Duratron® T4503 PAI
- Chemical Family
- Polyamides
Duratron® T4503 PAI Polyamide-imide is a compression molded material that offers exceptional electrical insulation properties and excellent dimensional stability. This grade is often selected for extreme applications where large geometries are required, such as dies or thermal insulators. It has a similar composition to Duratron® T4203 PAI and is known for its high compressive strength, elongation, and impact resistance.Features:Outstanding electrical insulation propertiesExcellent dimensional stabilityHigh compressive strength and elongationImpact resistanceBenefits:Suitable for extreme applications such as dies and thermal insulatorsCan be used for large geometriesCan be used for electrical connectors and insulatorsApplications:Electrical connectors and insulatorsStructural components such as linkages and seal ringsWear applications involving impact loading and abrasive wearHigh Temperature Electrical ConnectorsBearing CagesCan Mandrel
Properties
- Physical Form
- Plates, Rods, Tube
- Plates
- Rods
- Tube
Product families
- Equipment & Parts
- Tooling & Moldmaking
Other characteristics
- Brand
- Duratron® PBI, PEI, PAI
- Density
- 1,400.0 kg/m³
- Features
Creep Resistant, Dimensional Stability, High Strength, High Tolerance, Low Thermal Expansion, Odorless, Thermally Insulating
- Polymer Name
- Polyamide-imide (PAI)
- Tensile Modulus
- 3,450.0 MPa
- Markets
- Industrial
- Technology
- Plastics
- Labeling Claims
- Odor-free
- Product Families
- Plastics — Parts, Shapes & Films
- Engineering Notes
As Duratron® PAI has a relatively high moisture absorption rate (see Figure 24), parts used in high-temperature service or made to tight tolerances should be kept dry prior to installation. Thermal shock resulting in deformation can occur if moisture-laden parts are rapidly exposed to temperatures above 400°F (205°C).
- Material Features
- Creep Resistant
- Dimensional Stability
- High Strength
- High Tolerance
- Low Thermal Expansion
- Odorless
- Thermally Insulating
- Chemical Inventories
- TSCA (USA)
- TSCA Exempt (USA)
- Plastics and Elastomers End Uses
- Molds/Dies/Tools
- Semiconductor Manufacturing Equipment
Technical data
Table 1 of 4
3 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Specific Gravity | 1.4 | g/cc | ASTM D792 |
| Water Absorption (Immersion, 24hr) | 0.35 | % | ASTM D570(2) |
| Water Absorption (Immersion, At Saturation) | 1.7 | % | ASTM D570(2) |
Table 2 of 4
17 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Hardness | 80 | Rockwell E | ASTM D785 |
| Hardness | 119 | Rockwell M | ASTM D785 |
| Hardness | 90 | Shore D | ASTM D2240 |
| Tensile Strength | 110 | MPa | ASTM D638 |
| Tensile Strength (150°C) | 82.7 | MPa | ASTM D638 |
| Tensile Strength (65°C) | 103 | MPa | ASTM D638 |
| Elongation at Break | 3 | % | ASTM D638 |
| Tensile Modulus | 3.45 | GPa | ASTM D638 |
| Flexural Strength | 165 | MPa | ASTM D790 |
| Flexural Modulus | 4.14 | GPa | ASTM D790 |
| Compressive Strength | 124 | MPa | 10% Def.; ASTM D695 |
| Compressive Modulus | 2.41 | GPa | ASTM D695 |
Table 3 of 4
6 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Coefficient of Thermal Expansion (Linear, 40.0- 149 °C) | 27 | µm/m-°C | ASTM E831 |
| Thermal Conductivity | 0.259 | W/m-K | ASTM F433 |
| Maximum Service Temperature (Air) | 260 | ºC | Long Term |
| Deflection Temperature (1.8 MPa) | 278 | °C | ASTM D648 |
| Glass Transition Temperature | 275 | °C | ASTM D3418 |
| Flammability (Thickness 3.17 mm) | V-0 | — | UL94 |
Table 4 of 4
4 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Surface Resistivity (per Square) | max. 10¹³ | ohm | EOS/ESD S11.11 |
| Dielectric Constant (1 MHz) | 4.2 | — | ASTM D150 |
| Dielectric Strength | 23.6 | kV/mm | Short Term; ASTM D149 |
| Dissipation Factor (1 MHz) | 0.031 | — | ASTM D150 |
