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Leecast 15-95-3

LEECAST 15-95-3 is a two-part epoxy casting compound designed for encapsulation of high voltage components. Used in UL-listed applications requiring excellent electrical performance, heat dissipation,and flame retardance, it provides a system that is non-burning and highly resistant to thermal cycling with minimal effect on components.

Product families

Plastics — Thermoset Resins
  • Epoxies

Other characteristics

Brand
Leecast
Polymer Name
Epoxy Resins & Compounds
Volume Resistivity
2000000000000.0 - 2000000000000.0 Ohm-m
Safety

Some individuals may be sensitive to epoxy compounds. Care should be taken to minimize contact. If skin contactoccurs wash with soap and water. If eye contact occurs, flush with copious quantities of water. Keep containers closed when not in use to prevent contamination. Minimizeexposure to Part B to air and moisture.

Appearance
Blue liquid, Tan liquid
Shelf LIfe
12 months
Cure
  • Chemical Cure
  • Heat Cure
Technology
Plastics
Handling and Mixing

LEECAST 15-95-3 can be mixed, deaired and cast at normal ambient temperatures of 70 – 85oF. For lower viscosity, Part A can be warmed to around 100oF before mixing. Preheating of the component to no more than 120oF will also aid in the filling of smaller components. Measure out the proportionate quantities of Parts A and B and mix thoroughly, scraping the sides and bottom of the container. De-air using vacuum and pour the blended epoxy in the mold. Gel at room temperature for 4 – 6 hours, then post-cure for 1 hour at about 80oC.

Plastics and Elastomers Functions
Resin

Technical data

Table 1 of 3

14 rows
CharacteristicValueUnit
Hardness91Shore D
Viscosity (25ºC) (Part A)50000cps
Density (PART A)13lbs./gal
Viscosity (25ºC) (Part B)25cps
Density (PART B)7.7lbs./gal
Tensile Strength9800psi
Compressive Strength22000psi
Flexural Strength14500psi
Shrinkage0.25%
Heat Deflection Temperature95ºC
Coefficient of Expansion (25 -100ºC) (in/in/ºC x 10-6)30—
Specific Gravity1.6g/ml

Table 2 of 3

15 rows
CharacteristicValueUnit
Volume Resistivity (25°C)min. 2.0 x 10^14ohm-cm
Volume Resistivity (80°C)4.4 x 10^13ohm-cm
Volume Resistivity (100°C)1.1 x 10^12ohm-cm
Volume Resistivity (125°C)8.7 x 10^10ohm-cm
Volume Resistivity (150°C)1.3 x 10^10ohm-cm
Dissipation Factor (15K Hz) (80°C)0.016—
Dissipation Factor (15K Hz) (80°C)5.72—
Dissipation Factor (15K Hz) (100°C)0.016—
Dissipation Factor (15K Hz) (100°C)5.85—
Dissipation Factor (15K Hz) (125°C)0.021—
Dissipation Factor (15K Hz) (125°C)6.11—
Dissipation Factor (15K Hz) (150°C)0.019—

Table 3 of 3

6 rows
CharacteristicValueUnit
Mix Ratio, by weight (PART A)100—
Work Life (25ºC) (PART A)60min
Cure Schedule (PART A)Gel at room temperature for 4 - 6 hours, then postcure1 hour at 80oC—
Mix Ratio, by weight (PART B)100—
Work Life (25ºC) (PART B)8min
Cure Schedule (PART B)Gel at room temperature for 4 - 6 hours, then postcure1 hour at 80oC—

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