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Toray MicroPly™ TCF4045
- Chemical Family
- Epoxy & Epoxy Derivatives
Toray Toray MicroPly™ TCF4045 is a low dielectric, low density epoxy syntactic film. The material displays both good mechanical and dielectric properties. Toray MicroPly™ TCF4045’s base resin chemistry features low moisture absorption with good high temperature properties. 177°C (350°F) Cure, Low Dielectric Epoxy Syntactic Film.
Product families
Applications
Automotive & Transportation — Transportation
- Aerospace & Aviation
Product Families
Composite Materials — Core Materials
- Foam Cores
Other characteristics
- Brand
- Toray MicroPly
- Core Type
- Thermoset Foam
- Functions
- Core Material
- Markets
- Automotive & Transportation
- Core
- Thermoset Foam
- Technology
- Composite Materials
- Material Features
- Good Mechanical Properties
- Low Water Absorption
- HIGHLIGHTS
- Good high temperature properties
- Lightweight core fill
- Good dielectric properties
- Recommended Applications
- Aerostructures
- Radome
- Radomes and antennae core fill
- Lightweight core fil
- Good dielectric properties
- Composite Materials Functions
- Core Material
- Composites Processing Methods
- Out of Autoclave Prepreg
- Vacuum Bagging
Technical data
Table 1 of 2
2 rows| Characteristic | Value | Unit |
|---|---|---|
| Dry Tg | 180 (356) | °C (°F) |
| Wet Tg | 166 (331) | °C (°F) |
Table 2 of 2
3 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Density | 0.61 (38) | g/cc (pcf) | — |
| Dielectric Constant at 10 GHz | 1.57 | — | ASTM D 2520 |
| Loss Tangent at 10 GHz | 0.0078 | — | ASTM D 2520 |
