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LNP™ THERMOCOMP™ Compound EF006ER
- Chemical Family
- Polyetherimide (PEI)Polyimides (PI)
LNP THERMOCOMP EF006ER compound is based on Polyetherimide (PEI) resin containing 30% glass fiber. Added features of this grade include: Easy Molding, Mold Release.
Product families
Applications
Applications
- Consumer Goods — Appliances & Electronics
- Consumer Goods — Lawn & Garden
- Consumer Goods — Sports & Recreation
Building & Construction — Decorative Materials & Finishes
- Artificial Turf
Electrical & Electronics — Devices & Assemblies
- Consumer Electronics
- Displays
Printing & Packaging — Packaging
- Non-Food Consumer Packaging
Personal Care — Packaging & Accessories
- Applicators & Accessories
Electrical & Electronics — Parts & Components
- Connectors
- Housings & Enclosures
- Switches & Relays
Automotive & Transportation — Transportation
- Aerospace & Aviation
Product Families
Plastics — Engineering & Specialty Polymers
- High Performance Thermoplastics
Other characteristics
- Brand
- LNP™ THERMOCOMP™ Compound
- Polymer Name
- Polyether Imide (PEI)
- Fillers Included
- Glass Fiber
- Flexural Modulus
- 9340.0 - 9340.0 MPa
- Additives Included
- Mold Release Agent
- Processing Methods
- Injection Molding
- Note
ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
- Markets
- Automotive & Transportation
- Building & Construction
- Consumer Goods
- Electrical & Electronics
- Personal Care
- Printing & Packaging
- Technology
- Plastics
- Material Features
- Cost Effective
- Easy To Mold
- Good Mold Release
- Good Moldability
- Good Processability
- High Stiffness
- High Temperature Resistance
- Very Good Heat Resistance
- Country Availability
- Canada
- China (Mainland)
- Mexico
- USA
- Plastics and Elastomers End Uses
- Aerospace Applications
- Aircraft Exteriors
- Appliances
- Automotive Applications
- Building Materials
- Cell Phones
- Commercial Appliance
- Computer Components
- Plastics and Elastomers Functions
- Resin
- Plastics and Elastomers Processing Methods
- Injection Molding
Technical data
Table 1 of 5
10 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Stress (Break) ¹¹ | 164 | MPa | ASTM D638 |
| Tensile Stress (Break) ¹¹ | 154 | MPa | ISO 527 |
| Tensile Strain (Break) ¹¹ | 3 | % | ASTM D638 |
| Tensile Strain (Break) ¹¹ | 3 | % | ISO 527 |
| Tensile Modulus (at 5 mm/min) ¹¹ | 10100 | MPa | ASTM D638 |
| Flexural Stress ¹¹ | 241 | MPa | ASTM D790 |
| Flexural Stress ¹¹ | 235 | MPa | ISO 178 |
| Flexural Modulus ¹¹ | 9700 | MPa | ISO 178 |
| Flexural Modulus ¹¹ | 9340 | MPa | ASTM D790 |
| Tensile Modulus (at 1 mm/min) ¹¹ | 10200 | MPa | ISO 527 |
Table 2 of 5
7 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Density ¹¹ | 1.52 | g/cm³ | ISO 1183 |
| Density ¹¹ | 1.52 | g/cm³ | ASTM D792 |
| Moisture Absorption (at 23°C, 50% RH, 24hrs) ¹¹ | 0.1 | % | ASTM D570 |
| Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹ | 0.1 - 0.3 | % | ASTM D955 |
| Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹ | 0.23 | % | ISO 294 |
| Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹ | 0.4 - 0.6 | % | ASTM D955 |
| Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹ | 0.52 | % | ISO 294 |
Table 3 of 5
8 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Heat Deflection Temperature (at 0.45 MPa, 3.2 mm, Unannealed) ¹¹ | 203 | °C | ASTM D648 |
| Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹ | 195 | °C | ASTM D648 |
| Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹ | 0.0000234 | 1/°C | ASTM E831 |
| Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹ | 0.000023 | 1/°C | ISO 11359-2 |
| Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹ | 0.0000414 | 1/°C | ASTM E831 |
| Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹ | 0.000042 | 1/°C | ISO 11359-2 |
| Heat Deflection Temperature/Bf (at 0.45 Mpa, Flatw 80*10*4, sp=64mm) ¹¹ | 207 | °C | ISO 75/Bf |
| Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80*10*4, sp=64mm) ¹¹ | 201 | °C | ISO 75/Af |
Table 4 of 5
4 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Izod Impact (Unnotched, at 23°C) ¹¹ | 646 | J/m | ASTM D4812 |
| Izod Impact (Notched, at 23°C) ¹¹ | 90 | J/m | ASTM D256 |
| Izod Impact (Unnotched, 80*10*4, at 23°C) ¹¹ | 39 | kJ/m² | ISO 180/1U |
| Izod Impact (Notched, 80*10*4, at 23°C) ¹¹ | 9 | kJ/m² | ISO 180/1A |
Table 5 of 5
12 rows| Characteristic | Value | Unit |
|---|---|---|
| Drying Temperature ⁷ | 150 | °C |
| Drying Time ⁷ | 4 - 6 | Hrs |
| Maximum Moisture Content ⁷ | 0.02 | % |
| Melt Temperature ⁷ | 360 - 400 | °C |
| Rear - Zone 1 Temperature ⁷ | 360 - 380 | °C |
| Middle - Zone 2 Temperature ⁷ | 370 - 390 | °C |
| Front - Zone 3 Temperature ⁷ | 380 - 400 | °C |
| Nozzle Temperature ⁷ | 390 - 400 | °C |
| Mold Temperature ⁷ | 140 - 180 | °C |
| Back Pressure ⁷ | 0.3 - 0.7 | MPa |
| Screw Speed (Circumferential speed) ⁷ | 0.2 - 0.3 | m/s |
| Vent Depth ⁷ | 0.025 - 0.076 | mm |
