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Yincae® SMT 256B
Yincae® SMT 256B is designed to enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA and flip-chip.
Product families
Applications
Applications
- Consumer Goods — Appliances & Electronics
Electrical & Electronics — Packaging & Assembly
- Adhesives & Sealants
Electrical & Electronics — Parts & Components
- Printed Circuit Boards (PCBs)
- Semiconductor Manufacturing
Product Families
Ready-to-Use Products — Adhesives & Sealants
- Encapsulants
Other characteristics
- Brand
- Yincae
- Cure Method
- Heat Cure
- Product Type
- Encapsulant
- Application Area
Ball Grid Array (BGA), Chip Scale Packaging (CSP), Circuit Substrates, Semiconductors; Ball Grid Array (BGA); Chip Scale Packaging (CSP); Circuit Substrates; Semiconductors
- Application Method
- Dip Coating
- Color
- Black
- Markets
- Consumer Goods
- Electrical & Electronics
- Features
- Black Color
- Easy Storage
- Cure
- Heat Cure
- Technology
- Ready-to-Use Products
- Applying Method
- Dip
- Application Methods
- Dip Coating
- Ready to Use Product Features
- High Temperature Curing
Technical data
Table 1 of 1
4 rows| Characteristic | Value | Unit |
|---|---|---|
| Reflow Peak Temperature | 230 - 260 | °C |
| Viscosity | 5 - 20 | kcp |
| Coefficient of Thermal Expansion | 65.0 | — |
| In-Line Curing Peak Temperature | 230 - 260 | °C |
