To catalogue
Accura® Phoenix
Product families
Applications
Electrical & Electronics — Devices & Assemblies
- Other Devices & Assemblies
Electrical & Electronics — Parts & Components
- Semiconductor Manufacturing
Product Families
Plastics — 3D Printing Polymers
- Photoactive Resins
Other characteristics
- Brand
- Accura
- End Uses
- Electrical/Electronic Applications
- Tensile Strength
- 45.0 - 61.0 MPa
- Markets
- Electrical & Electronics
- Appearance
- Clear or transparent
- Technology
- Plastics
- Material Features
- Antimony Free
- Heat Resistance
- High Clarity
- High Rigidity
- High Stiffness
- Low Viscosity
- Plastics and Elastomers End Uses
- Electrical/Electronic Applications
- Plastics and Elastomers Functions
- Resin
Technical data
Table 1 of 3
3 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Liquid Density (25°C) | 1.13 | g/cm3 | -- |
| Solid Density | 1.19 | g/cm³ | — |
| Viscosity (30°C) | 120 - 130 | cps | -- |
Table 2 of 3
9 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Strength | 45 - 61 | MPa | ASTM D638 |
| Hardness | 80 | Shore D | ASTM D2240 |
| Elongation at Break | 3 - 5.0 | % | ASTM D638 |
| Tensile Modulus | 2340 - 2640 | Mpa | ASTM D638 |
| Flexural Strength | 96 - 100 | MPa | ASTM D790 |
| Flexural Modulus | 2140 - 2330 | Mpa | ASTM D790 |
| Impact Strength | 13 - 19 | J/m | ASTM D256 |
| Penetration Depth (Dp) | 6.4 | mils | -- |
| Critical Exposure (Ec) | 11.7 | mJ/cm2 | -- |
Table 3 of 3
5 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Coefficient of Thermal Expansion (20-50°C) | 41.3 | µmm/m°C | ASTM E 831-93 |
| Coefficient of Thermal Expansion (60-90°C) | 96.6 | µmm/m°C | ASTM E 831-93 |
| Heat Deflection Temperature - HDT (0.45 MPa) | 83 | °C | ASTM D648 |
| Heat Deflection Temperature - HDT (1.82 MPa) | 64 | °C | ASTM D648 |
| Glass Transition Temperature | 63 | °C | DMA, E |
