TuffBond® 305
- Chemical Family
- Epoxy & Epoxy Derivatives
Hernon Tuffbond® 305 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond® 305 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loud speakers. Tuffbond® 305 is also recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components.
Product families
- Structural Adhesives
Other characteristics
- Brand
- TuffBond
- Cure Method
- Air Dry
- Product Type
Epoxy Adhesive, Reactive Adhesive, Structural Adhesive; Epoxy Adhesive; Reactive Adhesive; Structural Adhesive
- Compatible Substrates & Surfaces
- Ceramic, Metal, Wood
- Markets
- Electrical & Electronics
- Storage
Tuffbond® 305 should be stored in a cool, dry location in unopened containers at a temperature between 45ºF to 85ºF (7ºC to 29ºC) unless otherwise labeled. Optimal storage is at the lower half of this temperature range. To prevent contamination of unused material, do not return any material to its original container.
- Cure
- Air Dry
- Applications
Electrical & Electronics — Other Electrical & Electronics Applications
- Technology
- Ready-to-Use Products
- Benefits
- Fast at room temperature (about 4 minutes).
- Low shrinkage.
- 100% reactive, non-solvent system.
- Easy mixing ratio of resin and hardener.
- No fuming on gelation.
- General Information
This product is not recommended for use in pure oxygen and/or oxygen rich systems and should not be selected as a sealant for chlorine or other strong oxidizing materials. For safe handling information on this product, consult the Safety Data Sheet (SDS).
- Certifications and Compliance
- ISO 9001
- Typical Properties (Uncured)
- 12,000 to 18,000
- Ready to Use Product Features
- Fast Cure
- Solventless
- Compatible Substrates and Surfaces
- Ceramic
- Metal
- Wood
