LNP™ THERMOCOMP™ Compound DX05477

Chemical Family: Polycarbonate (PC)

SABIC's Specialties Business LNP™ THERMOCOMP™ DX05477 compound is based on Polycarbonate (PC) resin containing 10% glass fiber. Added features of this grade include: Easy Molding, Mold Release, Flame Retardant.

Product families

Applications

Consumer Goods — Appliances & Electronics
Consumer Goods — Lawn & Garden

Building & Construction — Decorative Materials & Finishes

Artificial Turf

Electrical & Electronics — Devices & Assemblies

Consumer Electronics
Displays

Printing & Packaging — Packaging

Non-Food Consumer Packaging

Personal Care — Packaging & Accessories

Applicators & Accessories

Electrical & Electronics — Parts & Components

Connectors
Housings & Enclosures
Switches & Relays

Product Families

Plastics — Engineering & Specialty Polymers

Polycarbonates

Other characteristics

Brand: LNP™ THERMOCOMP™ Compound
Polymer Name: Polycarbonate (PC)
Fillers Included: Glass Fiber
Additives Included: Flame Retardant, Mold Release Agent
Flame Retardant
Mold Release Agent
Processing Methods: Injection Molding
Note: ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
Markets: Building & Construction
Consumer Goods
Electrical & Electronics
Personal Care
Printing & Packaging
Technology: Plastics
Material Features: Cost Effective
Easy To Mold
Flame Retardant
Good Mold Release
Good Moldability
Good Processability
High Modulus
High Stiffness
Country Availability: Canada
China (Mainland)
Mexico
USA
Plastics and Elastomers End Uses: Building Materials
Cell Phones
Computer Components
Consumer Applications
Containers
Displays
Doors
Electrical Components
Plastics and Elastomers Functions: Resin
Plastics and Elastomers Processing Methods: Injection Molding

Technical data

Table 1 of 5

14 rows

Characteristic	Value	Unit	Method
Tensile Stress (Yield) ¹¹	62	MPa	ASTM D638
Tensile Stress (Yield) ¹¹	70	MPa	ISO 527
Tensile Stress (Break) ¹¹	57	MPa	ASTM D638
Tensile Stress (Break) ¹¹	69	MPa	ISO 527
Tensile Strain (Yield) ¹¹	3.8	%	ISO 527
Tensile Strain (Yield) ¹¹	4.2	%	ASTM D638
Tensile Strain (Break) ¹¹	7.4	%	ASTM D638
Tensile Strain (Break) ¹¹	4.4	%	ISO 527
Tensile Modulus (at 50 mm/min) ¹¹	2820	MPa	ASTM D638
Flexural Stress ¹¹	120	MPa	ISO 178
Flexural Stress ¹¹	119	MPa	ASTM D790
Flexural Modulus ¹¹	3440	MPa	ASTM D790

Table 2 of 5

6 rows

Characteristic	Value	Unit	Method
Density ¹¹	1.26	g/cm³	ISO 1183
Density ¹¹	1.271	g/cm³	ASTM D792
Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹	0.5	%	ASTM D955
Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹	0.5	%	ISO 294
Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹	0.6	%	ASTM D955
Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹	0.59	%	ISO 294

Table 3 of 5

3 rows

Characteristic	Value	Unit	Method
Heat Deflection Temperature (at 0.45 MPa, 3.2 mm, Unannealed) ¹¹	145	°C	ASTM D648
Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹	138	°C	ASTM D648
Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80104, sp=64mm) ¹¹	136	°C	ISO 75/Af

Table 4 of 5