Technicure® D-10
- CASE Ingredients Functions
- Curing Agent
- Chemical Family
- Amides
Technicure® D-10 is a pulverized grade of dicyandiamide with an average particle size of about 10 micron. The products contains fumed silica to prevent clumping and improve flow. Typically the product is used with epoxy resin between 3-8 phr. Technicure® D-10 reacts with epoxy resin at temperatures higher than 170°C unless an accelerator is used. Suggested accelerators include Technicure® LC-80, Technicure® LC-100 and substituted urea such as Technicure® MDU-11M, Technicure® PDU-250M and Technicure® TDU-200M. The type and loading level of an accelerator will provide excellent balance of low temperature reactivity and formulation shelf stability. Technicure® D-10 is available without fumed silica or with a different flow control agent.
Properties
- Physical Form
- Powder
- Solid
Product families
Applications
- Consumer Goods — Appliances & Electronics; Automotive & Transportation — Other Automotive & Transportation Applications; Paints & Coatings — Other Paints & Coatings Applications; Consumer Goods — Sports & Recreation
- Aerospace Coatings
- Automotive OEM Coatings
- Off Road & Commercial Vehicle Coatings
- Rail & Mass Transit Coatings
- Other Industrial Applications
- Aerospace Coatings
- Automotive OEM Coatings
- Off Road & Commercial Vehicle Coatings
- Rail & Mass Transit Coatings
- Agricultural & Construction Equipment
- Appliances & Consumer Goods
- Industrial Coatings
- Metal Coatings
- Aerospace & Aviation
- Commercial
- Rail & Mass Transit
Product Families
- Functional Additives
Other characteristics
- Brand
- Technicure
- End Uses
- 1K (1 Component) Adhesive, Powder Coating
- Functions
- Curing Agent
- Compatible Polymers & Resins
- Epoxies (EP)
- Markets
- Automotive & Transportation
- Consumer Goods
- Industrial
- Paints & Coatings
- Advantages
- Long formulation shelf stability
- High glass transition temperature
- Excellent adhesion to a variety of substrates
- Can be used with an accelerator
- Appearance
- White micronized powder
- Coating Type
- Powder Coating
- Technology
- CASE Ingredients
- Adhesive & Sealant Type
- 1K (1 Component) Adhesive
- Compatible Polymers and Resins
- Epoxies (EP)
Technical data
Table 1 of 1
4 rows| Characteristic | Value | Unit |
|---|---|---|
| Moisture Content | Max. 0.5 | % |
| Assay | 99 | % |
| Average Particle Size | 10 | micron |
| Melting Point | 207- -211 | °C |
