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LNP™ THERMOCOMP™ Compound DF002FV

Chemical Family
Polycarbonate (PC)

SABIC's Specialties Business LNP™ THERMOCOMP™ DF002FV compound is based on Polycarbonate (PC) resin containing 10% glass fiber. Added features of this grade include: Improved Plating Surface and Mechanical Performance suitable for Laser Direct Structuring (LDS) applications, Good Surface Esthetics and Wide Processing Window.

Product families

Applications

Applications
  • Consumer Goods — Appliances & Electronics
Automotive & Transportation — Automotive
  • Interior
Electrical & Electronics — Devices & Assemblies
  • Consumer Electronics
  • Displays
Printing & Packaging — Packaging
  • Non-Food Consumer Packaging
Personal Care — Packaging & Accessories
  • Applicators & Accessories
Electrical & Electronics — Parts & Components
  • Connectors
  • Housings & Enclosures
  • Switches & Relays

Product Families

Plastics — Engineering & Specialty Polymers
  • Polycarbonates

Other characteristics

Brand
LNP™ THERMOCOMP™ Compound
Polymer Name
Polycarbonate (PC)
Fillers Included
Glass Fiber
Additives Included

Heat Stabilizer, Impact Modifier, Metal Deactivator, Mold Release Agent; Heat Stabilizer; Impact Modifier; Metal Deactivator; Mold Release Agent

Processing Methods
Injection Molding, Laser Sintering (SLS)
Note

ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ᵖ UL ratings shown on the technical datasheet might not cover the full range of thicknesses and colors. For details, please see the UL Yellow Card.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.

Markets
  • Automotive & Transportation
  • Consumer Goods
  • Electrical & Electronics
  • Personal Care
  • Printing & Packaging
Flame Rating
UL 94 HB
Technology
Plastics
Material Features
  • Cost Effective
  • Excellent Aesthetics
  • Excellent Dielectric Properties
  • Good Aesthetics
  • Good Mold Release
  • Good Surface Appearance
  • Heat Stabilized
  • High Modulus
Country Availability
  • Canada
  • China (Mainland)
  • Mexico
  • USA
Certifications and Compliance
UL 94
Plastics and Elastomers End Uses
  • Antenna
  • Automotive Applications
  • Automotive Interior Parts
  • Cell Phones
  • Computer Components
  • Consumer Applications
  • Containers
  • Displays
Plastics and Elastomers Functions
Resin
Plastics and Elastomers Processing Methods
  • Injection Molding
  • Laser Sintering (SLS)

Technical data

Table 1 of 7

5 rows
CharacteristicValueUnitMethod
Tensile Stress (Break, Type I, 5 mm/min) ¹¹60MPaASTM D638
Tensile Strain (Break, Type I, 5 mm/min) ¹¹4.1%ASTM D638
Tensile Modulus (at 5 mm/min) ¹¹3800MPaASTM D638
Flexural Stress (Yield, 1.3 mm/min, 50 mm span) ¹¹110MPaASTM D790
Flexural Modulus (at 1.3 mm/min, 50 mm span) ¹¹3600MPaASTM D790

Table 2 of 7

4 rows
CharacteristicValueUnitMethod
Specific Gravity ¹¹1.27—ASTM D792
Mold Shrinkage (flow, 3.2 mm) ᵍ ¹¹0.3%SABIC method
Mold Shrinkage (xflow, 3.2 mm) ᵍ ¹¹0.5%SABIC method
Melt Flow Rate (at 300°C, 1.2 kgf) ¹¹29g/10 minASTM D1238

Table 3 of 7

5 rows
CharacteristicValueUnitMethod
Heat Deflection Temperature (at 0.45 MPa, 3.2 mm) ¹¹1.25E+02°CASTM D648
Heat Deflection Temperature (at 1.82 MPa, 3.2 mm) ¹¹119°CASTM D648
Relative Temperature Index (Electrical) ᵖ ¹¹80°CUL 746B
Relative Temperature Index (Mechanical with impact) ᵖ ¹¹80°CUL 746B
Relative Temperature Index (Mechanical without impact) ᵖ ¹¹80°CUL 746B

Table 4 of 7

6 rows
CharacteristicValueMethod
Dielectric Constant (at 1.1 GHz) ¹¹3.05SABIC method
Dielectric Constant (at 1.9 GHz) ¹¹3.05SABIC method
Dielectric Constant (at 5 GHz) ¹¹3.03SABIC method
Dissipation Factor (at 1.1 GHz) ¹¹0.014SABIC method
Dissipation Factor (at 1.9 GHz) ¹¹0.013SABIC method
Dissipation Factor (at 5 GHz) ¹¹0.011SABIC method

Table 5 of 7

2 rows
CharacteristicValueUnitMethod
Izod Impact (Unnotched, at 23°C) ¹¹700J/mASTM D4812
Izod Impact (Notched, at 23°C) ¹¹170J/mASTM D256

Table 6 of 7

8 rows
CharacteristicValueUnit
Drying Temperature ⁷1.10E+02°C
Drying Time ⁷3 - 4Hrs
Melt Temperature ⁷270 - 295°C
Nozzle Temperature ⁷270 - 295°C
Front - Zone 3 Temperature ⁷270 - 295°C
Middle - Zone 2 Temperature ⁷270 - 295°C
Rear - Zone 1 Temperature ⁷270 - 295°C
Mold Temperature ⁷100 - 120°C

Table 7 of 7

1 row
CharacteristicValueUnitMethod
UL Recognized (94HB Flame Class Rating) ᵖ0.5mmUL 94

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