Toray BT250E-6
- Chemical Family
- Epoxy & Epoxy Derivatives
Toray BT250E-6 resin system is a 121°C (250°F) cure epoxy prepreg with excellent strength and stiffness. It provides an outstanding surface finish under vacuum bag/oven cure. BT250E-6 has an FAA-conformed database on carbon IM-7 uni-directional tape, S2-glass, and AS-4C plain weave.
Properties
- Physical Form
- Prepreg
Product families
Applications
- Aerospace & Aviation
Product Families
- Thermoset Prepregs
Other characteristics
- Functions
- Prepreg
- Polymer Name
- Epoxy Resins & Compounds
- Processing Methods
Out of Autoclave Prepreg, Prepreg Processing, Vacuum Bagging
- Markets
- Automotive & Transportation
- Shelf LIfe
- Out Life
- Up to 30 days at ambient
- Frozen Storage Life
- 12 months at -18°C (< 0°F)
- Out life is the maximum time allowed at ambient temperature before cure. *Ambient is 18–22°C (65–72°F)
- Product Type
- 121°C–127°C (250°F–260°F) Cure Epoxy
- Technology
- Composite Materials
- Product Handling
- The following guidelines are provided to our customers to assure that best practices are used to attain the best results from Toray Advanced Composites epoxy products. Keep in mind that these procedures represent best practices for all composite prepreg and adhesive materials.
- FREEZER STORAGE
- Epoxy resin materials have good shelf life at room temperature; however, the life and performance of the material is best preserved with the following basic guidelines. Refer to the shelf life included in the product certifications. The epoxy material should be sealed in an airtight bag and kept frozen below -18°C (0°F) when not being used for longest life and most consistent performance. A good safety measure is to have a bag of desiccant (silica moisture absorber) in the core of the prepreg roll to assure the best protection from moisture ingression.
- MOISTURE ABSORPTION AND SENSITIVITY
- While very resistant to moisture absorption after cure, epoxies can be adversely affected by moisture uptake prior to cure. For this reason, all materials must be completely thawed to room temperature prior to opening the sealed bag to avoid condensation on the material. Also, it is good practice to keep prepreg and in-process hardware in a sealed bag or vacuum bag if it will be exposed to the atmosphere for long periods of time.
- HANDLING OF MATERIALS
- When handling any prepreg materials, one should always wear clean, powder-free latex gloves. This will assure that no hand oils are transferred to the prepreg and/or composite during processing. The presence of oils in the part could lead to problems in both mechanical and electrical performance of the part. This also guards against dermatitis that may occur with some users.
- NONMETALLIC HONEYCOMB AND FOAM CORE USE
- When using nonmetallic honeycomb and foam core materials for sandwich structures, the materials should always be dried in an oven prior to lay-up to drive off any moisture that may be in the core. The core should be cooled in the presence of a desiccant to avoid moisture uptake. Following drying, it is always best to use the material as soon as possible. Recommended core dry time/temp: 121°C (250°F) for 3–4 hours.
- Material Features
- Good Surface Appearance
- High Strength
- HIGHLIGHTS
Excellent system for out-of-autoclave cure and low pressure cure; Good for high-fatigue cycle Applicationss; Ideal for low-to-medium service temperature Applicationss; Comparable to other supplier 121°C (250°F) cure resin systems; FAA-conformed database on several fibers and fabrics including S2 and carbon fiber.
- Recommended Applications
- Aerostructures
- Rotorcraft and blades
- Propellers
- Composite Materials Functions
- Prepreg
- Composites Processing Methods
- Out of Autoclave Prepreg
- Prepreg Processing
- Vacuum Bagging
Technical data
Table 1 of 2
2 rows| Characteristic | Value | Unit |
|---|---|---|
| Coefficient of Thermal Expansion (CTE) | 59.6 | ppm/°C |
| Glass Transition Temperature (Tg) | 131 (268) | °C (°F) |
Table 2 of 2
3 rows| Characteristic | Value | Unit |
|---|---|---|
| Density | 1.2 | g/cc |
| Dielectric Constant at 10 GHz | 3.06 | — |
| Loss Tangent at 10 GHz | 0.011 | — |
