LNP™ THERMOCOMP™ Compound LC008E

Chemical Family: Polyether Ether Ketone (PEEK)

SABIC's Specialties Business LNP THERMOCOMP LC008E compound is based on Polyetheretherketone (PEEK) resin containing 40% carbon fiber. Added features of this grade include: Easy Molding, Electrically Conductive. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

Product families

Applications

Consumer Goods — Appliances & Electronics

Electrical & Electronics — Devices & Assemblies

Consumer Electronics
Displays
Industrial Automation

Electrical & Electronics — Parts & Components

Connectors
Housings & Enclosures
Semiconductor Manufacturing
Switches & Relays

Product Families

Plastics — Engineering & Specialty Polymers

High Performance Thermoplastics

Other characteristics

Brand: LNP™ THERMOCOMP™ Compound
Polymer Name: Polyetheretherketone (PEEK)
Fillers Included: Carbon Fiber
Flexural Modulus: 26880.0 - 26880.0 MPa
Processing Methods: Injection Molding
Note: ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
Markets: Consumer Goods
Electrical & Electronics
Technology: Plastics
Labeling Claims: No Added PFAS
Material Features: Cost Effective
ESD Protection
Easy To Mold
Electrically Conductive
Good Moldability
Good Processability
High Stiffness
High Strength
Country Availability: Canada
China (Mainland)
Mexico
USA
Plastics and Elastomers End Uses: Cell Phones
Computer Components
Displays
Electrical Components
Electrical Enclosure
Electrical Internal Frame
Electrical/Electronic Applications
Internal Armature
Plastics and Elastomers Functions: Resin
Plastics and Elastomers Processing Methods: Injection Molding

Technical data

Table 1 of 5

10 rows

Characteristic	Value	Unit	Method
Tensile Stress (Break) ¹¹	240	MPa	ASTM D638
Tensile Stress (Break) ¹¹	242	MPa	ISO 527
Tensile Strain (Break) ¹¹	1.3	%	ASTM D638
Tensile Strain (Break) ¹¹	1.3	%	ISO 527
Tensile Modulus (at 5 mm/min) ¹¹	33090	MPa	ASTM D638
Flexural Stress ¹¹	365	MPa	ASTM D790
Flexural Stress ¹¹	352	MPa	ISO 178
Flexural Modulus ¹¹	26880	MPa	ASTM D790
Flexural Modulus ¹¹	27500	MPa	ISO 178
Tensile Modulus (at 1 mm/min) ¹¹	30520	MPa	ISO 527

Table 2 of 5

6 rows

Characteristic	Value	Unit	Method
Density ¹¹	1.47	g/cm³	ASTM D792
Density ¹¹	1.47	g/cm³	ISO 1183
Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹	0.1 - 0.3	%	ASTM D955
Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹	0.05	%	ISO 294
Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹	0.6 - 0.8	%	ASTM D955
Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹	0.73	%	ISO 294

Table 3 of 5

8 rows

Characteristic	Value	Unit	Method
Heat Deflection Temperature (at 0.45 MPa, 3.2 mm, Unannealed) ¹¹	338	°C	ASTM D648
Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹	322	°C	ASTM D648
Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹	0.000007	1/°C	ISO 11359-2
Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹	0.0000072	1/°C	ASTM E831
Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹	0.000027	1/°C	ASTM E831
Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹	0.000027	1/°C	ISO 11359-2
Heat Deflection Temperature/Bf (at 0.45 Mpa, Flatw 80104, sp=64mm) ¹¹	338	°C	ISO 75/Bf
Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80104, sp=64mm) ¹¹	326	°C	ISO 75/Af

Table 4 of 5