LNP™ THERMOCOMP™ Compound DX13354

Chemical Family: Polycarbonate (PC)

SABIC's Specialties Business LNP THERMOCOMP DX13354 compound is based on Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: Improved Plating Surface and Mechanical Performance suitable for Laser Direct Structuring (LDS) applications, Improved Impact, Good Surface Esthetics and Wide Processing Window. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

Product families

Applications

Consumer Goods — Appliances & Electronics

Automotive & Transportation — Automotive

Interior

Electrical & Electronics — Devices & Assemblies

Consumer Electronics
Displays

Printing & Packaging — Packaging

Non-Food Consumer Packaging

Personal Care — Packaging & Accessories

Applicators & Accessories

Electrical & Electronics — Parts & Components

Connectors
Housings & Enclosures
Switches & Relays

Product Families

Plastics — Engineering & Specialty Polymers

High Performance Thermoplastics
Polycarbonates

Other characteristics

Brand: LNP™ THERMOCOMP™ Compound
Polymer Name: Polycarbonate (PC)
Fillers Included: Glass Fiber
Flexural Modulus: 8020.0 - 8020.0 MPa
Additives Included: Heat Stabilizer, Impact Modifier, Metal Deactivator, Mold Release Agent; Heat Stabilizer; Impact Modifier; Metal Deactivator; Mold Release Agent
Processing Methods: Injection Molding, Laser Sintering (SLS)
Note: ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
Markets: Automotive & Transportation
Consumer Goods
Electrical & Electronics
Personal Care
Printing & Packaging
Technology: Plastics
Labeling Claims: No Added PFAS
Material Features: Cost Effective
Excellent Aesthetics
Excellent Dielectric Properties
Good Aesthetics
Good Mold Release
Good Surface Appearance
Heat Stabilized
High Ductility
Country Availability: Canada
China (Mainland)
Mexico
USA
Plastics and Elastomers End Uses: Automotive Interior Parts
Cell Phones
Computer Components
Consumer Applications
Containers
Displays
Electrical Components
Electrical Enclosure
Plastics and Elastomers Functions: Resin
Plastics and Elastomers Processing Methods: Injection Molding
Laser Sintering (SLS)

Technical data

Table 1 of 6

10 rows

Characteristic	Value	Unit	Method
Tensile Stress (Break, Type I, 5 mm/min) ¹¹	120	MPa	ASTM D638
Tensile Strain (Break, Type I, 5 mm/min) ¹¹	2.4	%	ASTM D638
Tensile Modulus (at 5 mm/min) ¹¹	8760	MPa	ASTM D638
Flexural Stress ¹¹	180	MPa	ISO 178
Flexural Stress ¹¹	170	MPa	ASTM D790
Flexural Modulus ¹¹	8020	MPa	ASTM D790
Flexural Modulus ¹¹	8450	MPa	ISO 178
Tensile Stress (Break, 50 mm/min) ¹¹	120	MPa	ISO 527
Tensile Strain (Break, 50 mm/min) ¹¹	2.4	%	ISO 527
Tensile Modulus (at 1 mm/min) ¹¹	8840	MPa	ISO 527

Table 2 of 6

7 rows

Characteristic	Value	Unit	Method
Specific Gravity ¹¹	1.47	—	ASTM D792
Mold Shrinkage (flow, 3.2 mm) ᵍ ¹¹	0.05 - 0.1	%	SABIC method
Mold Shrinkage (xflow, 3.2 mm) ᵍ ¹¹	0.2 - 0.4	%	SABIC method
Melt Flow Rate (at 280°C, 2.16 kgf) ¹¹	10	g/10 min	ASTM D1238
Melt Flow Rate (at 280°C, 5.0 kgf) ¹¹	27	g/10 min	ASTM D1238
Melt Flow Rate (at 300°C, 1.2 kgf) ¹¹	16	g/10 min	ASTM D1238
Melt Volume Rate (at 300°C, 1.2 kg) ¹¹	13	cm³/10 min	ASTM D1238

Table 3 of 6

8 rows

Characteristic	Value	Unit	Method
Heat Deflection Temperature (at 0.45 MPa, 3.2 mm) ¹¹	126	°C	ASTM D648
Heat Deflection Temperature (at 1.82 MPa, 3.2 mm) ¹¹	122	°C	ASTM D648
Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹	0.000021	1/°C	ISO 11359-2
Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹	0.000021	1/°C	ASTM E831
Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹	0.000071	1/°C	ISO 11359-2
Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹	0.000069	1/°C	ASTM E831
Heat Deflection Temperature/Bf (at 0.45 Mpa, Flatw 80104, sp=64mm) ¹¹	127	°C	ISO 75/Bf
Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80104, sp=64mm) ¹¹	124	°C	ISO 75/Af

Table 4 of 6

6 rows

Characteristic	Value	Method
Dielectric Constant (at 1.1 GHz) ¹¹	3.52	SABIC method
Dielectric Constant (at 1.9 GHz) ¹¹	3.44	SABIC method
Dielectric Constant (at 5 GHz) ¹¹	3.51	SABIC method
Dissipation Factor (at 1.1 GHz) ¹¹	0.014	SABIC method
Dissipation Factor (at 1.9 GHz) ¹¹	0.013	SABIC method
Dissipation Factor (at 5 GHz) ¹¹	0.012	SABIC method

Table 5 of 6