LNP™ THERMOCOMP™ Compound Z1C00VI
SABIC's Specialties Business LNP THERMOCOMP Z1C00VI compound is based on Polyphenylene Ether / Polystyrene (PPE/PS) blend containing proprietary fillers. Added features of this grade include: Ultra-Low Dielectric Constant and Loss Tangent for Laser Direct Structuring (LDS), High HDT, Low Warpage, Excellent Surface Finishing and Chemical Resistant. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Interior
- Consumer Electronics
- Displays
- Non-Food Consumer Packaging
- Applicators & Accessories
- Connectors
- Housings & Enclosures
- Switches & Relays
Product Families
- Blends & Alloys
Other characteristics
- Brand
- LNP™ THERMOCOMP™ Compound
- Density
- 1110.0 - 1110.0 kg/m³
- Polymer Name
- PPO/PS Alloy
- Flexural Modulus
- 2800.0 - 2800.0 MPa
- Processing Methods
- Injection Molding, Laser Sintering (SLS)
- Note
ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
- Markets
- Automotive & Transportation
- Consumer Goods
- Electrical & Electronics
- Personal Care
- Printing & Packaging
- Technology
- Plastics
- Labeling Claims
- No Added PFAS
- Fillers Included
- Titanium Dioxide
- Additives Included
- Heat Stabilizer
- Impact Modifier
- Material Features
- Chemical Resistant
- Cost Effective
- Excellent Dielectric Properties
- Heat Stabilized
- High Impact Resistance
- High Temperature Resistance
- Impact Modified
- Low Warpage
- Country Availability
- Canada
- China (Mainland)
- Mexico
- USA
- Plastics and Elastomers End Uses
- Automotive Interior Parts
- Cell Phones
- Computer Components
- Consumer Applications
- Containers
- Displays
- Electrical Components
- Electrical Enclosure
- Plastics and Elastomers Functions
- Resin
- Plastics and Elastomers Processing Methods
- Injection Molding
- Laser Sintering (SLS)
Technical data
Table 1 of 6
14 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Stress (Yield, Type I, 50 mm/min) ¹¹ | 70 | MPa | ASTM D638 |
| Tensile Stress (Break, Type I, 50 mm/min) ¹¹ | 52 | MPa | ASTM D638 |
| Tensile Strain (Yield, Type I, 50 mm/min) ¹¹ | 4.5 | % | ASTM D638 |
| Tensile Strain (Break, Type I, 50 mm/min) ¹¹ | 8 | % | ASTM D638 |
| Tensile Modulus (at 50 mm/min) ¹¹ | 2700 | MPa | ASTM D638 |
| Flexural Stress (Break, 1.3 mm/min, 50 mm span) ¹¹ | 110 | MPa | ASTM D790 |
| Flexural Modulus (at 1.3 mm/min, 50 mm span) ¹¹ | 2700 | MPa | ASTM D790 |
| Tensile Stress (Yield, 50 mm/min) ¹¹ | 70 | MPa | ISO 527 |
| Tensile Stress (Break, 50 mm/min) ¹¹ | 55 | MPa | ISO 527 |
| Tensile Strain (Yield, 50 mm/min) ¹¹ | 4.5 | % | ISO 527 |
| Tensile Strain (Break, 50 mm/min) ¹¹ | 9 | % | ISO 527 |
| Tensile Modulus (at 1 mm/min) ¹¹ | 2800 | MPa | ISO 527 |
Table 2 of 6
2 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Density ¹¹ | 1.11 | g/cm³ | ISO 1183 |
| Mold Shrinkage (flow) ᵍ ¹¹ | 0.5 - 0.7 | % | SABIC method |
Table 3 of 6
1 row| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Heat Deflection Temperature/Bf (at 0.45 Mpa, Flatw 80*10*4, sp=64mm) ¹¹ | 155 | °C | ISO 75/Bf |
Table 4 of 6
6 rows| Characteristic | Value | Method |
|---|---|---|
| Dielectric Constant (at 1.1 GHz) ¹¹ | 2.65 | SABIC method |
| Dielectric Constant (at 1.9 GHz) ¹¹ | 2.65 | SABIC method |
| Dielectric Constant (at 10 GHz) ¹¹ | 2.65 | SABIC method |
| Dissipation Factor (at 1.1 GHz) ¹¹ | 0.0012 | SABIC method |
| Dissipation Factor (at 1.9 GHz) ¹¹ | 0.0014 | SABIC method |
| Dissipation Factor (at 10 GHz) ¹¹ | 0.002 | SABIC method |
Table 5 of 6
4 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Izod Impact (Notched, at 23°C) ¹¹ | 40 | J/m | ASTM D256 |
| Izod Impact (Unnotched, at 23°C) ¹¹ | 600 | J/m | ASTM D4812 |
| Izod Impact (Notched, 80*10*4, at 23°C) ¹¹ | 6 | kJ/m² | ISO 180/1A |
| Izod Impact (Unnotched, 80*10*4, at 23°C) ¹¹ | 50 | kJ/m² | ISO 180/1U |
Table 6 of 6
10 rows| Characteristic | Value | Unit |
|---|---|---|
| Drying Temperature ⁷ | 120 | °C |
| Drying Time ⁷ | 3 - 5 | Hrs |
| Melt Temperature ⁷ | 270 - 320 | °C |
| Nozzle Temperature ⁷ | 280 - 320 | °C |
| Front - Zone 3 Temperature ⁷ | 280 - 310 | °C |
| Middle - Zone 2 Temperature ⁷ | 270 - 300 | °C |
| Rear - Zone 1 Temperature ⁷ | 260 - 290 | °C |
| Mold Temperature ⁷ | 100 - 140 | °C |
| Back Pressure ⁷ | 10 | MPa |
| Screw Speed ⁷ | 100 | rpm |
