To catalogue
Oxy-Bond™ 157-F Thermally Conductive Epoxy Adhesive
- Chemical Family
- Epoxy & Epoxy Derivatives
Oxy-Bond™ 157-F Thermally Conductive Epoxy Adhesive is used for room temperature curing, rigid, thermally conductive epoxy.
Product families
Ready-to-Use Products — Adhesives & Sealants
- Conductive Adhesives
Other characteristics
- Brand
- Oxy-Bond
- Cure Method
- Air Dry
- Product Type
2K (2 component) Adhesive, Conductive Adhesive, Epoxy Adhesive; 2K (2 component) Adhesive; Conductive Adhesive; Epoxy Adhesive
- Compatible Substrates & Surfaces
- Plastics, Polyvinyl Chloride (PVC)
- Markets
- Adhesives & Sealants
- Highlights
Engineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to match a variety of specific application parameters, including MIL-APPROVED. Custom designed bonding products and expert technical assistance are always available.
- Cure
- Air Dry
- Applications
Adhesives & Sealants — Other Adhesives & Sealants Applications
- Technology
- Ready-to-Use Products
- Ready to Use Product Features
- Conductive
- Good Electrical Properties
- High Durability
- Compatible Substrates and Surfaces
- Plastics
- Polyvinyl Chloride (PVC)
Technical data
Table 1 of 3
1 row| Characteristic | Value | Unit |
|---|---|---|
| Viscosity | 30000.0 | cP |
Table 2 of 3
2 rows| Characteristic | Value | Unit |
|---|---|---|
| Maximum Service (Temperature, Air) | 150.0 | °C |
| Maximum Service (Temperature, Air) | -40.0 | °C |
Table 3 of 3
3 rows| Characteristic | Value | Unit |
|---|---|---|
| Cure Time (Temperature 23.0 °C) | 2880.0 | min |
| Cure Time (Temperature 65.0 °C) | 60.0 | min |
| Pot Life | 120.0 | min |
