LNP™ THERMOCOMP™ Compound LF002EXD-WT02005

Chemical Family: Polyether Ether Ketone (PEEK)

LNP THERMOCOMP LF002EXD compound is based on Polyetheretherketone (PEEK) resin containing 10% glass fiber. Added features of this grade include: Custom Color, Easy Molding.

Product families

Applications

Consumer Goods — Appliances & Electronics

Industrial — Chemical & Industrial Manufacturing

Equipment & Parts

Electrical & Electronics — Devices & Assemblies

Consumer Electronics
Displays
Industrial Automation

Electrical & Electronics — Parts & Components

Connectors
Housings & Enclosures
Semiconductor Manufacturing
Switches & Relays

Product Families

Plastics — Engineering & Specialty Polymers

High Performance Thermoplastics

Other characteristics

Brand: LNP™ THERMOCOMP™ Compound
Polymer Name: Polyetheretherketone (PEEK)
Fillers Included: Glass Fiber
Flexural Modulus: 7700.0 - 7700.0 MPa
Processing Methods: Injection Molding
Note: ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
Color: Custom
Markets: Consumer Goods
Electrical & Electronics
Industrial
Technology: Plastics
Material Features: Cost Effective
Easy To Mold
Good Moldability
Good Processability
High Stiffness
High Temperature Resistance
Very Good Heat Resistance
Country Availability: Canada
China (Mainland)
Mexico
USA
Plastics and Elastomers End Uses: Appliances
Cell Phones
Commercial Appliance
Computer Components
Consumer Applications
Displays
Electrical Components
Electrical Enclosure
Plastics and Elastomers Functions: Resin
Plastics and Elastomers Processing Methods: Injection Molding

Technical data

Table 1 of 5

8 rows

Characteristic	Value	Unit	Method
Density ¹¹	1.86	g/cm³	ISO 1183
Melt Volume Rate (at 400°C, 10.0 kg) ¹¹	50	cm³/10 min	ISO 1133
Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹	0.5 - 0.6	%	ISO 294
Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹	0.5 - 0.6	%	ISO 294
Moisture Absorption (at 23°C, 50% RH) ¹¹	0.1 - 0.2	%	ISO 62
Water Absorption (at 23°C, saturated) ¹¹	0.2 - 0.23	%	ISO 62-1
Moisture Absorption (at 23°C, 50% RH, 24hrs) ¹¹	max. 0.1	%	ASTM D570
Water Absorption (at 23°C, 24hrs) ¹¹	0.1	%	ASTM D570

Table 2 of 5

10 rows

Characteristic	Value	Unit	Method
Tensile Stress (Break, 5 mm/min) ¹¹	97	MPa	ISO 527
Tensile Strain (Break, 5 mm/min) ¹¹	2	%	ISO 527
Tensile Modulus (at 1 mm/min) ¹¹	8700	MPa	ISO 527
Flexural Strength (at 2 mm/min) ¹¹	169	MPa	ISO 178
Flexural Modulus (at 2 mm/min) ¹¹	7700	MPa	ISO 178
Tensile Stress (Break, Type I, 5 mm/min) ¹¹	99	MPa	ASTM D638
Tensile Strain (Break, Type I, 5 mm/min) ¹¹	2.5	%	ASTM D638
Tensile Modulus (at 5 mm/min) ¹¹	8700	MPa	ASTM D638
Flexural Stress (Break, 1.3 mm/min, 50 mm span) ¹¹	161	MPa	ASTM D790
Flexural Modulus (at 1.3 mm/min, 50 mm span) ¹¹	7600	MPa	ASTM D790

Table 3 of 5

6 rows

Characteristic	Value	Unit	Method
Heat Deflection Temperature/Bf (at 0.45 Mpa, Flatw 80104, sp=64mm) ¹¹	min. 300	°C	ISO 75/Bf
Heat Deflection Temperature (at 1.8 MPa, 3.2 mm, Unannealed) ¹¹	190	°C	ASTM D648
Vicat Softening Temperature (Rate B/50) ¹¹	min. 300	°C	ISO 306
Vicat Softening Temperature (Rate B/120) ¹¹	min. 300	°C	ISO 306
Coefficient of Thermal Expansion (at 23°C to 60°C, flow) ¹¹	0.00003	1/°C	ISO 11359-2
Coefficient of Thermal Expansion (at 23°C to 60°C, xflow) ¹¹	0.000041	1/°C	ISO 11359-2

Table 4 of 5