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SolverPI Powder 1600X

Chemical Family
Polyimides (PI)

SolverPI Powder 1600X has high molecular weight, poor mobility, used for molding. Thermoplastic Pl is an amorphous resin, the products made from thermoplastic Pl is amber and transparent.

Properties

Physical Form
  • Powder
  • Solid

Product families

Applications

Applications
  • Consumer Goods — Appliances & Electronics
Industrial — Chemical & Industrial Manufacturing
  • Tooling & Moldmaking

Product Families

Composite Materials — Polymers & Resins
  • Thermoplastic Resins

Other characteristics

Brand
SolverPI
Markets
  • Consumer Goods
  • Industrial
Features

Creep resistance, radiation resistance, good wave penetrating ability;; Good corrosion resistance, moisture absorption is higher than ordinary plasticslightly;; Not resistant to strong acid, alkali and high temperature steam (The only Shortcomings);

Appearance
Light Yellow
Application

Advantages when compared with other special engineering plastics: 1. Compared with PEEK PPS, thermoplastic Pl is a non crystalline, showing better stability of mechanical properties and size at high temperature condition. While the crystalline plastic will continue to crystallization or crystallization damage when using the temperature between Tg and Tm, causing the mechanical changes and decreasing dimensional stability, creep resistance reducing 2. Compared with PTFE, better dimensional stability, better creep resistance and high strength, the shortage is worse corrosion resistance. 3. Stabler performance in the high or low temperature performance. The processing temperature can be 340-380 °C, lower than Aurum. It no need heat treatment after the molding process. 4. Thermal properties: Tg:260 °C, HDT:250 °C, long-term use temperature is 240 °C. At the same time, also has very good performance of low temperature resistant, will not brittle fracture at the temperature of -269 °C in liquid nitrogen.; Compared with BMI; The performance of BMI is more brittle, it will break off during the use of the process. SolverPI-Powder 1600X is showing as melting state during thermoplastic molding, the adhesion and toughness is better than not easier to be cracked Usage life is longer. BMI can be used for 4 hours, while SolverPi-Powder 1600x can be used continuously for 72 hours. Using temperature can be higher. SolverPi-Powder 1600x can keep stable within 240 °C In the high-end abrasive in German are using polyimide as a binder.; Application: Press all kinds of machinery, electronic components, such as floating seal ring, sealing ring, bush pressed sheet, rod, diamond grinding tools etc. The demand of high-grade diamond abrasive for thermoplastic Pl is big because the traditional adhesives can not meet their requiremen

Technology
Composite Materials
Material Features
  • Corrosion Resistant
  • Excellent Creep
  • Good Mechanical Properties
  • Good Thermal Stability
  • Translucent
Composite Materials Functions
Resins Binders & Matrix Materials

Technical data

Table 1 of 4

4 rows
CharacteristicValueUnitMethod
The impact strength244KJ/m2GB/ 1043.1/1eU-2008
The bending strength135MPaGB/T 9341-2008
The compression strength136MPaGB/T 1041-2008
The coefficient of friction0.43—GB/T 3960-1983(1989)

Table 2 of 4

8 rows
CharacteristicValueUnitMethod
Linear expansion of coefficient (23-30°C)3.68*10-51/°CGB/T 1036-1989
Intrinsic viscosity0.5-0.8dl/gQ/HSMT
Oxygen index46%GB/T 2406.2-2009
The vertical combustionV-0levelGB/T 2408-2008
The tensile strength108MPaGB/T 1040.2/1A-2006
Elongation at break15%GB/T 1040.2-2006
Density (25°C)1.38g/cm—
Rockwell hardness110m—

Table 3 of 4

2 rows
CharacteristicValueUnitMethod
The thermal deformation temperature (1.80MPa)250°CGB/T 1634.2-2004
Glass transition temperature (nitrogen atmosphere)260°CGB/T 19466.2-2009

Table 4 of 4

2 rows
CharacteristicValueUnitMethod
Dielectric strength16.3MV/mGB/T 1408. 1-2006
Volume resistivity2.0 x 10^14Ω.m—

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