LNP™ THERMOCOMP™ Compound WX15003
- Chemical Family
- Polyesters
LNP THERMOCOMP WX15003 compound is based on Polybutylene Terephthalate (PBT) resin containing 45 % glass fiber/mineral. Added features of this grade include: UV stabilized.
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Consumer Goods — Lawn & Garden
- Consumer Goods — Sports & Recreation
- Artificial Turf
- Consumer Electronics
- Displays
- Non-Food Consumer Packaging
- Applicators & Accessories
- Connectors
- Housings & Enclosures
- Switches & Relays
Product Families
- Polyesters & Copolyesters
Other characteristics
- Brand
- LNP™ THERMOCOMP™ Compound
- Polymer Name
- Polybutylene Terephthalate (PBT)
- Fillers Included
- Glass Fiber, Glass/Mineral, Mineral
- Glass Fiber
- Glass/Mineral
- Mineral
- Flexural Modulus
- 7400.0 - 7400.0 MPa
- Additives Included
Heat Stabilizer, Metal Deactivator, Mold Release Agent, UV Stabilizer; Heat Stabilizer; Metal Deactivator; Mold Release Agent; UV Stabilizer
- Processing Methods
- Injection Molding
- Note
ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
- Markets
- Building & Construction
- Consumer Goods
- Electrical & Electronics
- Personal Care
- Printing & Packaging
- Technology
- Plastics
- Material Features
- Cost Effective
- Good Mold Release
- Good UV Stability
- Good Weather Stability
- Heat Stabilized
- High Stiffness
- Low Warpage
- Metal Detectable
- Country Availability
- Canada
- China (Mainland)
- Mexico
- USA
- Plastics and Elastomers End Uses
- Appliances
- Building Materials
- Cell Phones
- Commercial Appliance
- Computer Components
- Consumer Applications
- Containers
- Displays
- Plastics and Elastomers Functions
- Resin
- Plastics and Elastomers Processing Methods
- Injection Molding
Technical data
Table 1 of 7
7 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Taber Abrasion (CS-17, 1 kg) ¹¹ | 76 | mg/1000cy | SABIC method |
| Tensile Stress (Break, 5 mm/min) ¹¹ | 100 | MPa | ISO 527 |
| Tensile Strain (Break, 5 mm/min) ¹¹ | 2 | % | ISO 527 |
| Tensile Modulus (at 1 mm/min) ¹¹ | 8000 | MPa | ISO 527 |
| Flexural Stress (Break, 2 mm/min) ¹¹ | 140 | MPa | ISO 178 |
| Flexural Modulus (at 2 mm/min) ¹¹ | 7400 | MPa | ISO 178 |
| Ball Indentation Hardness (H358/30) ¹¹ | 145 | MPa | ISO 2039-1 |
Table 2 of 7
3 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Mold Shrinkage (on Tensile Bar, flow) ᵍ ¹¹ | 0.2 - 0.6 | % | SABIC method |
| Density ¹¹ | 1.83 | g/cm³ | ISO 1183 |
| Melt Volume Rate (at 265°C, 1.2 kg) ¹¹ | 11 | cm³/10 min | ISO 1133 |
Table 3 of 7
11 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Thermal Conductivity ¹¹ | 0.33 | W/m-°C | ISO 8302 |
| Coefficient of Thermal Expansion (at 23°C to 80°C, flow) ¹¹ | 0.00003 | 1/°C | ISO 11359-2 |
| Coefficient of Thermal Expansion (at 23°C to 80°C, xflow) ¹¹ | 0.000075 | 1/°C | ISO 11359-2 |
| Coefficient of Thermal Expansion (at 23°C to 150°C, flow) ¹¹ | 0.000025 | 1/°C | ISO 11359-2 |
| Coefficient of Thermal Expansion (at 23°C to 150°C, xflow) ¹¹ | 0.00008 | 1/°C | ISO 11359-2 |
| Ball Pressure Test (at 123°C to 127°C) ¹¹ | Pass | — | IEC 60695-10-2 |
| Vicat Softening Temperature (Rate A/50) ¹¹ | 220 | °C | ISO 306 |
| Vicat Softening Temperature (Rate B/50) ¹¹ | 200 | °C | ISO 306 |
| Vicat Softening Temperature (Rate B/120) ¹¹ | 200 | °C | ISO 306 |
| Heat Deflection Temperature/Be (at 0.45MPa, Edgew 120*10*4, sp=100mm) ¹¹ | 220 | °C | ISO 75/Be |
| Heat Deflection Temperature/Ae (at 1.8 Mpa, Edgew 120*10*4, sp=100mm) ¹¹ | 180 | °C | ISO 75/Ae |
Table 4 of 7
6 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Volume Resistivity ¹¹ | min. 1.E+15 | Ω.cm | IEC 60093 |
| Surface Resistivity (ROA) ¹¹ | min. 1.E+15 | Ω | IEC 60093 |
| Relative Permittivity (1 MHz) ¹¹ | 3.5 | — | IEC 60250 |
| Dissipation Factor (at 50/60 Hz) ¹¹ | 0.001 | — | IEC 60250 |
| Dissipation Factor (at at 1 MHz) ¹¹ | 0.013 | — | IEC 60250 |
| Relative Permittivity (50/60 Hz) ¹¹ | 3.6 | — | IEC 60250 |
Table 5 of 7
8 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Izod Impact (Unnotched, 80*10*4, at 23°C) ¹¹ | 33 | kJ/m² | ISO 180/1U |
| Izod Impact (Unnotched, 80*10*4, at -30°C) ¹¹ | 31 | kJ/m² | ISO 180/1U |
| Izod Impact (Notched, 80*10*4, at 23°C) ¹¹ | 5 | kJ/m² | ISO 180/1A |
| Izod Impact (Notched, 80*10*4, at -30°C) ¹¹ | 4 | kJ/m² | ISO 180/1A |
| Charpy Impact (at 23°C, V-notch Edgew 80*10*4 sp=62mm) ¹¹ | 4 | kJ/m² | ISO 179/1eA |
| Charpy Impact (at -30°C, V-notch Edgew 80*10*4 sp=62mm) ¹¹ | 3.00E+00 | kJ/m² | ISO 179/1eA |
| Charpy Impact (at 23°C, Unnotch Edgew 80*10*4 sp=62mm) ¹¹ | 35 | kJ/m² | ISO 179/1eU |
| Charpy Impact (at -30°C, Unnotch Edgew 80*10*4 sp=62mm) ¹¹ | 35 | kJ/m² | ISO 179/1eU |
Table 6 of 7
10 rows| Characteristic | Value | Unit |
|---|---|---|
| Drying Temperature ⁷ | 110 - 120 | °C |
| Drying Time ⁷ | 2 - 4 | Hrs |
| Maximum Moisture Content ⁷ | 0.02 | % |
| Melt Temperature ⁷ | 255 - 280 | °C |
| Nozzle Temperature ⁷ | 245 - 270 | °C |
| Front - Zone 3 Temperature ⁷ | 250 - 270 | °C |
| Middle - Zone 2 Temperature ⁷ | 240 - 260 | °C |
| Rear - Zone 1 Temperature ⁷ | 230 - 250 | °C |
| Hopper Temperature ⁷ | 40 - 60 | °C |
| Mold Temperature ⁷ | 60 - 100 | °C |
Table 7 of 7
1 row| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Glow Wire Flammability Index (passes at 750°C) | 3.2 | mm | IEC 60695-2-12 |
