Yincae® BP 256
Yincae® BP 256 is a family of microchip assembly and ball attachment adhesive products that are used to enhance solder joint reliability and eliminate solder joint cracking in CSP, BGA, flip chips and POP microchip applications. They remove metal oxide and allow individual solder joints to be formed, encapsulated by a 3-D polymer network. The resulting solder joint bond is 5 to 10 times stronger than that of conventional underfill. These products are specially engineered for use in lead-free, Sn/Pb and Sn/Bi processes.
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Adhesives & Sealants
- Printed Circuit Boards (PCBs)
- Semiconductor Manufacturing
Product Families
- Encapsulants
Other characteristics
- Brand
- Yincae
- Cure Method
- Heat Cure
- Product Type
- Encapsulant
- Application Area
- Circuit Substrates, Semiconductors
- Circuit Substrates
- Semiconductors
- Markets
- Consumer Goods
- Electrical & Electronics
- Features
Designed to enhance solder joint reliability and eliminate cleaning processes for ball bumping procedures; Ball bumping adhesive
- Cure
- Heat Cure
- Technology
- Ready-to-Use Products
- Applying Method
- Pin-transfer
- Application
Ball attachment. Provide a perfect solution for customers looking to strengthen the solder joint assembly and eliminate underfilling in a 100% reworkable manner.
- Ready to Use Product Features
- High Temperature Curing
Technical data
Table 1 of 1
3 rows| Characteristic | Value | Unit |
|---|---|---|
| Reflow Peak Temperature | 220 - 260 | °C |
| Viscosity | 15 - 35 | kcp |
| Coefficient of Thermal Expansion | 65.0 | — |
