Park Aerospace E-767 108 Glass
- Chemical Family
- Epoxy & Epoxy Derivatives
Park’s E-767 is a versatile, low flow, adhesive grade epoxy resin. When impregnated onfiberglass fabric it provides high bond strength at elevated temperatures while maintaining high electrical integrity.
Product families
Applications
- Printed Circuit Boards (PCBs)
Product Families
- Thermoset Resins
Other characteristics
- Polymer Name
- Epoxy Resins & Compounds
- Reinforcement Material
- Glass Fibers
- Markets
- Electrical & Electronics
- Technology
- Composite Materials
- Product Forms
Typical reinforcements are 1080 and 116 glass cloth Available in solution coated fabrics up to 60 inches wide (1.5 m)
- Material Features
- Good Bonding Strength
- Low Flow
- Benefits and Features
- High Tensile Shear Strength
- Excellent electrical Properties
- High peel strength
- Good thermal properties
- Applications and Qualifications
The prime application of Park's E-767 Epoxy is in bonding metallic surfaces to base materials for printed circuit boards, comparable to G10. It is also an excellent adhesive for metal to metal bonding such as stainless steel or aluminum to itself. Copper and other metallics may be bonded to epoxy, polyester, Kapton®, Mylar® and other such dielectric systems. In addition to controlled flow, the E-767 on fiberglass cloth will maintain a specific bond line thickness. Selection of other fabric carriers will enable the user to vary this bond line thickness according to his or her needs. Other applications have included multilayer, heat sink bonding and overlay.
- Composite Materials Functions
- Resins Binders & Matrix Materials
Technical data
Table 1 of 2
8 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Resin Solids | 60-70% | — | — |
| Roll length (Nominal (38” width) / 230 m (.97m) | 250 | yds | — |
| Copper Bond Peel Strength (1 oz at 70°F) (35 micron at 21°C) | 15 / 2.1 | lbs/in / N/mm | MIL-P-13949 |
| Solder Blister Resistance - (500°F) (260°C) | 20 | seconds | MIL-P-13949 |
| Tensile Shear (77°F) (25°C) (Aluminum to Aluminum) | 4100 psi / 28.3 kPa | — | ASTM D-1002 |
| Tensile Shear (77°F) (25°C) (Steel to Steel) | 4250 psi / 29.3 kPa | — | ASTM D-1002 |
| Tensile Shear (212°F) (100°C) (Aluminum to Aluminum) | 690 psi / 4.8 kPa | — | ASTM D-1002 |
| Tensile Shear (212°F) (100°C) (Steel to Steel) | 2000 psi / 13.8 kPa | — | ASTM D-1002 |
Table 2 of 2
2 rows| Characteristic | Value | Unit |
|---|---|---|
| Resin Flow (340°F, 50 psi) (170°C, 345 k/Pa) | 1-5% | % |
| Gel Time (340°F/170°C) | 10-60 | Seconds |
