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Odyssey 6860
- Chemical Family
- Epoxy & Epoxy Derivatives
Fielco Adhesives Odyssey 6860 is a rapid setting, ambient curing epoxy potting compound for encapsulation of small circuit assemblies.
Product families
Applications
Applications
- Consumer Goods — Appliances & Electronics
Electrical & Electronics — Packaging & Assembly
- Adhesives & Sealants
Electrical & Electronics — Parts & Components
- Printed Circuit Boards (PCBs)
- Semiconductor Manufacturing
Product Families
Ready-to-Use Products — Adhesives & Sealants
- Encapsulants
Other characteristics
- Brand
- Fielco Adhesives Odyssey
- Cure Method
- Air Dry
- Product Type
- Potting Compound
- Markets
- Consumer Goods
- Electrical & Electronics
- Cure
- Air Dry
- Technology
- Ready-to-Use Products
- Ready to Use Product Features
- Fast Setting
