LNP™ THERMOCOMP™ Compound JF004E

Chemical Family: Polysulfones

SABIC's Specialties Business LNP THERMOCOMP JF004E compound is based on Polyethersulfone (PES) resin containing 20% glass fiber. Added features of this grade include: Easy Molding. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

Product families

Applications

Consumer Goods — Appliances & Electronics
Consumer Goods — Lawn & Garden
Consumer Goods — Sports & Recreation

Building & Construction — Decorative Materials & Finishes

Artificial Turf

Electrical & Electronics — Devices & Assemblies

Consumer Electronics
Displays

Printing & Packaging — Packaging

Non-Food Consumer Packaging

Personal Care — Packaging & Accessories

Applicators & Accessories

Electrical & Electronics — Parts & Components

Connectors
Housings & Enclosures
Switches & Relays

Product Families

Plastics — Engineering & Specialty Polymers

High Performance Thermoplastics

Other characteristics

Brand: LNP™ THERMOCOMP™ Compound
Polymer Name: Polyethersulfone (PES)
Fillers Included: Glass Fiber
Additives Included: Flame Retardant
Processing Methods: Injection Molding
Note: ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ᵖ UL ratings shown on the technical datasheet might not cover the full range of thicknesses and colors. For details, please see the UL Yellow Card.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
Markets: Building & Construction
Consumer Goods
Electrical & Electronics
Personal Care
Printing & Packaging
Flame Rating: UL 94 V0
Technology: Plastics
Labeling Claims: No Added PFAS
Material Features: Cost Effective
Easy To Mold
Flame Retardant
Good Moldability
Good Processability
High Modulus
High Stiffness
High Temperature Resistance
Country Availability: Canada
China (Mainland)
Mexico
USA
Certifications and Compliance: UL 94
Plastics and Elastomers End Uses: Appliances
Building Materials
Cell Phones
Commercial Appliance
Computer Components
Consumer Applications
Containers
Displays
Plastics and Elastomers Functions: Resin
Plastics and Elastomers Processing Methods: Injection Molding

Technical data

Table 1 of 6

14 rows

Characteristic	Value	Unit	Method
Tensile Stress (Break, 5 mm/min) ¹¹	128	MPa	ISO 527
Tensile Stress (Break) ¹¹	109	MPa	ISO 527
Tensile Stress (Break) ¹¹	114	MPa	ASTM D638
Tensile Strain (Break, 5 mm/min) ¹¹	2.5	%	ISO 527
Tensile Strain (Break) ¹¹	2.9	%	ISO 527
Tensile Strain (Break) ¹¹	2.9	%	ASTM D638
Tensile Modulus (at 1 mm/min) ¹¹	7350	MPa	ISO 527
Tensile Modulus (at 50 mm/min) ¹¹	7350	MPa	ASTM D638
Flexural Stress (Yield, at 2 mm/min) ¹¹	178	MPa	ISO 178
Flexural Stress ¹¹	183	MPa	ISO 178
Flexural Stress ¹¹	186	MPa	ASTM D790
Flexural Modulus (at 2 mm/min) ¹¹	6000	MPa	ISO 178

Table 2 of 6

8 rows

Characteristic	Value	Unit	Method
Mold Shrinkage (on Tensile Bar, flow) ᵍ ¹¹	0.25 - 0.45	%	SABIC method
Density ¹¹	1.51	g/cm³	ASTM D792
Density ¹¹	1.51	g/cm³	ISO 1183
Moisture Absorption (at 23°C, 50% RH, 24hrs) ¹¹	0.4	%	ASTM D570
Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹	0.5 - 0.7	%	ASTM D955
Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹	0.5 - 0.7	%	ISO 294
Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹	0.6 - 0.8	%	ASTM D955
Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹	0.6 - 0.8	%	ISO 294

Table 3 of 6

12 rows

Characteristic	Value	Unit	Method
Coefficient of Thermal Expansion (at 23°C to 60°C, flow) ¹¹	0.000024	1/°C	ISO 11359-2
Coefficient of Thermal Expansion (at 23°C to 60°C, xflow) ¹¹	0.000055	1/°C	ISO 11359-2
Heat Deflection Temperature/Bf (at 0.45 Mpa, Flatw 80104, sp=64mm) ¹¹	223	°C	ISO 75/Bf
Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80104, sp=64mm) ¹¹	218	°C	ISO 75/Af
Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80104, sp=64mm) ¹¹	205	°C	ISO 75/Af
Relative Temperature Index (Electrical) ¹¹	180	°C	UL 746B
Relative Temperature Index (Mechanical with impact) ¹¹	180	°C	UL 746B
Relative Temperature Index (Mechanical without impact) ¹¹	180	°C	UL 746B
Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹	205	°C	ASTM D648
Relative Temperature Index (Electrical) ᵖ ¹¹	180	°C	UL 746B
Relative Temperature Index (Mechanical with impact) ᵖ ¹¹	180	°C	UL 746B
Relative Temperature Index (Mechanical without impact) ᵖ ¹¹	180	°C	UL 746B

Table 4 of 6