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Semitron® MDS 100

Semitron® MDS 100 modified Polyetheretherketone PEEK shapes offer a remarkable combination of strength, stiffness, and stability. This grade in particular was developed for use in uncontrolled application environments where a high level of precision is required. Due to this, Semitron® MDS 100 components are often used as test sockets, nests, and fixtures in test and package equipment throughout the semiconductor and electronics industry.Features:Remarkable combination of strength, stiffness, and stabilityDeveloped for use in uncontrolled application environments where a high level of precision is requiredMoisture absorption of 0.10% at 24 hrs. (per ASTM D570)Thermal performance to 210 °C (410 °F)Flexural modulus > 1,400,000 psiBenefits:Ideal for test sockets, nests and fixtures in test and package equipmentSuitable for use in semiconductor and electronics industryCan withstand harsh, uncontrolled environmentsLow moisture absorption ensures dimensional stabilityHigh thermal performance and flexural modulus ensures durability and precisionApplications:Test sockets, nests and fixtures in test and package equipmentOther applications in the semiconductor and electronics industry that require a high level of precision and stability in uncontrolled environments.

Properties

Physical Form
  • Plates, Rods
  • Plates
  • Rods

Product families

Electrical & Electronics — Parts & Components
  • Semiconductor Manufacturing
  • Terminal Blocks Plugs & Sockets

Other characteristics

Brand
Semitron®
Density
1,510.0 kg/m³
Features

Dimensional Stability, Good Machinability, Good Stability, High Performance, High Rigidity, High Stiffness, High Strength, High Tolerance, Low Moisture Absorption, Moisture Resistant, Odorless

Polymer Name
Polyetheretherketone (PEEK)
Tensile Modulus
11,000.0 MPa
Color (Properties)
Grey
Markets
Electrical & Electronics
Flame Rating
UL 94 V0
Technology
Plastics
Labeling Claims
Odor-free
Benefits
  • Very low moisture absorption
  • Easily machined to precise dimensions
  • Very strong and stiff
  • Low CLTE means parts stay in spec
  • Available in thin cross-sections
Product Families
Plastics — Parts, Shapes & Films
Color
Grey
Material Features
  • Dimensional Stability
  • Good Machinability
  • Good Stability
  • High Performance
  • High Rigidity
  • High Stiffness
  • High Strength
  • High Tolerance
Chemical Inventories
  • TSCA (USA)
  • TSCA Exempt (USA)
Applications

Test sockets for the semiconductor manufacturing industry; Fixtures for electronics testing; Mounting points for precision diagnostic equipment; Positioning platforms for miniature motion control devices

Competitive Advantage

Quadrant Semitron® MDS 100 was developed specifically to provide a highly rigid, stable, moisture-resistant platform for precision structural applications. Its unique, proprietary polymer matrix makes it ideal for use in parts where fine machining and precise tolerances are critical. With flexural modulus performance greater than 1,000,000 psi, Quadrant Semitron® MDS 100 sets a new performance level for machinable polymers. Quadrant's new technology allows the production of shapes that reduce the amount of machining required for thinner parts.

Certifications and Compliance
UL 94
Plastics and Elastomers End Uses
  • Electrical/Electronic Applications
  • Semiconductor Applications
  • Sockets

Technical data

Table 1 of 4

8 rows
CharacteristicValueUnitMethod
Tensile Strength118MPaISO 527-1/-2 (7)
Tensile Strain (Elongation) at Break2%ISO 527-1/-2 (7)
Tensile Modulus of Elasticity11000MPaISO 527-1/-2 (9)
Shear Strength83MPaASTM D732
Compressive Stress (1 / 2 / 5 % Nominal Strain)73/ 125MPaISO 604 (10)
Charpy Impact Strength (Unnotched)21kJ/m²ISO 179-1/1eU
Charpy Impact Strength (Notched)2kJ/m²ISO 179-1/1eA
Hardness (14)106Rockwell MISO 2039-2

Table 2 of 4

6 rows
CharacteristicValueUnitMethod
Melting Temperature (DSC, 10°C (50°F) / min)340°CISO 11357-1/-3
Thermal Conductivity (23°C)0.25W/(K.m)—
Coefficient of Linear Thermal Expansion (23 - 60°C)20µm/(m.K)—
Coefficient of Linear Thermal Expansion (23 - 100°C)20µm/(m.K)—
Coefficient of Linear Thermal Expansion (min. 150°C)21µm/(m.K)—
Flammability (3 mm) (5)V-0—UL 94

Table 3 of 4

1 row
CharacteristicValueUnitMethod
Surface Resistivity10000000000000Ohm/sq.ANSI/ESD STM 11.11

Table 4 of 4

1 row
CharacteristicValueUnitMethod
Density1.51g/cm³ISO 1183-1

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