	°C	ASTM D648
Heat Deflection Temperature (at 1.82 MPa, 6.4 mm, Unannealed) ¹¹	75	°C	ASTM D648
Coefficient of Thermal Expansion (at 23°C to 60°C, flow) ¹¹	0.00012	1/°C	ISO 11359-2
Coefficient of Thermal Expansion (at 23°C to 60°C, xflow) ¹¹	0.00014	1/°C	ISO 11359-2

Table 4 of 7

3 rows

Characteristic	Value	Unit	Method
Volume Resistivity ᵈ ¹¹	8000000000 - 300000000000	Ω.cm	ASTM D257
Surface Resistivity ᵈ ¹¹	9000000000 - 400000000000	Ω	ASTM D257
Static Decay (at 5000V to max. 50V) ¹¹	max. 2	Seconds	FTMS101B

Table 5 of 7

2 rows

Characteristic	Value	Unit	Method
Light Transmission (at 2.54 mm) ¹¹	77	%	ASTM D1003
Haze (at 2.54 mm) ¹¹	25	%	ASTM D1003

Table 6 of 7