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SolverPI Powder 1600

Chemical Family
Polyimides (PI)

SolverPI Powder 1600 has high molecular weight, poor mobility, used for molding. Thermoplastic Pl is an amorphous resin, the products made from thermoplastic Pl is amber and transparent.

Properties

Physical Form
  • Powder
  • Solid

Product families

Applications

Applications
  • Consumer Goods — Appliances & Electronics
Industrial — Chemical & Industrial Manufacturing
  • Tooling & Moldmaking

Product Families

Composite Materials — Polymers & Resins
  • Thermoplastic Resins

Other characteristics

Brand
SolverPI
Markets
  • Consumer Goods
  • Industrial
Appearance
Light Yellow
Application

Press all kinds of machinery, electronic components, such as floating seal ring, sealing ring, bush pressed sheet, rod, diamond grinding tools etc.. The demand of high-grade diamond abrasive for thermoplastic Pl is big because the traditional adhesives can not meet their requirements.

Technology
Composite Materials
Characteristic

Creep resistance, radiation resistance, good wave penetrating ability.; Good corrosion resistance, moisture absorption is higher than ordinary plasticslightly.; Not resistant to strong acid, alkali and high-temperature steam (The only Shortcomings); In a word, SOLVER Thermoplastic Polyimide Molding Powder (SolverPI-Powder 1600) can completely replace Mitsui AURUM

Material Features
  • Corrosion Resistant
  • Excellent Creep
  • Translucent
Composite Materials Functions
Resins Binders & Matrix Materials

Technical data

Table 1 of 4

4 rows
CharacteristicValueUnitMethod
The impact strength244KJ/m2GB/ 1043.1/1eU-2008
The bending strength135MPaGB/T 9341-2008
The compression strength136MPaGB/T 1041-2008
The coefficient of friction0.43—GB/T 3960-1983(1989)

Table 2 of 4

8 rows
CharacteristicValueUnitMethod
Linear expansion of coefficient (23-30°C)3.68*10-51/°CGB/T 1036-1989
Intrinsic viscosity0.5-0.8dl/gQ/HSMT
Oxygen index46%GB/T 2406.2-2009
The vertical combustionV-0levelGB/T 2408-2008
The tensile strength108MPaGB/T 1040.2/1A-2006
Elongation at break15%GB/T 1040.2-2006
Density (25°C)1.38g/cm—
Rockwell hardness110m—

Table 3 of 4

2 rows
CharacteristicValueUnitMethod
The thermal deformation temperature (1.80MPa)250°CGB/T 1634.2-2004
Glass transition temperature (nitrogen atmosphere)260°CGB/T 19466.2-2009

Table 4 of 4

2 rows
CharacteristicValueUnitMethod
Dielectric strength16.3MV/mGB/T 1408. 1-2006
Volume resistivity2.0 x 10^14Ω.m—

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