VESTAMID® L1670
- Chemical Family
- Polyamides
VESTAMID® L1670 is a low-viscosity polyamide 12 compound that has been specifically developed with heat and light stabilization for the extrusion of thin wire insulations and cable jacketings. Coatings made from VESTAMID® L1670 demonstrate a low coefficient of friction, which greatly facilitates the process of laying cables. This compound is well-suited for profile extrusion and wire and cable extrusion processing techniques.
Properties
- Physical Form
- Granules
- Pellets
- Solid
Product families
Applications
- Cooling & Climate
- Equipment & Parts
- Batteries
- Connectors
- Jacketing & Insulation
Product Families
- Polyamides
Other characteristics
- Brand
- VESTAMID
- Polymer Name
- Polyamide 12 (PA 12)
- Flexural Modulus
- 1,350.44 MPa
- Additives Included
Heat Stabilizer, Light Stabilizer, Lubricant (Unspecified), Processing Aid, UV Stabilizer; Heat Stabilizer; Light Stabilizer; Lubricant (Unspecified); Processing Aid; UV Stabilizer
- Color (Properties)
- Natural
- Materials Features
Chemical Resistant, Dimensional Stability, Good Tenacity, Heat Stabilized, Light Stabilized, Low Coefficient of Friction, Low Viscosity, Low Water Absorption, Lubricated, Rodents Resistant, Semi Crystalline, Termites Resistant, UV Stabilized, Unreinforced, Very Good Heat Resistance
- Processing Methods
Cable Extrusion, Extrusion, Injection Molding, Profile Extrusion, Wire Extrusion
- Markets
- Automotive & Transportation
- Electrical & Electronics
- Industrial
- Shelf LIfe
- 2 years
- Flame Rating
- IEC 60695-11-10 HB
- Technology
- Plastics
- Color
- Natural
- Material Features
- Chemical Resistant
- Dimensional Stability
- Good Tenacity
- Heat Stabilized
- Light Stabilized
- Low Coefficient of Friction
- Low Viscosity
- Low Water Absorption
- Attributes
VESTAMID® L1670 coatings exhibit a low coefficient of friction which facilitates the laying of cable.; Switchboard wiring isolated with VESTAMID® L1670 can be soldered with no worry of interference by the plastic resin. The wiring can be soldered without the need to strip the isolating layer.; Jacketing of VESTAMID® L1670 protects buried cables from attack by termites.; This partially crystalline polyamide 12 bases compounds have a very low water absorption. Therefore products produced from VESTAMID® L1670 maintain their dimensions in environments with varying humidity levels, while maintaining a high tenacity, a low coefficient of friction and good chemical resistance.
- Storage Condition
Inside the original and undamaged packaging, the product has a shelf life of at least 2 years when stored in dry rooms at temperatures not exceeding 30°C.
- Packaging Information
VESTAMID® L1670 is supplied as cylindrical granules, ready for processing in moisture-proof packaging.
- Plastics and Elastomers End Uses
- Cable Insulation
- Cable Jacketing
- Connectors
- EV Battery Coolant Pipes
- EV Battery Management System
- Electrical/Electronic Applications
- Industrial Applications
- Wire Jacketing
- Plastics and Elastomers Functions
- Resin
- Plastics and Elastomers Processing Methods
- Cable Extrusion
- Extrusion
- Injection Molding
- Profile Extrusion
- Wire Extrusion
Technical data
Table 1 of 8
26 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Modulus (dry) | 203000 | psi | ISO 527 |
| Tensile Modulus (cond.) | 158000 | psi | ISO 527 |
| Tensile Strength (dry) | 6380 | psi | ISO 527 |
| Tensile Strength (cond.) | 5800 | psi | ISO 527 |
| Yield Stress (dry) | 6380 | psi | ISO 527 |
| Yield Stress (cond.) | 5800 | psi | ISO 527 |
| Yield Strain (dry) | 5 | % | ISO 527 |
| Yield Strain (cond.) | 13 | % | ISO 527 |
| Stress at 50% Strain (dry) | 4500 | psi | ISO 527 |
| Stress at 50% Strain (cond.) | 4350 | psi | ISO 527 |
| Stress at Break (dry) | 7250 | psi | ISO 527 |
| Stress at Break (cond.) | 8700 | psi | ISO 527 |
Table 2 of 8
4 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Density (dry) | 1.01 | g/cm³ | ISO 1183 |
| Water Absorption (dry) | 1.4 | % | Sim. to ISO 62 |
| Humidity Absorption (dry) | 0.7 | % | Sim. to ISO 62 |
| Shore D Hardness (dry) | 75(3 sec) | — | ISO 7619-1 |
Table 3 of 8
8 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Melting Temperature (dry) | 352 | °F | ISO 11357-1/-3 |
| Glass Transition Temperature (dry) | 13 | °F | ISO 11357-1/-2 |
| Temperature of Deflection Under Load A (1.80 Mpa, dry) | 122 | °F | ISO 75-1/-2 |
| Temperature of Deflection Under Load B (0.45 Mpa, dry) | 248 | °F | ISO 75-1/-2 |
| Vicat Softening Temperature A (10 N, 50 K/h, dry) | 349 | °F | ISO 306 |
| Vicat Softening Temperature B (50 N, 50 K/h, dry) | 284 | °F | ISO 306 |
| Coefficient of Linear Thermal Expansion (23°C to 55 °C, Parallel, dry) | 8.33e-05 | in/in/°F | ISO 11359-1/-2 |
| Coefficient of Linear Thermal Expansion (23°C to 55 °C, Normal, dry) | 8.33e-05 | in/in/°F | ISO 11359-1/-2 |
Table 4 of 8
11 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Volume Resistivity (pV, dry) | min. 1E13 | Ohm*m | IEC 62631-3-1 |
| Volume Resistivity (pV, cond.) | 3200000000000 | Ohm*m | IEC 62631-3-1 |
| Surface Resistivity (σC, Circular Electrodes, dry) | 8500000000000 | Ohm/sq | IEC 62631-3-2 |
| Surface Resistivity (σC, Circular Electrodes, cond.) | min. 1E15 | Ohm/sq | IEC 62631-3-2 |
| Relative Permittivity (50Hz, dry) | 3.9 | — | IEC 62631-2-1 |
| Relative Permittivity (100Hz, dry) | 3.8 | — | IEC 62631-2-1 |
| Relative Permittivity (1MHz, dry) | 3 | — | IEC 62631-2-1 |
| Dissipation Factor (1Mhz, dry) | 271 | E-4 | IEC 62631-2-1 |
| Electric Strength (AC, S20/S20, t. 1 mm, cond.) | 838 | kV/in | IEC 60243-1 |
| Electric Strength (AC, S20/P50, dry) | 686 | V/mil | Sim. to IEC 60243-1 |
| Comparative Tracking Index (Test Solution A, 50 Drops Value, dry) | 600 | — | IEC 60112 |
Table 5 of 8
4 rows| Characteristic | Value | Unit |
|---|---|---|
| Minimum Mold Temperature | 86 | °F |
| Maximum Mold Temperature | 212 | °F |
| Minimum Melt Temperature | 356 | °F |
| Maximum Melt Temperature | 428 | °F |
Table 6 of 8
4 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Injection Molding - Melt Temperature | 410 | °F | ISO 294 |
| Injection Molding - Mold Temperature | 176 | °F | ISO 294 |
| Injection Molding - Injection Velocity | 7.87 | in/s | ISO 294 |
| Injection Molding - Pressure at Hold | 10200 | psi | ISO 294 |
Table 7 of 8
5 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Melt Volume Flow Rate (dry, at 446°F, 4.76lb)) | 60 | cm³/10min | ISO 1133 |
| Molding Shrinkage (Parallel, dry) | 9 | % | ISO 294-4, 2577 |
| Molding Shrinkage (Normal, dry) | 11 | % | ISO 294-4, 2577 |
| Mold Temperature (dry) | 140 | °F | — |
| Melt Temperature (dry) | 392 | °F | — |
Table 8 of 8
6 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Burning Behavior (at 1.5 mm Nominal Thickness) (dry) | HB | class | IEC 60695-11-10 |
| Burning Behavior (at Thickness 0.1260 in.) (dry) | HB | class | IEC 60695-11-10 |
| Glow Wire Flammability Index (at Thickness 0.0394 in.) | 1760 | °F | IEC 60695-2-12 |
| Glow Wire Flammability Index (at Thickness 0.0787 in.) | 1760 | °F | IEC 60695-2-12 |
| Glow Wire Ignition Temperature (at Thickness 0.0394 in.) | 1560 | °F | IEC 60695-2-13 |
| Glow Wire Ignition Temperature (at Thickness 0.0787 in.) | 1560 | °F | IEC 60695-2-13 |
