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Silquest™ A-186

Silquest™ A-186 silane adhesion promoter, can result in better electrical and/or mechanical properties in a variety of applications and industries. From enhancing electronic encapsulants to enabling improved sealant formulations, Silquest™ A-186 silane provides both epoxy and silane functionalities that promote adhesion in a range of formulations, including SPUR+ prepolymer, urethane, epoxy, silicone, and acrylic caulks, coatings, sealants and adhesives.

Properties

Physical Form
  • Beads
  • Liquid
  • Solid

Identification

CASE Ingredients Functions
Adhesion PromoterCoupling Agent

Product families

Applications

Automotive & Transportation — Bonding & Assembly
  • Transportation Assembly
Adhesives & Sealants — Industrial & Assembly Adhesives
  • Transportation Assembly

Product Families

CASE Ingredients — Additives
  • Functional Additives

Other characteristics

Brand
Silquest
End Uses

Waterborne Adhesive, Waterborne Coating, Waterborne Sealant

Features
Excellent Adhesion, Improved Flexibility
Functions
Adhesion Promoter, Coupling Agent
Compatible Polymers & Resins

Acrylics, Epoxies (EP), Polysulfide Rubber, Polyurethanes (PU), Silicones

Markets
  • Adhesives & Sealants
  • Automotive & Transportation
Appearance
Clear, pale
Coating Type
Waterborne Coating
Technology
CASE Ingredients
HIGHLIGHTS

Epoxy Functionality : Epoxy ring is reactive with many organic functionalities. Epoxy functionality will offer non-yellowing adhesion in many resin systems. May improve flexibility of systems vs. other adhesion promoters.; Epoxy ring is reactive with many organic functionalities.; Epoxy functionality will offer non-yellowing adhesion in many resin systems.; May improve flexibility of systems vs. other adhesion promoters.; Trimethoxy Silane Functionality : Bonds to inorganic substrates to provide excellent wet and dry adhesion. Very fast hydrolysis rate.; Bonds to inorganic substrates to provide excellent wet and dry adhesion.; Very fast hydrolysis rate.; Enhanced electrical properties of epoxy based electronic encapsulant and packaging materials, resulting from improved bonding between resin and substrate or filler.; An excellent candidate for waterborne applications such as acrylic and vinyl-acrylic caulks.; Improved adhesion to glass, and metal substrates can be obtained in epoxy, polysulfide, urethane and acrylic bases adhesives, sealants and caulks.; SPUR+ perpolymer applications benefit from adhesion without decrease in elongation and yellowing.; Urethane applications benefit from enhanced adhesion to glass and metal substrates, while providing improved shelf stability over amino silane alternatives. Typical use level ranges from 0.5 to 1.5 pbw.

Adhesive & Sealant Type
  • Waterborne Adhesive
  • Waterborne Sealant
Compatible Polymers and Resins
  • Acrylics
  • Epoxies (EP)
  • Polysulfide Rubber
  • Polyurethanes (PU)
  • Silicones

Technical data

Table 1 of 1

4 rows
CharacteristicValueUnit
Flash Point113°C
Viscosity (25°C)5cSt
Flash Point235°F
Flash Point113 (235)°C (°F)

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