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LNP™ THERMOCOMP™ Compound LC008EXP
- Chemical Family
- Polyether Ether Ketone (PEEK)
LNP THERMOCOMP LC008EXP compound is based on Polyetheretherketone (PEEK) resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive, Easy Molding.
Product families
Applications
Applications
- Consumer Goods — Appliances & Electronics
Industrial — Chemical & Industrial Manufacturing
- Equipment & Parts
Electrical & Electronics — Devices & Assemblies
- Consumer Electronics
- Displays
- Industrial Automation
Electrical & Electronics — Parts & Components
- Connectors
- Housings & Enclosures
- Semiconductor Manufacturing
- Switches & Relays
Product Families
Plastics — Engineering & Specialty Polymers
- High Performance Thermoplastics
Other characteristics
- Brand
- LNP™ THERMOCOMP™ Compound
- Polymer Name
- Polyetheretherketone (PEEK)
- Fillers Included
- Carbon Fiber
- Flexural Modulus
- 22900.0 - 22900.0 MPa
- Additives Included
- Mold Release Agent
- Processing Methods
- Injection Molding
- Note
⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.. ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
- Markets
- Consumer Goods
- Electrical & Electronics
- Industrial
- Technology
- Plastics
- Material Features
- Cost Effective
- Easy To Mold
- Electrically Conductive
- Good Mold Release
- Good Moldability
- Good Processability
- High Stiffness
- High Strength
- Country Availability
- Canada
- China (Mainland)
- Mexico
- USA
- Plastics and Elastomers End Uses
- Cell Phones
- Computer Components
- Displays
- Electrical Components
- Electrical Enclosure
- Electrical Internal Frame
- Electrical/Electronic Applications
- Electronic Components
- Plastics and Elastomers Functions
- Resin
- Plastics and Elastomers Processing Methods
- Injection Molding
Technical data
Table 1 of 5
5 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Stress (Break, 5 mm/min) ¹¹ | 256 | MPa | ISO 527 |
| Tensile Strain (Break, 5 mm/min) ¹¹ | 1.6 | % | ISO 527 |
| Tensile Modulus (at 1 mm/min) ¹¹ | 26200 | MPa | ISO 527 |
| Flexural Stress (Break, 2 mm/min) ¹¹ | 341 | MPa | ISO 178 |
| Flexural Modulus (at 2 mm/min) ¹¹ | 22900 | MPa | ISO 178 |
Table 2 of 5
1 row| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Density ¹¹ | 1.45 | g/cm³ | ISO 1183 |
Table 3 of 5
3 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Coefficient of Thermal Expansion (at 23°C to 60°C, flow) ¹¹ | 0.000004 | 1/°C | ISO 11359-2 |
| Coefficient of Thermal Expansion (at 23°C to 60°C, xflow) ¹¹ | 0.000041 | 1/°C | ISO 11359-2 |
| Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80*10*4, sp=64mm) ¹¹ | min. 300 | °C | ISO 75/Af |
Table 4 of 5
2 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Izod Impact (Unnotched, 80*10*4, at 23°C) ¹¹ | 45 | kJ/m² | ISO 180/1U |
| Izod Impact (Notched, 80*10*4, at 23°C) ¹¹ | 9 | kJ/m² | ISO 180/1A |
Table 5 of 5
10 rows| Characteristic | Value | Unit |
|---|---|---|
| Drying Temperature ⁷ | 120 - 150 | °C |
| Drying Time ⁷ | 4 | Hrs |
| Maximum Moisture Content ⁷ | 0.1 | % |
| Melt Temperature ⁷ | 380 - 390 | °C |
| Front - Zone 3 Temperature ⁷ | 380 - 395 | °C |
| Middle - Zone 2 Temperature ⁷ | 365 - 375 | °C |
| Rear - Zone 1 Temperature ⁷ | 350 - 360 | °C |
| Mold Temperature ⁷ | 140 - 165 | °C |
| Back Pressure ⁷ | 0.3 - 0.7 | MPa |
| Screw Speed ⁷ | 60 - 100 | rpm |
