LNP™ COLORCOMP™ Compound DX09304C
- Chemical Family
- Polycarbonate (PC)
SABIC's Specialties Business LNP COLORCOMP DX09304C is an unfilled polycarbonate (PC) resin. Added features of this grade include: easy molding, very low level of leachable ions and low outgassing. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Equipment & Parts
- Consumer Electronics
- Displays
- Industrial Automation
- Connectors
- Semiconductor Manufacturing
- Switches & Relays
Product Families
- High Performance Thermoplastics
- Polycarbonates
Other characteristics
- Brand
- LNP™ COLORCOMP™ Compound
- Polymer Name
- Polycarbonate (PC)
- Flexural Modulus
- 2200.0 - 2200.0 MPa
- Processing Methods
- Injection Molding
- Note
ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁿ Tensile Stiffness (K) is a structural property defined as the stress/strain in the linear region of the stress/strain curve. Value depends on the geometry/shape and boundary/surrounding conditions.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
- Markets
- Consumer Goods
- Electrical & Electronics
- Industrial
- Technology
- Plastics
- Labeling Claims
- No Added PFAS
- Material Features
- Good Moldability
- Good Processability
- Low Liquid Particle Count
- Low Outgassing
- No Added PFAS
- Unreinforced
- Plastics and Elastomers End Uses
- Cell Phones
- Computer Components
- Displays
- Electrical Components
- Electrical/Electronic Applications
- Industrial Applications
- Semiconductor Applications
- Tablets
- Plastics and Elastomers Functions
- Resin
- Plastics and Elastomers Processing Methods
- Injection Molding
Technical data
Table 1 of 5
13 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Flexural Stress (Yield, 1.3 mm/min, 50 mm span) ¹¹ | 94 | MPa | ASTM D790 |
| Flexural Modulus (at 1.3 mm/min, 50 mm span) ¹¹ | 2210 | MPa | ASTM D790 |
| Flexural Strength (at 2 mm/min) ¹¹ | 92.4 | MPa | ISO 178 |
| Flexural Modulus (at 2 mm/min) ¹¹ | 2200 | MPa | ISO 178 |
| Tensile Stress (Yield, Type I, 50 mm/min) ¹¹ | 60.4 | MPa | ASTM D638 |
| Tensile Stress (Break, Type I, 50 mm/min) ¹¹ | 59.1 | MPa | ASTM D638 |
| Tensile Modulus (at 50 mm/min) ¹¹ | 2283 | MPa | ASTM D638 |
| Tensile Strain (Yield, Type I, 50 mm/min) ¹¹ | 0.22 | % | ASTM D638 |
| Tensile Strain (Break, Type I, 50 mm/min) ¹¹ | 78.6 | % | ASTM D638 |
| Tensile Stress (Yield, 50 mm/min) ¹¹ | 59.4 | MPa | ISO 527 |
| Tensile Stress (Break, 50 mm/min) ¹¹ | 60.5 | MPa | ISO 527 |
| Tensile Modulus (at 1 mm/min) ¹¹ | 2300 | MPa | ISO 527 |
Table 2 of 5
5 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Specific Gravity ⁿ | 1.195 | — | ASTM D792 |
| Water Absorption (at 23°C, saturated) ⁿ | 0.05 | % | ISO 62-1 |
| Melt Flow Rate (at 300°C, 1.2 kgf) ⁿ | 22 | g/10 min | ASTM D1238 |
| Mold Shrinkage (flow) ᵍ | 0.66 | % | SABIC method |
| Mold Shrinkage (xflow) ᵍ | 0.69 | % | SABIC method |
Table 3 of 5
4 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Heat Deflection Temperature (at 0.45 MPa, 3.2 mm, Unannealed) ¹¹ | 142 | °C | ASTM D648 |
| Vicat Softening Temperature (Rate A/120) ¹¹ | 149 | °C | ISO 306 |
| Coefficient of Thermal Expansion (at 23°C to 80°C, flow) ¹¹ | 0.00008 | 1/°C | ISO 11359-2 |
| Coefficient of Thermal Expansion (at 23°C to 80°C, xflow) ¹¹ | 0.00008 | 1/°C | ISO 11359-2 |
Table 4 of 5
9 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Izod Impact (Notched, at 23°C) ¹¹ | 790 | J/m | ASTM D256 |
| Izod Impact (Unnotched, at 23°C) ¹¹ | 2117 | J/m | ASTM D4812 |
| Izod Impact (Notched, at -30°C) ¹¹ | 108 | J/m | ASTM D256 |
| Izod Impact (Unnotched, 80*10*4, at 23°C) ¹¹ | 139 | kJ/m² | ISO 180/1U |
| Izod Impact (Notched, 80*10*4, at 23°C) ¹¹ | 46.5 | kJ/m² | ISO 180/1A |
| Izod Impact (Notched, 80*10*4, at -30°C) ¹¹ | 11.1 | kJ/m² | ISO 180/1A |
| Charpy Impact (at 23°C, Unnotch Edgew 80*10*4 sp=62mm) ¹¹ | 100.8 | kJ/m² | ISO 179/1eU |
| Charpy Impact (at 23°C, V-notch Edgew 80*10*4 sp=62mm) ¹¹ | 63.3 | kJ/m² | ISO 179/1eA |
| Charpy Impact (at -30°C, V-notch Edgew 80*10*4 sp=62mm) ¹¹ | 11.7 | kJ/m² | ISO 179/1eA |
Table 5 of 5
11 rows| Characteristic | Value | Unit |
|---|---|---|
| Drying Temperature ⁷ | 100 | °C |
| Drying Time ⁷ | 3 - 5 | Hrs |
| Maximum Moisture Content ⁷ | 0.02 | % |
| Melt Temperature ⁷ | 260 - 300 | °C |
| Nozzle Temperature ⁷ | 260 - 300 | °C |
| Front - Zone 3 Temperature ⁷ | 260 - 300 | °C |
| Middle - Zone 2 Temperature ⁷ | 260 - 300 | °C |
| Rear - Zone 1 Temperature ⁷ | 240 - 260 | °C |
| Mold Temperature ⁷ | 80 - 120 | °C |
| Back Pressure ⁷ | 0.1 - 0.5 | MPa |
| Screw Speed ⁷ | 30 - 100 | rpm |
