LNP™ THERMOCOMP™ Compound EF002EXH

Chemical Family: Polyetherimide (PEI)Polyimides (PI)

SABIC's Specialties Business LNP THERMOCOMP EF002EXH compound is based on Polyetherimide (PEI) resin containing 10% glass fiber. Added features of this grade include: Healthcare. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

Product families

Applications

Healthcare & Pharma — Medical

Medical Devices & Assemblies
Surgical Instruments & Trays

Printing & Packaging — Packaging

Healthcare Packaging
Industrial & Transport Packaging

Electrical & Electronics — Parts & Components

Housings & Enclosures

Product Families

Plastics — Engineering & Specialty Polymers

High Performance Thermoplastics

Other characteristics

Brand: LNP™ THERMOCOMP™ Compound
Polymer Name: Polyether Imide (PEI)
Fillers Included: Glass Fiber
Processing Methods: Injection Molding
Note: ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
Markets: Electrical & Electronics
Healthcare & Pharma
Printing & Packaging
Technology: Plastics
Labeling Claims: No Added PFAS
Material Features: Cost Effective
High Modulus
High Stiffness
High Temperature Resistance
No Added PFAS
Very Good Heat Resistance
Country Availability: Canada
China (Mainland)
Mexico
USA
Plastics and Elastomers End Uses: Electrical Enclosure
Electrical Internal Frame
Internal Armature
Medical Devices
Medical Packaging
Medical/Healthcare Applications
Pharmaceutical Packaging
Surgical Devices
Plastics and Elastomers Functions: Resin
Plastics and Elastomers Processing Methods: Injection Molding

Technical data

Table 1 of 5

14 rows

Characteristic	Value	Unit	Method
Tensile Stress (Yield, Type I, 5 mm/min) ¹¹	114	MPa	ASTM D638
Tensile Stress (Break, Type I, 5 mm/min) ¹¹	115	MPa	ASTM D638
Tensile Strain (Yield, Type I, 5 mm/min) ¹¹	3	%	ASTM D638
Tensile Strain (Break, Type I, 5 mm/min) ¹¹	3	%	ASTM D638
Tensile Modulus (at 5 mm/min) ¹¹	4610	MPa	ASTM D638
Flexural Stress (Yield, 1.3 mm/min, 50 mm span) ¹¹	225	MPa	ASTM D790
Flexural Modulus (at 1.3 mm/min, 50 mm span) ¹¹	6850	MPa	ASTM D790
Tensile Stress (Yield, 5 mm/min) ¹¹	165	MPa	ISO 527
Tensile Stress (Break, 5 mm/min) ¹¹	165	MPa	ISO 527
Tensile Strain (Yield, 5 mm/min) ¹¹	2	%	ISO 527
Tensile Strain (Break, 5 mm/min) ¹¹	2	%	ISO 527
Tensile Modulus (at 1 mm/min) ¹¹	9500	MPa	ISO 527

Table 2 of 5

5 rows

Characteristic	Value	Unit	Method
Specific Gravity ¹¹	1.34	—	ASTM D792
Mold Shrinkage (flow, 3.2 mm) ᵍ ¹¹	0.2 - 0.4	%	SABIC method
Density ¹¹	1.42	g/cm³	ISO 1183
Water Absorption (at 23°C, saturated) ¹¹	0.9	%	ISO 62-1
Moisture Absorption (at 23°C, 50% RH) ¹¹	0.5	%	ISO 62

Table 3 of 5

6 rows

Characteristic	Value	Unit	Method
Heat Deflection Temperature (at 1.82 MPa, 6.4 mm, Unannealed) ¹¹	207	°C	ASTM D648
Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹	0.000025	1/°C	ISO 11359-2
Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹	0.000025	1/°C	ASTM E831
Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹	0.00005	1/°C	ISO 11359-2
Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹	0.00005	1/°C	ASTM E831
Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80104, sp=64mm) ¹¹	205	°C	ISO 75/Af

Table 4 of 5