Semitron® MP-370
- Chemical Family
- Polyether Ether Ketone (PEEK)
Semitron® MP 370 shapes exhibit excellent moisture absorption and thermal resistance, while also maintaining outstanding strength and dimensional stability. As a result, this grade is often selected for test socket applications where precision machining is critical, and complex geometries are prevalent.Features:Excellent moisture absorptionHigh thermal resistanceOutstanding strength and dimensional stabilityExcellent machinabilityBenefits:Allows for precision machining and complex geometries in test socket applicationsProvides greater strength and dimensional stability compared to unfilled PEEK materialsLow internal stresses and no "soft center" issues associated with injection molded blanksApplications:Test sockets for the semiconductor manufacturing industryPrecision machining and complex geometries in various industries where high thermal resistance and moisture absorption are required.
Properties
- Physical Form
- Plates
Product families
- Semiconductor Manufacturing
- Terminal Blocks Plugs & Sockets
Other characteristics
- Brand
- Semitron®
- Density
- 1,650.0 kg/m³
- Features
Dimensional Stability, Excellent Toughness, Good Machinability, Good Stability, Good Thermal Stability, High Performance, High Strength, High Tolerance, Low Moisture Absorption, Odorless
- Polymer Name
- Polyetheretherketone (PEEK)
- Tensile Modulus
- 4,450.0 MPa
- Color (Properties)
- Grey
- Markets
- Electrical & Electronics
- Flame Rating
- UL 94 V0
- Key Benefits
Very low moisture absorption; Finer, cleaner detail possible - excellent machinability; Very high level of precision possible - low internal stresses; Good value - an ideal choice for specific application environments
- Technology
- Plastics
- Labeling Claims
- Odor-free
- Product Families
- Plastics — Parts, Shapes & Films
- Color
- Grey
- Material Features
- Dimensional Stability
- Excellent Toughness
- Good Machinability
- Good Stability
- Good Thermal Stability
- High Performance
- High Strength
- High Tolerance
- Chemical Inventories
- TSCA (USA)
- TSCA Exempt (USA)
- Applications
IC test sockets for semiconductor manufacturing equipment; Structural parts in electronics and telecom equipment; Insulating blocks and fixtures in diagnostic equipment
- Competitive Advantage
Base Resin- Semitron® MP370 uses modified PEEK as a base resin offering higher heat for improved ability to machine clean fine features and improved toughness to resist breakage in use when compared to ceramic filled PEEK materials.. Processing- Semitron® MP370 uses extrusion to manufacture ultra low stress consistent plate as compared to typical injection molded ceramic filled materials. Extruded material provides far better dimensional stability during machining allowing for finer features while maintaining tighter tolerances.
- Certifications and Compliance
- UL 94
- Plastics and Elastomers End Uses
- Semiconductor Applications
- Sockets
Technical data
Table 1 of 4
8 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Tensile Strength | 78 | MPa | ISO 527-1/-2 (7) |
| Tensile Strain (Elongation) at Break | 2 | % | ISO 527-1/-2 (7) |
| Tensile Modulus of Elasticity | 4450 | MPa | ISO 527-1/-2 (9) |
| Shear Strength | 78 | MPa | ASTM D732 |
| Compressive Stress (1 / 2 / 5 % Nominal Strain) | 38/72 | MPa | ISO 604 (10) |
| Charpy Impact Strength (Unnotched) | 50 | kJ/m² | ISO 179-1/1eU |
| Charpy Impact Strength (Notched) | 4 | kJ/m² | ISO 179-1/1eA |
| Hardness (14) | 97 | Rockwell M | ISO 2039-2 |
Table 2 of 4
7 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Melting Temperature (DSC, 10°C (50°F) / min) | 340 | °C | ISO 11357-1/-3 |
| Thermal Conductivity (23°C) | 0.34 | W/(K.m) | — |
| Coefficient of Linear Thermal Expansion (23 - 60°C) | 49 | µm/(m.K) | — |
| Coefficient of Linear Thermal Expansion (23 - 100°C) | 51 | µm/(m.K) | — |
| Coefficient of Linear Thermal Expansion (min. 150°C) | 109 | µm/(m.K) | — |
| Heat Deflection Temperature (Method A: 1.8 MPa (264 PSI)) | 148 | °C | ISO 75-1/-2 |
| Flammability (3 mm) (5) | V-0 | — | UL 94 |
Table 3 of 4
1 row| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Surface Resistivity | 10000000000000 | Ohm/sq. | ANSI/ESD STM 11.11 |
Table 4 of 4
2 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Density | 1.65 | g/cm³ | ISO 1183-1 |
| Water Absorption (At Saturation in Water of 23 °C) | 0.5 | % | — |
