Kyron® GC100
- Chemical Family
- Polyether Ether Ketone (PEEK)
Kyron® GC100 Polyetheretherketone PEEK - Superior Dimensional Stability and Micro-Machinability for Semiconductor and Electronics ApplicationsFeatures:Unfilled injection molded shapesSuperior dimensional stability and stiffnessExcellent micro-machinability capabilities due to low CTE and tensile elongationBenefits:Specifically formulated for the semiconductor and electronics industryIdeal solution for burn in and test socket applications where precision machining is requiredApplications:Burn in and test socket applications in the semiconductor and electronics industryAny application requiring precision machining and excellent dimensional stability and stiffness.
Properties
- Physical Form
- Plates
Product families
- Terminal Blocks Plugs & Sockets
Other characteristics
- Brand
- Kyron®
- Features
Good Machinability, Good Stability, High Stiffness, High Tolerance, Low Moisture Absorption
- Polymer Name
- Polyetheretherketone (PEEK)
- Tensile Modulus
- 7,579.0 MPa
- Note
(1) Data represents Mitsubishi Chemical Advanced Materials estimated maximum long-term service temperature based on practical field experience.; (2) Specimens: 1/8" thick x 2" diameter or square.; (3) Estimated rating based on available data. The UL-94 Test is a laboratory test and does not relate to actual fire hazard.
- Markets
- Electrical & Electronics
- Key Benefits
Flexural modulus of over 1,000,000 psi; Available in 10" x 10" plates of 6mm, 9mm or 12mm thick; Tensile elongation of 3.0% for precise hole placement; Extremely stable during usage, CTE of 1.85 (x10⁻⁵th)
- Technology
- Plastics
- Product Families
- Plastics — Parts, Shapes & Films
- Material Features
- Good Machinability
- Good Stability
- High Stiffness
- High Tolerance
- Low Moisture Absorption
- Plastics and Elastomers End Uses
- Sockets
- Test Socket Material Vs. Other Materials
Versus GF-PAI – Kyron® GC-100 provides the stiffness of GF PAI with improved small hole machinability & lower moisture absorption.; Versus Standard Polyimides – Kyron® GC-100 offers 2X higher stiffness, 2.5X less moisture absorption, 35% lower CTE and 2X better hole accuracy.; Versus MDS-100 – Designed to complement MDS-100, offers relatively similar properties but available in thicker cross sections.
Technical data
Table 1 of 4
11 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Specific Gravity (73˚F) | 1.52 | — | ASTM D792 |
| Tensile Strength (At Break, 73˚F) | 16000 | psi | ASTM D638 |
| Tensile Modulus of Elasticity (73˚F) | 1100000 | psi | ASTM D638 |
| Tensile Elongation (At break, 73˚F) | 3 | % | ASTM D638 |
| Shear Strength (73˚F) | 11000 | psi | ASTM D732 |
| Flexural Strength (73˚F) | 24000 | psi | ASTM D790 |
| Flexural Modulus of Elasticity (73˚F) | 1100000 | psi | ASTM D790 |
| Compressive Strength (10% Deformation, 73˚F) | 23000 | psi | ASTM D695 |
| Compressive Modulus of Elasticity (73˚F) | 600000 | psi | ASTM D695 |
| Hardness (73˚F) | M100/R123 | Rockwell | ASTM D785 |
| Notched Izod (Notched, 73˚F) | 0.7 | ft.lb./in² | ASTM D256 Type “A” |
Table 2 of 4
5 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Coefficient of Linear Thermal Expansion | 1.85 x 10⁻⁵ | in./in./°F | ASTM E-831 (TMA) |
| Heat Deflection Temperature (264 psi) | 445 | °F | ASTM D648 |
| Melting Point (Crystalline) - Peak | 644 | °F | ASTM D3418 |
| Continuous Service Tempearature in Air (1) | max. 480 | °F | — |
| Thermal Conductivity | 2.36 | BTU in./(hr. ft² ˚F) | ASTM F433 |
Table 3 of 4
2 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Surface Resistivity | min. 10¹³ | ohms/square | EOS/ESD S11.11 |
| Flammability (1.5mm) (2) (3) | V-0 | — | UL-94 |
Table 4 of 4
1 row| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Water Absorption Immersion (Saturation) (2) | 0.44 | % by wt. | ASTM D570 |
