LNP™ THERMOCOMP™ Compound KF004A
SABIC's Specialties Business LNP THERMOCOMP KF004A compound is based on POM (Acetal) homopolymer resin containing 20% glass fiber. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Consumer Goods — Lawn & Garden
- Artificial Turf
- Consumer Electronics
- Displays
- Non-Food Consumer Packaging
- Applicators & Accessories
- Connectors
- Housings & Enclosures
- Switches & Relays
Product Families
- Polyacetals
Other characteristics
- Brand
- LNP™ THERMOCOMP™ Compound
- Polymer Name
- Polyacetal Homopolymer (POM)
- Fillers Included
- Glass Fiber
- Flexural Modulus
- 7100.0 - 7100.0 MPa
- Processing Methods
- Injection Molding
- Note
ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
- Markets
- Building & Construction
- Consumer Goods
- Electrical & Electronics
- Personal Care
- Printing & Packaging
- Technology
- Plastics
- Labeling Claims
- No Added PFAS
- Material Features
- Cost Effective
- High Modulus
- High Stiffness
- No Added PFAS
- Country Availability
- Canada
- China (Mainland)
- Mexico
- USA
- Plastics and Elastomers End Uses
- Building Materials
- Cell Phones
- Computer Components
- Consumer Applications
- Containers
- Displays
- Doors
- Electrical Components
- Plastics and Elastomers Functions
- Resin
- Plastics and Elastomers Processing Methods
- Injection Molding
Technical data
Table 1 of 4
4 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Stress (Break) ¹¹ | 99 | MPa | ASTM D638 |
| Tensile Strain (Break) ¹¹ | 2.2 | % | ASTM D638 |
| Flexural Stress ¹¹ | 144 | MPa | ASTM D790 |
| Flexural Modulus ¹¹ | 7100 | MPa | ASTM D790 |
Table 2 of 4
3 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Density ¹¹ | 1.56 | g/cm³ | ASTM D792 |
| Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹ | 0.6 | % | ASTM D955 |
| Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹ | 2 | % | ASTM D955 |
Table 3 of 4
2 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Izod Impact (Unnotched, at 23°C) ¹¹ | 427 | J/m | ASTM D4812 |
| Izod Impact (Notched, at 23°C) ¹¹ | 58 | J/m | ASTM D256 |
Table 4 of 4
9 rows| Characteristic | Value | Unit |
|---|---|---|
| Drying Temperature ⁷ | 80 | °C |
| Drying Time ⁷ | 4 | Hrs |
| Melt Temperature ⁷ | 200 - 215 | °C |
| Front - Zone 3 Temperature ⁷ | 210 - 220 | °C |
| Middle - Zone 2 Temperature ⁷ | 195 - 205 | °C |
| Rear - Zone 1 Temperature ⁷ | 175 - 190 | °C |
| Mold Temperature ⁷ | 80 - 110 | °C |
| Back Pressure ⁷ | 0.2 - 0.3 | MPa |
| Screw Speed ⁷ | 30 - 60 | rpm |
