Yincae® TM 158
Yincae® TM 158 is a rapid cure, self-filling, self-leveling and self soldering adhesives, which can be used as die attach adhesives for LED, CSP, QFP etc., to replace conductive adhesives (Ag) or solder materials such as solder paste or preform. In comparison to conductive adhesives (Ag),TM products have higher electrical and thermal conductivity. In comparison to soldering materials, our solderable adhesives eliminate outgassing from soldering processes, eliminate die skewing and shifting and eliminate solder bleeding. This soldered interface is encapsulated with a 3D polymer network after curing allowing it to tolerate harsh environmental conditions.
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Adhesives & Sealants
- Printed Circuit Boards (PCBs)
- Semiconductor Manufacturing
Product Families
- Conductive Adhesives
Other characteristics
- Brand
- Yincae
- Product Type
- Conductive Adhesive
- Application Area
- Circuit Substrates, Semiconductors
- Circuit Substrates
- Semiconductors
- Markets
- Consumer Goods
- Electrical & Electronics
- Features
Solderable conductive adhesive.; Highly conductive adhesive designed to withstand application temperatures up to 400°C.
- Technology
- Ready-to-Use Products
- Applying Method
- Dispense
- Ready to Use Product Features
- Conductive
- Excellent Solderability
- Good Thermal Conductivity
Technical data
Table 1 of 2
3 rows| Characteristic | Value | Unit |
|---|---|---|
| Viscosity | 800 - 1600 | cp |
| Coefficient of Thermal Expansion | 18 - 98 | — |
| Diamond Filled Thermal Conductivity | 60.0 | W/mK |
Table 2 of 2
1 row| Characteristic | Value | Unit |
|---|---|---|
| Curing Conditions (150°C) | 15 - 30 | minutes |
