LNP™ KONDUIT™ Compound 8TF36E
LNP™ KONDUIT™ Compound 8TF36E is based on liquid crystal polymer (LCP) resin, reinforced with 15% glass fibers and a proprietary thermal filler. This grade features high flow, low moisture absorption, high temperature resistance, and is thermally conductive and electrically insulative. It is suitable for light colors and designed for applications in electronic components and material handling where these properties are essential.
Product families
- High Performance Thermoplastics
Other characteristics
- Brand
- LNP™ KONDUIT™ Compound
- Polymer Name
- Liquid Crystal Polymer (LCP)
- Fillers Included
- Glass Fiber, Proprietary
- Glass Fiber
- Proprietary
- Processing Methods
- Injection Molding
- Note
¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design. ² Measurements made from laboratory test coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article. ³ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.
- Technology
- Plastics
- Labeling Claims
- No Added PFAS
- Material Features
- Electrically Insulating
- High Flow
- High Temperature Resistance
- Light Color
- Low Moisture Absorption
- No Added PFAS
- Thermally Conductive
- Plastics and Elastomers End Uses
- Electronic Components
- Electronic Material Handling
- Plastics and Elastomers Functions
- Resin
- Plastics and Elastomers Processing Methods
- Injection Molding
Technical data
Table 1 of 6
10 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Stress (Break, Type I, 5 mm/min) ¹ | 125.0 | MPa | ASTM D638 |
| Tensile Strain (Break, Type I, 5 mm/min) ¹ | 2.3 | % | ASTM D638 |
| Tensile Modulus (at 5 mm/min) ¹ | 13000.0 | MPa | ASTM D638 |
| Flexural Strength (1.3 mm/min, 50 mm span) ¹ | 165.0 | MPa | ASTM D790 |
| Flexural Modulus (at 1.3 mm/min, 50 mm span) ¹ | 12000.0 | MPa | ASTM D790 |
| Tensile Stress (Break, 5 mm/min) ¹ | 127.0 | MPa | ISO 527 |
| Tensile Strain (Break, 5 mm/min) ¹ | 2.2 | % | ISO 527 |
| Tensile Modulus (at 1 mm/min) ¹ | 13030.0 | MPa | ISO 527 |
| Flexural Strength (2 mm/min) ¹ | 170.0 | MPa | ISO 178 |
| Flexural Modulus (at 2 mm/min) ¹ | 13160.0 | MPa | ISO 178 |
Table 2 of 6
5 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Specific Gravity ¹ | 1.72 | — | ASTM D792 |
| Water Absorption (23°C/24hrs) ¹ | 0.02 | % | ISO 62-1 |
| Melt Flow Rate (at 345°C/2.16 kgf) ¹ | 150.0 | g/10 min | ASTM D1238 |
| Mold Shrinkage (flow) ² | 0.1 | % | SABIC method |
| Mold Shrinkage (xflow) ² | 0.2 | % | SABIC method |
Table 3 of 6
12 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Heat Deflection Temperature (0.45 MPa, 3.2 mm, unannealed) ¹ | 280.0 | °C | ASTM D648 |
| Heat Deflection Temperature (1.82 MPa, 3.2mm, unannealed) ¹ | 265.0 | °C | ASTM D648 |
| Heat Deflection Temperature/Bf (0.45 MPa Flatw 80*10*4 sp=64mm) ¹ | min. 280 | °C | ISO 75/Bf |
| Heat Deflection Temperature/Af (1.8 MPa Flatw 80*10*4 sp=64mm) ¹ | 261.0 | °C | ISO 75/Af |
| Coefficient of Thermal Expansion (at 23°C to 150°C, flow) ¹ | 1.0e-05 | 1/°C | ASTM E831 |
| Coefficient of Thermal Expansion (at 23°C to 150°C, flow) ¹ | 1.1e-05 | 1/°C | ISO 11359-2 |
| Coefficient of Thermal Expansion (at 23°C to 150°C, xflow) ¹ | 5.5e-05 | 1/°C | ASTM E831 |
| Coefficient of Thermal Expansion (at 23°C to 150°C, xflow) ¹ | 6.5e-05 | 1/°C | ISO 11359-2 |
| Vicat Softening Temperature (at Rate B/50) ¹ | 204.0 | °C | ISO 306 |
| Vicat Softening Temperature (at Rate B/120) ¹ | 207.0 | °C | ISO 306 |
| Thermal Conductivity (in-plane, 25*0.4mm disk) ¹ | 4.5 | W/m-K | ASTM E1461-07 |
| Thermal Conductivity (through-plane, 10*10*3mm sample) ¹ | 1.0 | W/m-K | ASTM E1461-07 |
Table 4 of 6
10 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Surface Resistivity ¹ | 1.0e+16 | Ω | ASTM D257 |
| Volume Resistivity ¹ | 1.0e+16 | Ω.cm | ASTM D257 |
| Dielectric Constant (at 1.1 GHz) ¹ | 4.06 | — | SABIC method |
| Dissipation Factor (at 1.1 GHz) ¹ | 0.00307 | — | SABIC method |
| Dielectric Constant (at 1.9 GHz) ¹ | 4.12 | — | SABIC method |
| Dissipation Factor (at 1.9 GHz) ¹ | 0.00289 | — | SABIC method |
| Dielectric Constant (at 5 GHz) ¹ | 4.07 | — | SABIC method |
| Dissipation Factor (at 5 GHz) ¹ | 0.00263 | — | SABIC method |
| Dielectric Constant (at 10 GHz) ¹ | 4.08 | — | SABIC method |
| Dissipation Factor (at 10 GHz) ¹ | 0.00285 | — | SABIC method |
Table 5 of 6
22 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Izod Impact (Notched, 23°C) ¹ | 70.0 | J/m | ASTM D256 |
| Izod Impact (Notched, -30°C) ¹ | 68.0 | J/m | ASTM D256 |
| Izod Impact (Unnotched, 23°C) ¹ | 400.0 | J/m | ASTM D4812 |
| Izod Impact (Unnotched, -30°C) ¹ | 350.0 | J/m | ASTM D4812 |
| Izod Impact (Notched 80*10*3 +23°C) ¹ | 7.6 | kJ/m² | ISO 180/1A |
| Izod Impact (Notched 80*10*3 -30°C) ¹ | 7.1 | kJ/m² | ISO 180/1A |
| Izod Impact (Unnotched 80*10*3 +23°C) ¹ | 21.4 | kJ/m² | ISO 180/1U |
| Izod Impact (Unnotched 80*10*3 -30°C )¹ | 17.4 | kJ/m² | ISO 180/1U |
| Izod Impact (Notched 80*10*4 +23°C) ¹ | 7.7 | kJ/m² | ISO 180/1A |
| Izod Impact (Notched 80*10*4 -30°C) ¹ | 8.3 | kJ/m² | ISO 180/1A |
| Izod Impact (Unnotched 80*10*4 +23°C) ¹ | 21.7 | kJ/m² | ISO 180/1U |
| Izod Impact (Unnotched 80*10*4 -30°C) ¹ | 18.3 | kJ/m² | ISO 180/1U |
Table 6 of 6
10 rows| Characteristic | Value | Unit |
|---|---|---|
| Drying Temperature ³ | 140 - 150 | °C |
| Drying Time ³ | 4 - 6 | Hrs |
| Melt Temperature ³ | 335 - 345 | °C |
| Nozzle Temperature ³ | 335 - 345 | °C |
| Front - Zone 3 Temperature ³ | 335 - 345 | °C |
| Middle - Zone 2 Temperature ³ | 335 - 340 | °C |
| Rear - Zone 1 Temperature ³ | 280 - 300 | °C |
| Mold Temperature ³ | 100 - 120 | °C |
| Back Pressure ³ | 0.1 - 0.4 | MPa |
| Screw Speed ³ | 80 - 100 | rpm |
