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Kopla KDG1015
- Chemical Family
- Polyamides
Kopla KDG1015 is a Polyamide 66 (PA 66) polymer which is reinforced with glass fiber.
Product families
Applications
Applications
- Electrical & Electronics — Other Electrical & Electronics Applications
Automotive & Transportation — Automotive
- Exterior & Body
- Interior
- Powertrain & UTH
Paints & Coatings — Building & Construction
- Other Building & Construction Applications
Building & Construction — Building Materials
- Other Building Materials
Product Families
Plastics — Engineering & Specialty Polymers
- Polyamides
Other characteristics
- Polymer Name
- Polyamide 66 (PA 66)
- Fillers Included
- Glass Fiber
- Flexural Modulus
- 5300.0 - 5300.0 MPa
- Markets
- Automotive & Transportation
- Building & Construction
- Electrical & Electronics
- Paints & Coatings
- Technology
- Plastics
- Characteristic
Rigidity, Mechanical strength, Heat resistance, Glycol resistance
- Material Features
- Excellent Mechanical Strength
- Good Glycol Resistance
- Good Rigidity
- Heat Resistance
- Plastics and Elastomers End Uses
- Automotive Exterior Parts
- Automotive Interior Parts
- Automotive Under The Hood
- Construction Applications
- Furniture
- Plastics and Elastomers Functions
- Resin
Technical data
Table 1 of 4
7 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Strength | 125 | MPa | D638 |
| Charpy Impact Strength | 41 | KJ/m2 | D256 |
| Flexural Modulus | 5300 | MPa | D790 |
| Flexural Strength | 180 | MPa | D790 |
| Rockwell Hardness | 120 | Scale R | D785 |
| Tensile Elongation | 4 | x10-5 1/K | D696 |
| Tensile Modulus | 6200 | MPa | D790 |
Table 2 of 4
4 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Thermal Expansion | 3.5 | x10-5 1/K | D696 |
| Flammability | HB | — | UL94 |
| Heat Deflection Temperature | 241 | °C | D648 |
| Melting Point | 260 | °C | DSC |
Table 3 of 4
4 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Volume Resistivity | 1x10^15 | Ω.cm | D257 |
| Dielectric Constant | 3.7 | — | D150 |
| Dielectric Disspation | 0.01 | — | D150 |
| Dieletric Strength | 31 | — | D149 |
Table 4 of 4
3 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Water Absorption | 1.1 | % | D570 |
| Density | 1.23 | — | D792 |
| Mold Shrinkage (3T) | 0.6-1.0 | % | D955 |
