LNP™ KONDUIT™ Compound PX10323H

Chemical Family: Polyamides

LNP KONDUIT PX10323H compound is based on Nylon 6 resin containing glass fiber. Added features of this grade include: Thermally Conductive and Healthcare.

Product families

Applications

Electrical & Electronics — Devices & Assemblies

Lighting

Healthcare & Pharma — Medical

Medical Devices & Assemblies
Surgical Instruments & Trays

Printing & Packaging — Packaging

Healthcare Packaging
Industrial & Transport Packaging

Product Families

Plastics — Engineering & Specialty Polymers

Polyamides

Other characteristics

Brand: LNP™ KONDUIT™ Compound
Polymer Name: Polyamide 6 (PA 6)
Fillers Included: Glass Fiber, Graphite
Glass Fiber
Graphite
Flexural Modulus: 14300.0 - 14300.0 MPa
Additives Included: Heat Stabilizer, Mold Release Agent
Heat Stabilizer
Mold Release Agent
Processing Methods: Injection Molding
Note: ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.; ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.; ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
Markets: Electrical & Electronics
Healthcare & Pharma
Printing & Packaging
Technology: Plastics
Material Features: Good Mold Release
Heat Stabilized
Thermally Conductive
Plastics and Elastomers End Uses: LED Lighting
Medical Devices
Medical Packaging
Medical/Healthcare Applications
Pharmaceutical Packaging
Surgical Devices
Plastics and Elastomers Functions: Resin
Plastics and Elastomers Processing Methods: Injection Molding

Technical data

Table 1 of 7

13 rows

Characteristic	Value	Unit	Method
Tensile Stress (Break, Type I, 5 mm/min) ¹¹	70	MPa	ASTM D638
Tensile Strain (Break, Type I, 5 mm/min) ¹¹	0.9	%	ASTM D638
Tensile Modulus (at 5 mm/min) ¹¹	13700	MPa	ASTM D638
Tensile Modulus (at 50 mm/min) ¹¹	10750	MPa	ASTM D638
Flexural Stress (Break, 1.3 mm/min, 50 mm span) ¹¹	95	MPa	ASTM D790
Flexural Stress (Yield, 1.3 mm/min, 50 mm span) ¹¹	96	MPa	ASTM D790
Flexural Modulus (at 1.3 mm/min, 50 mm span) ¹¹	14200	MPa	ASTM D790
Tensile Stress (Break, 5 mm/min) ¹¹	73	MPa	ISO 527
Tensile Strain (Break, 5 mm/min) ¹¹	0.8	%	ISO 527
Tensile Modulus (at 1 mm/min) ¹¹	14000	MPa	ISO 527
Flexural Stress (Break, 2 mm/min) ¹¹	96	MPa	ISO 178
Flexural Modulus (at 2 mm/min) ¹¹	14300	MPa	ISO 178

Table 2 of 7

5 rows

Characteristic	Value	Unit	Method
Density ¹¹	1.61	g/cm³	ASTM D792
Density ¹¹	1.61	g/cm³	ISO 1183
Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹	0.2	%	ASTM D955
Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹	0.22	%	ASTM D955
Moisture Absorption (at 23°C, 50% RH) ¹¹	0.04	%	ISO 62

Table 3 of 7

17 rows

Characteristic	Value	Unit	Method
Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹	186	°C	ASTM D648
Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹	0.0000161	1/°C	ASTM E831
Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹	0.0000356	1/°C	ASTM E831
Heat Deflection Temperature (at 1.82 MPa, 6.4 mm, Unannealed) ¹¹	204	°C	ASTM D648
Coefficient of Thermal Expansion (at 40°C to 120°C, flow) ¹¹	0.0000124	1/°C	ASTM E831
Thermal Conductivity (through-plane, 60603mm plaque) ¹¹	1.5	W/m-K	ISO 22007-2
Coefficient of Thermal Expansion (at 40°C to 120°C, xflow) ¹¹	0.0000727	1/°C	ASTM E831
Thermal Conductivity (in-plane, 60603mm plaque) ¹¹	18	W/m-K	ISO 22007-2
Thermal Conductivity (through-plane, 10103mm sample) ¹¹	3.5	W/m-K	ASTM E1461-07
Thermal Conductivity (in-plane, 25*0.4mm disc) ¹¹	15	W/m-K	ASTM E1461-07
Coefficient of Thermal Expansion (at -30°C to 80°C, flow) ¹¹	0.000014	1/°C	ISO 11359-2
Coefficient of Thermal Expansion (at -30°C to 80°C, xflow) ¹¹	0.0000395	1/°C	ISO 11359-2

Table 4 of 7

1 row

Characteristic	Value	Unit	Method
Surface Resistivity ¹¹	1050000	Ω	ASTM D257

Table 5 of 7

4 rows

Characteristic	Value	Unit	Method
Izod Impact (Unnotched, at 23°C) ¹¹	73	J/m	ASTM D4812
Izod Impact (Notched, at 23°C) ¹¹	30	J/m	ASTM D256
Izod Impact (Unnotched, 80104, at 23°C) ¹¹	6	kJ/m²	ISO 180/1U
Izod Impact (Notched, 80104, at 23°C) ¹¹	3	kJ/m²	ISO 180/1A

Table 6 of 7

20 rows

Characteristic	Value	Unit
Drying Temperature ⁷	80 - 90	°C
Drying Temperature ⁷	80	°C
Drying Time ⁷	3 - 4	Hrs
Drying Time ⁷	4	Hrs
Maximum Moisture Content ⁷	0.15 - 0.25	%
Melt Temperature ⁷	270 - 300	°C
Melt Temperature ⁷	270 - 295	°C
Nozzle Temperature ⁷	270 - 300	°C
Front - Zone 3 Temperature ⁷	270 - 290	°C
Front - Zone 3 Temperature ⁷	270 - 300	°C
Middle - Zone 2 Temperature ⁷	270 - 290	°C
Middle - Zone 2 Temperature ⁷	270 - 300	°C

Table 7 of 7