LNP™ THERMOCOMP™ Compound DX13354X
- Chemical Family
- Polycarbonate (PC)
SABIC's Specialties Business LNP™ THERMOCOMP™ DX13354X compound is based on Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: Improved Plating Surface and Mechanical Performance suitable for Laser Direct Structuring (LDS) applications, Improved Impact, Good Surface Esthetics, Wide Processing Window and Colorable.
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Interior
- Consumer Electronics
- Displays
- Non-Food Consumer Packaging
- Applicators & Accessories
- Connectors
- Housings & Enclosures
- Switches & Relays
Product Families
- High Performance Thermoplastics
- Polycarbonates
Other characteristics
- Brand
- LNP™ THERMOCOMP™ Compound
- Polymer Name
- Polycarbonate (PC)
- Fillers Included
- Glass Fiber
- Flexural Modulus
- 6400.0 - 6400.0 MPa
- Additives Included
Heat Stabilizer, Impact Modifier, Metal Deactivator, Mold Release Agent; Heat Stabilizer; Impact Modifier; Metal Deactivator; Mold Release Agent
- Processing Methods
- Injection Molding, Laser Sintering (SLS)
- Note
ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
- Color
- White
- Markets
- Automotive & Transportation
- Consumer Goods
- Electrical & Electronics
- Personal Care
- Printing & Packaging
- Technology
- Plastics
- Material Features
- Cost Effective
- Excellent Aesthetics
- Excellent Dielectric Properties
- Good Aesthetics
- Good Colorability
- Good Mold Release
- Good Surface Appearance
- Heat Stabilized
- Country Availability
- Canada
- China (Mainland)
- Mexico
- USA
- Plastics and Elastomers End Uses
- Automotive Applications
- Automotive Interior Parts
- Cell Phones
- Computer Components
- Consumer Applications
- Containers
- Displays
- Electrical Components
- Plastics and Elastomers Functions
- Resin
- Plastics and Elastomers Processing Methods
- Injection Molding
- Laser Sintering (SLS)
Technical data
Table 1 of 6
10 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Stress (Break, Type I, 5 mm/min) ¹¹ | 90 | MPa | ASTM D638 |
| Tensile Strain (Break, Type I, 5 mm/min) ¹¹ | 2.2 | % | ASTM D638 |
| Flexural Strength (at 1.3 mm/min, 50 mm span) ¹¹ | 130 | MPa | ASTM D790 |
| Tensile Modulus (at 5 mm/min) ¹¹ | 6900 | MPa | ASTM D638 |
| Flexural Modulus (at 1.3 mm/min, 50 mm span) ¹¹ | 6300 | MPa | ASTM D790 |
| Tensile Stress (Break, 5 mm/min) ¹¹ | 90 | MPa | ISO 527 |
| Tensile Strain (Break, 5 mm/min) ¹¹ | 2.1 | % | ISO 527 |
| Tensile Modulus (at 1 mm/min) ¹¹ | 6600 | MPa | ISO 527 |
| Flexural Strength (at 2 mm/min) ¹¹ | 130 | MPa | ISO 178 |
| Flexural Modulus (at 2 mm/min) ¹¹ | 6400 | MPa | ISO 178 |
Table 2 of 6
7 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Specific Gravity ¹¹ | 1.43 | — | ASTM D792 |
| Mold Shrinkage (flow, 3.2 mm) ᵍ ¹¹ | 0.1 - 0.3 | % | SABIC method |
| Mold Shrinkage (xflow, 3.2 mm) ᵍ ¹¹ | 0.3 - 0.5 | % | SABIC method |
| Melt Flow Rate (at 280°C, 2.16 kgf) ¹¹ | 12 | g/10 min | ASTM D1238 |
| Melt Flow Rate (at 300°C, 1.2 kgf) ¹¹ | 16 | g/10 min | ASTM D1238 |
| Melt Volume Rate (at 300°C, 1.2 kg) ¹¹ | 13 | cm³/10 min | ASTM D1238 |
| Density ¹¹ | 1.43 | g/cm³ | ISO 1183 |
Table 3 of 6
8 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Heat Deflection Temperature (at 0.45 MPa, 3.2 mm) ¹¹ | 124 | °C | ASTM D648 |
| Heat Deflection Temperature (at 1.82 MPa, 3.2 mm) ¹¹ | 120 | °C | ASTM D648 |
| Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹ | 0.000019 | 1/°C | ISO 11359-2 |
| Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹ | 0.000022 | 1/°C | ASTM E831 |
| Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹ | 0.000063 | 1/°C | ASTM E831 |
| Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹ | 0.000061 | 1/°C | ISO 11359-2 |
| Heat Deflection Temperature/Bf (at 0.45 Mpa, Flatw 80*10*4, sp=64mm) ¹¹ | 126 | °C | ISO 75/Bf |
| Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80*10*4, sp=64mm) ¹¹ | 122 | °C | ISO 75/Af |
Table 4 of 6
6 rows| Characteristic | Value | Method |
|---|---|---|
| Dielectric Constant (at 1.1 GHz) ¹¹ | 3.47 | SABIC method |
| Dielectric Constant (at 1.9 GHz) ¹¹ | 3.45 | SABIC method |
| Dielectric Constant (at 5 GHz) ¹¹ | 3.45 | SABIC method |
| Dissipation Factor (at 1.1 GHz) ¹¹ | 0.013 | SABIC method |
| Dissipation Factor (at 1.9 GHz) ¹¹ | 0.012 | SABIC method |
| Dissipation Factor (at 5 GHz) ¹¹ | 0.011 | SABIC method |
Table 5 of 6
6 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Izod Impact (Unnotched, at 23°C) ¹¹ | 500 | J/m | ASTM D4812 |
| Izod Impact (Notched, at 23°C) ¹¹ | 90 | J/m | ASTM D256 |
| Izod Impact (Unnotched, 80*10*4, at 23°C) ¹¹ | 32 | kJ/m² | ISO 180/1U |
| Izod Impact (Notched, 80*10*4, at 23°C) ¹¹ | 9 | kJ/m² | ISO 180/1A |
| Charpy Impact (Unnotched, at 23°C) ¹¹ | 36 | kJ/m² | ISO 179/2C |
| Charpy Impact (Notched, at 23°C) ¹¹ | 9 | kJ/m² | ISO 179/2C |
Table 6 of 6
8 rows| Characteristic | Value | Unit |
|---|---|---|
| Drying Temperature ⁷ | 110 | °C |
| Drying Time ⁷ | 3 - 4 | Hrs |
| Melt Temperature ⁷ | 270 - 295 | °C |
| Nozzle Temperature ⁷ | 270 - 295 | °C |
| Front - Zone 3 Temperature ⁷ | 270 - 295 | °C |
| Middle - Zone 2 Temperature ⁷ | 270 - 295 | °C |
| Rear - Zone 1 Temperature ⁷ | 270 - 295 | °C |
| Mold Temperature ⁷ | 100 - 120 | °C |
