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Technicure® Nano Dicy
- CASE Ingredients Features
- Excellent AdhesionFast CureHigh Glass Transition TemperatureImproves FlowLong Shelf LifeLow Temperature PerformanceMulti-Substrate AdhesionPrevents Clumping
- Chemical Name
- Dicyandiamide, Pyrogenic Silica
- Chemical Family
- Guanidines, SilicaGuanidinesSilica
Technicure® Nano Dicy is a pulverized grade of dicyandiamide. It contains fumed silica to prevent clumping and enhance flow. Its extremely fine particle size enables a more complete reaction, facilitating faster curing without compromising formulation shelf stability.
Properties
- Physical Form
- Powder
Identification
- CASE Ingredients Functions
- Curing Agent
Product families
Applications
Automotive & Transportation — Bonding & Assembly
- Transportation Assembly
Electrical & Electronics — Devices & Assemblies
- Automotive Electronics
Automotive & Transportation — Transportation
- Aerospace & Aviation
Product Families
CASE Ingredients — Additives
- Functional Additives
Composite Materials — Additives
- Functional Additives
Other characteristics
- Brand
- Technicure
- End Uses
1K (1 Component) Adhesive, Powder Coating, Pre-pregs
- Features
Excellent Adhesion, Fast Cure, Fast Curing, Good Adhesion, High Glass Transition Temperature, Improves Flow, Long Shelf Life, Low Temperature Performance, Multi-Substrate Adhesion, Prevents Clumping
- Labeling Claims
- Not Listed In California Proposition 65
- Compatible Polymers & Resins
- Epoxies (EP)
- Markets
- Automotive & Transportation
- Electrical & Electronics
- Use Levels
- 3 - 8 phr (Epoxy resin (EEW=190))
- Appearance
- White micronized powder
- Technology
- CASE Ingredients
- Composite Materials
- Benefits
- Long formulation shelf stability
- High glass transition temperature
- Excellent adhesion to a variety of substrates
- Can be used with an accelerator
- Composites End Use
- Pre-pregs
- Material Features
- Fast Curing
- Good Adhesion
- High Glass Transition Temperature
- Long Shelf Life
- Low Temperature Performance
- Chemical Inventories
- AICS (Australia)
- DSL (Canada)
- ECL (Korea)
- EINECS (EU)
- ENCS (Japan)
- PICCS (Phillipines)
- SEPA (China)
- TSCA (USA)
- Applications
One-component adhesives for auto, aerospace and electronics applications; Composites such as pre-pregs; Powder coatings; Technicure® Nano-Dicy can be used with accelerators to lower temperature of initiation.
- Coating End Applications
- Powder Coating
- Compatible Polymers and Resins
- Epoxies (EP)
- Composite Materials Functions
- Curing Agent
- Adhesives And Sealants
- 1K (1 Component) Adhesive
Technical data
Table 1 of 1
5 rows| Characteristic | Value | Unit |
|---|---|---|
| Average Particle Size | 1 - 2 | micron |
| Average Particle Size (90%) | max. 5 | micron |
| Melting Point | 207 - 211 | °C |
| Assay Content | 99.0 | % |
| Moisture Content | max. 0.5 | % |
