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NGAC TC907-07
The NGAC TC907-07 adhesive is thermally conductive and electrically insulating, and it can be cured at room temperature. It was created for the purpose of assembling heat sensitive components onto printed circuit boards. It is recommended for any application that necessitates strong adhesive bonds as well as excellent thermal transfer. NASA outgassing and weight loss requirements are met by NGAC TC907-07.
Product families
Applications
Applications
- Consumer Goods — Appliances & Electronics; Adhesives & Sealants — Other Adhesives & Sealants Applications
Electrical & Electronics — Packaging & Assembly
- Adhesives & Sealants
Electrical & Electronics — Parts & Components
- Printed Circuit Boards (PCBs)
Product Families
Ready-to-Use Products — Adhesives & Sealants
- Conductive Adhesives
Other characteristics
- Brand
- NGAC
- Cure Method
- Air Dry
- Product Type
- Conductive Adhesive
- Application Area
- Printed Electronics
- Compatible Substrates & Surfaces
- Glass, Metal, Plastics
- Color
- Blue
- Markets
- Adhesives & Sealants
- Consumer Goods
- Electrical & Electronics
- Pot Life
- 40 minutes
- Advantages
NGAC TC907-07 features the following characteristics that enable ease of use.
- Cure
- Air Dry
- Technology
- Ready-to-Use Products
- Ready to Use Product Features
- Chemical Resistant
- Electrically Insulating
- Low Shrinkage
- Thermally Conductive
- Compatible Substrates and Surfaces
- Glass
- Metal
- Plastics
Technical data
Table 1 of 1
10 rows| Characteristic | Value | Unit |
|---|---|---|
| Mixed Viscosity (CP52,10rpm) | 10000.0 | cps |
| Specific Gravity | 2.3 | — |
| Mix Ratio (Weight, R/H) | 100/9.5 | — |
| Hardness | 90.0 | Shore D |
| Operating Temperature | -70 to +125 | °C |
| Glass Transition Temperature | 60.0 | — |
| Thermal Conductivity, W/M/° | 0.96 | W/M/°K |
| CTE | 2.5e-05 | in/°C |
| Lap Shear (Alum to Alum) | 3000.0 | psi |
| NASA Outgassing | Passes | — |
