LNP™ THERMOCOMP™ Compound EFB26ER
- Chemical Family
- Polyetherimide (PEI)Polyimides (PI)
SABIC's Specialties Business LNP™ THERMOCOMP™ EFB26ER compound is based on Polyetherimide (PEI) resin containing 30% glass fiber, 10% glass bead. Added features of this grade include: Easy Molding, Mold Release.
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Consumer Goods — Lawn & Garden
- Artificial Turf
- Consumer Electronics
- Displays
- Non-Food Consumer Packaging
- Applicators & Accessories
- Connectors
- Housings & Enclosures
- Switches & Relays
Product Families
- High Performance Thermoplastics
Other characteristics
- Brand
- LNP™ THERMOCOMP™ Compound
- Polymer Name
- Polyether Imide (PEI)
- Fillers Included
- Glass Bead, Glass Fiber, PTFE
- Glass Bead
- Glass Fiber
- PTFE
- Flexural Modulus
- 10400.0 - 10400.0 MPa
- Additives Included
- Mold Release Agent
- Processing Methods
- Injection Molding
- Note
ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
- Markets
- Building & Construction
- Consumer Goods
- Electrical & Electronics
- Personal Care
- Printing & Packaging
- Technology
- Plastics
- Material Features
- Cost Effective
- Easy To Mold
- Good Mold Release
- Good Moldability
- Good Processability
- High Stiffness
- High Temperature Resistance
- Low Warpage
- Country Availability
- Canada
- China (Mainland)
- Mexico
- USA
- Plastics and Elastomers End Uses
- Building Materials
- Cell Phones
- Computer Components
- Consumer Applications
- Containers
- Displays
- Doors
- Electrical Components
- Plastics and Elastomers Functions
- Resin
- Plastics and Elastomers Processing Methods
- Injection Molding
Technical data
Table 1 of 5
9 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Stress (Yield, 5 mm/min) ¹¹ | 156 | MPa | ISO 527 |
| Tensile Stress (Break, 5 mm/min) ¹¹ | 153 | MPa | ISO 527 |
| Tensile Strain (Yield, 5 mm/min) ¹¹ | 1.5 | % | ISO 527 |
| Tensile Strain (Break, 5 mm/min) ¹¹ | 1.5 | % | ISO 527 |
| Tensile Modulus (at 1 mm/min) ¹¹ | 9000 | MPa | ISO 527 |
| Flexural Stress (Yield, at 2 mm/min) ¹¹ | 190 | MPa | ISO 178 |
| Flexural Stress (Break, 2 mm/min) ¹¹ | 190 | MPa | ISO 178 |
| Flexural Strain (Break, at 2 mm/min) ¹¹ | 1.9 | % | ISO 178 |
| Flexural Modulus (at 2 mm/min) ¹¹ | 10400 | MPa | ISO 178 |
Table 2 of 5
3 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Mold Shrinkage (flow) ᵍ ¹¹ | 0.2 | % | SABIC method |
| Density ¹¹ | 1.61 | g/cm³ | ISO 1183 |
| Water Absorption (at 23°C, 24hrs) ¹¹ | 0.27 | % | ISO 62-1 |
Table 3 of 5
3 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Coefficient of Thermal Expansion (at 23°C to 60°C, flow) ¹¹ | 0.000015 | 1/°C | ISO 11359-2 |
| Coefficient of Thermal Expansion (at 23°C to 60°C, xflow) ¹¹ | 0.000035 | 1/°C | ISO 11359-2 |
| Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80*10*4, sp=64mm) ¹¹ | 206 | °C | ISO 75/Af |
Table 4 of 5
2 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Izod Impact (Unnotched, 80*10*4, at 23°C) ¹¹ | 25 | kJ/m² | ISO 180/1U |
| Izod Impact (Notched, 80*10*4, at 23°C) ¹¹ | 6 | kJ/m² | ISO 180/1A |
Table 5 of 5
12 rows| Characteristic | Value | Unit |
|---|---|---|
| Drying Temperature ⁷ | 150 | °C |
| Drying Time ⁷ | 4 - 6 | Hrs |
| Maximum Moisture Content ⁷ | 0.02 | % |
| Melt Temperature ⁷ | 360 - 365 | °C |
| Rear - Zone 1 Temperature ⁷ | 345 - 355 | °C |
| Middle - Zone 2 Temperature ⁷ | 355 - 365 | °C |
| Front - Zone 3 Temperature ⁷ | 365 - 375 | °C |
| Nozzle Temperature ⁷ | 390 - 400 | °C |
| Mold Temperature ⁷ | 120 - 150 | °C |
| Back Pressure ⁷ | 0.3 - 0.7 | MPa |
| Screw Speed (Circumferential speed) ⁷ | 0.2 - 0.3 | m/s |
| Vent Depth ⁷ | 0.025 - 0.076 | mm |
